Infineon BC846PNH6327

Mfr. Part

BC846PNH6327

Manufacturer

Cypress Semiconductor (Infineon Technologies)

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Detailed Description

Complementary transistor pair NPN plus PNP integrated in one ultra‑small package 636 also known as SOT‑363 or SC‑70‑6. General purpose small‑signal device for amplification and switching. The H6327 suffix indicates Infineon tape‑and‑reel packaging. Classified under Integrated Circuits Specialized ICs in our catalog. Available stock quantity 2142 units. Data code 1325 plus indicates production batch identification.

Key Features

Dual transistor pair one NPN BC846 class and one PNP BC856 class in a single 6‑pin package

Compact footprint saves board space and reduces routing complexity

Wide voltage capability typical up to 65 V for both transistors

Continuous collector current capability typically up to 100 mA per transistor

Useful gain range for general signal work typical hFE 110 to 800 depending on grade and operating point

Low saturation voltage for efficient switching at modest currents

High transition frequency suitable for audio and RF small‑signal stages typically 100 to 300 MHz class

RoHS compliant and lead‑free plating available

Tape‑and‑reel packaging for automated SMT assembly

Key Advantages

Two complementary transistors in one package reduces BOM count and assembly time

Improved thermal tracking between NPN and PNP thanks to shared package

Ideal for push‑pull stages level shifting and bias networks

Cost effective and widely supported across ecosystems

Small package enables dense layouts in portable and IoT designs

Packaging

Type tape and reel H6327 code for high volume pick‑and‑place

Package case 636 SOT‑363 SC‑70‑6 plastic mold epoxy body copper lead frame

Approximate size 2.0 mm by 1.25 mm by 1.1 mm height

Pin configuration six leads typically three pins per transistor

• QPNP pins 1 emitter 2 base 3 collector

• QNPN pins 4 emitter 5 base 6 collector

Check the datasheet pin map for the exact vendor assignment

Marking code laser or ink top‑side code varies by lot

Lead finish matte tin compatible with Pb‑free reflow

Moisture sensitivity level low typical MSL 1 or 2 verify per datasheet

Thermal characteristics typical junction to ambient resistance around 500 to 600 C per W on standard FR‑4

Power dissipation typical up to 300 mW for the package with derating at high temperatures

Electrical properties typical VCEO 65 V Ic continuous up to 100 mA VCEsat low at moderate currents hFE broad usable range fT high for small‑signal work

Lifecycle

Current status active and widely available within Infineon’s discrete device family

Not nearing discontinuation based on industry availability trends

Equivalent or alternative models widely available customers should verify pinout and gain group

• Nexperia BC846PN 115 SOT‑363

• ON Semiconductor Onsemi BC846BPNLT1G SOT‑363

• Diodes Incorporated BC846BPN 7 F SOT‑363

• Vishay BC846BPN GS08 SOT‑363

• MCC Micro Commercial Components BC846BPN TP SOT‑363

These are complementary NPN PNP pairs in the same package class commonly used as drop‑in alternates

If you need a tailored equivalent or specific lot codes contact our sales team at Y‑IC via our website for the latest options and cross references

Key Application Areas

Signal amplification and buffering in audio and instrumentation

Level shifting and logic interfacing between different voltage rails

Push‑pull stages and simple output drivers for small loads

Sensor bias networks and bridge conditioning

Switching of small relays LEDs and low current loads

Portable devices wearables and space‑constrained IoT modules

RF and high frequency small‑signal stages up to VHF depending on layout and bias

Datasheet

Our website hosts the most authoritative datasheet for BC846PNH6327. Download the datasheet on this page to get exact pin maps electrical limits thermal data and application guidance.

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