Renesas Electronics America Inc IDT71P72804S167BQGI

Mfr. Part

IDT71P72804S167BQGI

Manufacturer

Renesas Electronics Corporation. Y-IC is a quality authorized distributor for Renesas. We deliver genuine parts, fast service, and reliable support so you get the best products and the best experience.

Detailed Description

18Mbit synchronous QDR-II SRAM, organization 1M x 18, parallel interface, 167 MHz operation, 1.7–1.9 V supply, low-latency 8.4 ns access, industrial temperature range, surface-mount 165-ball CABGA package. Base product family: IDT71P72. In-stock quantity: 2647 pcs.

Key Features

QDR-II SRAM architecture for high bandwidth

Separate read and write data ports to eliminate bus contention

18Mbit density, organized as 1M x 18

Parallel interface for FPGA/ASIC memory expansion

167 MHz clock speed

8.4 ns access time for quick transactions

1.7–1.9 V supply (nominal 1.8 V)

Industrial temperature range: -40°C to +85°C (TA)

Surface-mount BGA with 165-ball array

Tray packaging for secure handling

Key Advantages

High throughput with deterministic, low latency

Read/write on independent ports improves system efficiency

Simple integration with mainstream FPGAs and network ASICs

Reliable operation across industrial temperature range

Compact BGA footprint saves PCB space

Proven IDT/Renesas QDR-II ecosystem and tooling support

Packaging

Type: 165-CABGA (Chip Array Ball Grid Array), also referenced by family as 165-TBGA on some variants

Body size: 13 x 15 mm nominal

Ball count: 165-ball array for dense, efficient signal breakout

Material: Molded BGA body with lead-free, RoHS-compliant solder balls (see datasheet for exact alloy)

Mounting: Surface mount, compatible with standard Pb-free reflow profiles

Pin/Ball configuration: Address bus, separate read/write data buses, control and clock pins arranged per the family pinout (see datasheet for ball map)

Thermal characteristics: Designed for efficient heat spreading via BGA; operating temperature -40°C to +85°C (TA). Use good PCB copper planes for thermal management.

Electrical properties: 1.7–1.9 V supply, synchronous operation at 167 MHz, 8.4 ns access time, parallel I/O signaling per QDR-II standard

Moisture sensitivity: Follow MSL handling per datasheet and J-STD-033

Supplier device package: 165-CABGA (13x15)

Shipping package: Tray

Lifecycle

Current status: Actively supported in many designs. Availability can vary by speed grade and package as the market transitions to newer memory families.

Nearing discontinuation: Not confirmed for this exact speed grade and package. Status may change; check with us for the latest.

Equivalent or alternative models:

- Renesas IDT71P72804S133BQGI (133 MHz, same organization)

- Renesas IDT71P72804S200BQGI (200 MHz, same organization)

- Renesas family variants with different packages/speeds under IDT71P72 series

- Infineon (Cypress) CY7C1311KV18 series (18Mb, 1M x 18, QDR-II, multiple speed grades and 165-ball FBGA)

- GSI Technology 18Mb QDR-II 1M x 18 series (comparable functionality and packages)

- Always verify pin compatibility, timing, and power specs from each vendor’s datasheet before substitution

If you need a drop-in or a vetted alternative and don’t see it above, contact our Y-IC sales team via our website for a fast compatibility check and sourcing options

Key Application Areas

Core and edge network switches and routers (packet buffering, queues)

Telecom baseband and line cards (fast lookup tables, FIFOs)

FPGA/ASIC designs needing high-bandwidth external SRAM

Data plane processing, network security appliances, DPI

High-speed caching for DSP and video/image processing

Test and measurement instruments requiring deterministic memory access

Datasheet

Y-IC hosts the most authoritative, up-to-date datasheet for IDT71P72804S167BQGI on our product page. We strongly recommend downloading it now for full pin maps, timing diagrams, electrical specs, and layout guidance.

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