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| Part Number: | BAS70-05T-7-F |
|---|---|
| Manufacturer/Brand: | Diodes Incorporated |
| Part of Description: | DIODE ARRAY SCHOTTKY 70V SOT523 |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.8032 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 1 V @ 15 mA |
| Voltage - DC Reverse (Vr) (Max) | 70 V |
| Technology | Schottky |
| Supplier Device Package | SOT-523 |
| Speed | Small Signal =< 200mA (Io), Any Speed |
| Series | - |
| Reverse Recovery Time (trr) | 5 ns |
| Package / Case | SOT-523 |
| Product Attribute | Attribute Value |
|---|---|
| Package | Tape & Reel (TR) |
| Operating Temperature - Junction | -55°C ~ 125°C |
| Mounting Type | Surface Mount |
| Diode Configuration | 1 Pair Common Cathode |
| Current - Reverse Leakage @ Vr | 100 nA @ 50 V |
| Current - Average Rectified (Io) (per Diode) | 70mA (DC) |
| Base Product Number | BAS70 |




The BAS70-05T-7-F from Diodes Incorporated is a surface-mount Schottky diode array designed for space-constrained and high-performance electronic systems. Arranged as a single pair in common cathode configuration and housed in a SOT-523 package, the device is engineered to provide low forward voltage drop and rapid switching. With a voltage rating of 70V and a continuous forward current of 70mA, the BAS70-05T-7-F is suitable for tasks such as signal routing, voltage clamping, and high-speed switching in various applications, including portable electronics and data communications.
The BAS70-05T-7-F is noted for its low turn-on voltage, making it advantageous in low-voltage logic circuits and signal-level rectification. Its fast switching capabilities are beneficial in frequency-sensitive or speed-critical applications, ensuring minimal propagation delay as signals transition. To enhance robustness, the diode incorporates a PN junction guard ring, offering transient and electrostatic discharge (ESD) protection—a critical advantage in designs exposed to frequent electrical disturbances or handling.
The ultra-small SOT-523 package enables high-density placement, vital for modern compact systems such as wearables, sensor modules, and handheld devices. For automotive or other regulated environments, the device’s RoHS, halogen-free, and “green” status ensures compliance with widespread industry requirements.
Manufactured with molded plastic achieving a UL 94V-0 flammability rating, the BAS70-05T-7-F package combines safety with compactness. The device’s moisture sensitivity is classified as Level 1 per J-STD-020, indicating no special handling beyond standard storage conditions. Its terminals are finished with matte tin plating and are solderable per MIL-STD-202, method 208. The SOT-523 package dimensions and recommended pad layout support straightforward integration and automated pick-and-place assembly. At approximately 0.002 grams, the device contributes negligibly to overall PCB mass.
At a nominal ambient temperature of 25°C, the BAS70-05T-7-F achieves its maximum repetitive reverse voltage of 70V and sustains a continuous forward current up to 70mA, making it well-suited for both protection and signal processing tasks. Its forward voltage, switching speed, leakage current, and capacitance parameters are optimized for efficiency and speed, ensuring minimal energy loss and reduced signal lag.
The inclusion of graphical performance data—such as forward/reverse characteristics, total capacitance versus reverse voltage, and power derating—enables engineers to match device selection with real-life thermal, voltage, and frequency requirements. Power derating curves, in particular, are vital for determining safe operating limits under varying ambient conditions and for ensuring reliable long-term operation.
To support integration into PCB designs, the BAS70-05T-7-F’s SOT-523 footprint and pad layout are specified for optimal solderability and thermal performance. When mounted on FR-4 substrates using the recommended pad layout, engineers can minimize parasitic effects and ensure repeatable manufacturing outcomes. Careful attention to PCB layout can further optimize ESD and transient response, leveraging the device’s internal guard ring design.
In line with global regulations, the BAS70-05T-7-F is fully compliant with RoHS (2002/95/EC, 2011/65/EU, 2015/863/EU directives) and meets halogen-free and antimony-free “green” criteria. Its raw materials and processes restrict bromine, chlorine, and antimony below defined thresholds, supporting sustainable manufacturing and eco-friendly finished products. The device’s moisture sensitivity rating and robust construction contribute to strong long-term reliability in the field.
Within the same product family, engineers considering functional or pin-compatible alternatives may reference the BAS70T, BAS70-04T, and BAS70-06T from Diodes Incorporated, each differing in array configuration or circuit topology. For cross-brand substitutions, careful scrutiny of reverse voltage rating, package compatibility, leakage current, and switching parameters is essential to ensure correct function in target applications. When evaluating alternatives, matching the SOT-523 package, common cathode configuration, and similar electrical ratings is particularly important for seamless drop-in replacement.
: Selection Considerations for Engineers and Procurement
The BAS70-05T-7-F Schottky diode array from Diodes Incorporated offers a versatile balance of size, efficiency, protection, and compliance. Its technical features align with demands in modern electronics design, from high-speed switching to ESD protection in compact assemblies. With careful consideration of the outlined characteristics, application engineers and procurement teams can confidently specify the BAS70-05T-7-F for existing and new designs, while remaining aware of compatible alternatives within the BAS70 family and beyond.
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