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| Part Number: | SPC5602DF1MLL4 |
|---|---|
| Manufacturer/Brand: | NXP USA Inc. |
| Part of Description: | IC MCU 32BIT 256KB FLASH 100LQFP |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $233.932 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply (Vcc/Vdd) | 3V ~ 5.5V |
| Supplier Device Package | 100-LQFP (14x14) |
| Speed | 48MHz |
| Series | MPC56xx Qorivva |
| RAM Size | 16K x 8 |
| Program Memory Type | FLASH |
| Program Memory Size | 256KB (256K x 8) |
| Peripherals | DMA, POR, PWM, WDT |
| Package / Case | 100-LQFP |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Number of I/O | 79 |
| Mounting Type | Surface Mount |
| EEPROM Size | 4K x 16 |
| Data Converters | A/D 33x12b |
| Core Size | 32-Bit Single-Core |
| Core Processor | e200z0h |
| Connectivity | CANbus, LINbus, SCI, SPI |
| Base Product Number | SPC5602 |




The NXP SPC5602DF1MLL4 is a member of the MPC56xx Qorivva 32-bit automotive microcontroller family, tailored to address a wide variety of embedded automotive and industrial applications. Housed in a 100-pin LQFP package (14×14 mm), this device is built around an e200z0h core running at up to 48 MHz and features 256 KB of on-chip Flash, advanced peripheral modules, and robust system integration options. Designed with Power Architecture® technology, the SPC5602DF1MLL4 targets engineers who prioritize high integration, reliable real-time performance, and application-focused flexibility, particularly for body electronics, seat control, and general-purpose automotive control systems.
At the heart of the SPC5602DF1MLL4 lies a single-core, 32-bit e200z0h processor optimized for automotive-grade tasks. Leveraging Variable Length Encoding (VLE) to reduce code size, the CPU supports real-time computing with efficient power management. The device's memory layout consists of 256 KB of program Flash (with ECC), 64 KB of data Flash, and 16 KB of SRAM with error correction for stable operation.
Connectivity and communication are central to the device’s architecture. The microcontroller includes CANbus, LINbus, SCI, and SPI support—essential for addressing typical automotive communication requirements. For real-time application support, the crossbar switch infrastructure allows multiple bus masters concurrent access to memory and peripherals, eliminating bottlenecks in data handling.
Debug and development are facilitated via an IEEE 1149.1 JTAG interface and a Nexus IEEE-ISTO 5001-2003 Class 1 development interface, enabling efficient test, configuration, and programming during development and manufacturing.
The SPC5602DF1MLL4 is distinguished by its rich set of system modules. The integrated peripherals include up to 79 configurable general-purpose I/O pins, DMA, on-chip voltage regulation, and multiple timer resources (including a real-time counter and periodic interrupt timers). The Enhanced Modular Input/Output System (eMIOS-lite) supports comprehensive timing functions such as input capture, output compare, and PWM generation—indispensable for applications driving actuators and sensors.
A key highlight is the high-performance 33-channel, 12-bit analog-to-digital converter (ADC), supporting a broad variety of sensor inputs and signals. Communication modules include two DSPI channels and three LINFlex interfaces, offering flexible multi-protocol serial communication; the FlexCAN controller provides robust CAN protocol support with configurable message buffers.
System control modules—such as the software watchdog timer (SWT), on-chip clock and power management, and wake-up units—allow for stringent functional safety and low-power operation, which are critical in automotive-controlled scenarios. The embedded Boot Assist Module (BAM) streamlines in-system programming and flashing via standard serial links.
The SPC5602DF1MLL4 is specified for robust operation: a -40°C to +125°C automotive temperature range, 3.3 V power supply, and RoHS3 compliance for environmental stewardship. The device supports advanced electromagnetic compatibility (EMC) features and hardened software design guidelines to minimize noise susceptibility in harsh electronic environments.
Internally, the microcontroller uses a frequency-modulated phase-locked loop (FMPLL), which, together with flexible clock sources including a fast internal RC oscillator and a fast external crystal oscillator, provides reliable timing and synchronization for complex system activities.
The packaging is optimized for surface-mount applications, with a 100-LQFP form factor ensuring widespread compatibility with standard PCB assembly processes. Developers should also consider the device’s thermal characteristics and power supply pin assignments, as highlighted in the mechanical datasheet, for reliable long-term operation.
From an engineering deployment perspective, the SPC5602DF1MLL4 meets stringent automotive application requirements where resilience, predictable real-time performance, and integration density are pivotal. Engineers should utilize its crossbar switch design to architect efficient data flow between core, peripherals, and memory, particularly when orchestrating time-critical routines or balancing concurrent sensor interfaces.
The device’s multi-channel ADC and wide I/O configurability are especially valuable in systems needing comprehensive data acquisition from various sensor types—common in seat control, body systems, or gateway modules. Sophisticated power management features enable deep-sleep modes and rapid wake-up, which are increasingly essential in reducing current draw during vehicle idle phases.
For system development, real-time debugging interfaces and BAM-supported programming ease the integration of secure bootloaders and over-the-air update capabilities. The inclusion of EEPROM emulation support extends life and flexibility for parameter storage over the product’s long-term lifecycle.
For projects considering alternatives or preparing second-source strategies, NXP’s own MPC5602D series variants are natural peers, differing in pin count, Flash, and SRAM sizing:
MPC5602DLH (64 LQFP): Provides similar core architecture but with reduced package size and potentially adjusted I/O counts.
MPC5601DLH/MPC5601DLL: Suitable for lower memory and peripheral requirements—these variants feature 128 KB Flash and 12 KB SRAM with fewer ADC channels and timer resources.
Selection between these should be based on specific application needs—memory footprint, number of required I/O, and peripheral complement are primary differentiators. For direct replacements, footprint and pinout compatibility must be verified, especially in retrofit or design migration scenarios.
: Evaluating the SPC5602DF1MLL4 for your design needs
The SPC5602DF1MLL4 from NXP represents a robust, feature-rich microcontroller for modern automotive and industrial control designs. Combining a high-performance 32-bit CPU, industry-standard communication modules, and a comprehensive set of system peripherals, it enables engineers to realize sophisticated control logic efficiently. Its scalable package and pinout options, adherence to stringent automotive reliability standards, and advanced memory architecture make the SPC5602DF1MLL4 a compelling candidate for both new and evolving embedded applications. For teams balancing high integration, reliable communication, and future-resilient design practices, the SPC5602DF1MLL4 warrants close consideration within any professional selection process.
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IC MCU 32BIT 256KB FLASH 100LQFP
IC MCU 32BIT 256KB FLASH 64LQFP
IC MCU 32BIT 256KB FLASH 100LQFP
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SPC5602DF1MLL4NXP USA Inc. |
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