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| Part Number: | SPC5602DF1VLL4R |
|---|---|
| Manufacturer/Brand: | NXP USA Inc. |
| Part of Description: | IC MCU 32BIT 256KB FLASH 100LQFP |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $35.105 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply (Vcc/Vdd) | 3V ~ 5.5V |
| Supplier Device Package | 100-LQFP (14x14) |
| Speed | 48MHz |
| Series | MPC56xx Qorivva |
| RAM Size | 16K x 8 |
| Program Memory Type | FLASH |
| Program Memory Size | 256KB (256K x 8) |
| Peripherals | DMA, POR, PWM, WDT |
| Package / Case | 100-LQFP |
| Package | Tape & Reel (TR) |
| Product Attribute | Attribute Value |
|---|---|
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Number of I/O | 79 |
| Mounting Type | Surface Mount |
| EEPROM Size | 4K x 16 |
| Data Converters | A/D 33x12b |
| Core Size | 32-Bit Single-Core |
| Core Processor | e200z0h |
| Connectivity | CANbus, LINbus, SCI, SPI |
| Base Product Number | SPC5602 |




The NXP SPC5602DF1VLL4R is a high-performance, single-core, 32-bit microcontroller built on the robust e200z0h core architecture and tailored for cost–sensitive automotive and industrial control applications. As part of NXP’s MPC56xx Qorivva series, this MCU operates at up to 48 MHz and is housed within a compact 100-LQFP package (14 × 14 mm). Its substantial integration of non-volatile memory, flexible peripherals, and rich safety features make it well-suited for electronic control units (ECUs), body electronics, seat control, and other embedded automotive modules requiring reliable real-time processing and multitasking support.
With an extended operating temperature range of –40°C to +105°C and RoHS3 compliance, the SPC5602DF1VLL4R meets stringent automotive standards, ensuring long-term reliability and environmental compatibility. The device falls under active product status, assuring engineers of ongoing supply and manufacturer support.
At the heart of the SPC5602DF1VLL4R lies the e200z0h core, designed to be compliant with Power Architecture and supporting Variable Length Encoding (VLE) for a reduced code footprint. The single-level memory hierarchy—supported by a 64-bit crossbar switch—enables swift concurrent access to Flash, SRAM, or peripherals, crucial for real-time automotive applications.
The core delivers efficient 32-bit processing at up to 48 MHz, striking a balance between computational performance and low power consumption. With instruction set enhancements, the SPC5602DF1VLL4R optimizes both code density and execution speed, benefitting automotive coding standards and functional safety requirements. The processor is backed by standard development infrastructure, including drivers and OS support, enabling efficient integration into existing designs.
A key advantage of the SPC5602DF1VLL4R resides in its high-density embedded memory. The device integrates 256 KB of Code Flash memory with Error Correction Coding (ECC), 64 KB of Data Flash (ECC), and 16 KB of SRAM (ECC), offering robust storage for program code, parameters, variables, and real-time data. The inclusion of ECC for both volatile and non-volatile memories significantly enhances data integrity—fundamental in safety-oriented automotive applications.
Supplementary features include a Boot Assist Module (BAM) that supports Flash programming over serial interfaces (CAN/SCI), and support for in-system programming and debugging via Nexus and JTAG boundary scan. This comprehensive memory subsystem enables seamless application software updates, debugging, and security implementation.
Modern automotive networks demand versatile communication. The SPC5602DF1VLL4R brings an extensive suite of on-chip peripherals addressing both control and connectivity:
33-channel, 12-bit Analog-to-Digital Converter (ADC): Supports high-channel-count sensor interfacing for precision monitoring and control
1× FlexCAN (full CANbus module): For reliable high-speed communication within the vehicle network
3× LINFlex (Serial Communication with LIN capability): LINFlex modules maximize support for LIN and SCI protocols; two are master-only, one can act as master or slave and connects to the internal eDMA
2× DSPI (Serial Peripheral Interfaces): Offer high-speed SPI communications for various external expansions or sensor interfaces
Enhanced Modular Input Output System (eMIOS-lite): Supplies input capture, output compare, and Pulse Width Modulation (PWM) functions for actuator control
Enhanced Direct Memory Access (eDMA): Enables high-speed data transfers with minimal CPU intervention
Other core system modules—such as multiple periodic interrupt timers (PIT), real-time clock (RTC), cross-triggering unit (CTU), and sophisticated interrupt and wakeup control—deliver comprehensive timekeeping and interrupt management.
Energy efficiency is a prime concern for ECUs and automotive nodes. The SPC5602DF1VLL4R incorporates multiple power management mechanisms:
Integrated voltage regulator (VREG): Supports wide supply voltages from 3V to 5.5V, allowing flexible design integration and robust power sequencing across varying automotive electrical architectures.
Power Control Unit (MC_PCU): Sections the device into power domains to selectively power down inactive blocks, substantially reducing standby and operating power consumption.
Low Voltage Detector and Advanced Reset Gen Module: Ensure reliable operation under varying supply conditions through brown-out protection and managed reset behavior.
Multiple oscillator options (fast external crystal, fast internal RC, slow internal RC): Afford flexible clocking strategies that can be optimized for either performance or power savings depending on the operational mode.
These built-in features combine to deliver strong power efficiency and system safety—critical to reducing energy consumption and meeting OEM low-power mandates.
The device is supplied in a 100-LQFP package (14 × 14 mm), ideal for surface-mount assembly and offering superior pin accessibility for complex automotive PCB layouts. Up to 79 general-purpose I/O pins can be configured and multiplexed for a wide range of digital and analog functions, providing engineers the flexibility to tailor pin assignment to their application.
Environmental resilience is a hallmark: with operation guaranteed from –40°C to +105°C, the SPC5602DF1VLL4R is suitable for under-the-hood and body applications. The device is RoHS3 and REACH compliant, MSL-3 rated (for moisture sensitivity), and supports robust EMC and ESD standards to ensure reliable performance in harsh automotive environments.
For engineers considering system upgrades or second sourcing, understanding alternatives to the SPC5602DF1VLL4R is key. The broader NXP MPC560xD line, including the MPC5601DxLH and MPC5602DxLH, offers notable similarities with differentiation primarily in code Flash size (MPC5601DxLH provides 128 KB, for instance) and I/O or timer resources.
Device selection may also weigh package options; for example, the series includes devices in 64-LQFP (10 × 10 mm) configurations compatible with space-constrained PCBs, albeit with fewer I/Os. In all cases, engineers should assess memory needs, peripheral counts (especially ADC and timer channels), and pin mapping when evaluating compatible replacements within the MPC56xx Qorivva series.
– Key engineering factors in selecting the SPC5602DF1VLL4R
The SPC5602DF1VLL4R microcontroller stands out as a mature, feature-rich solution for automotive and industrial embedded control—offering a well-balanced blend of high memory density, robust peripheral integration, power management, and proven automotive qualification. Its architectural enhancements deliver efficient real-time processing, while compliance with modern communications (CAN, LIN, SPI) ensures seamless integration into complex ECUs and networked systems.
For product selection engineers and procurement teams, the SPC5602DF1VLL4R represents a versatile, scalable platform. Whether the application is new development or a legacy redesign, the device offers the assurance of long-term availability, extensive support infrastructure, and alignment with industry standards—central to informed, risk-mitigated component selection.
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SPC5602DF1VLL4RNXP USA Inc. |
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