Infineon Technologies IPA60R160P6

Mfr. Part

IPA60R160P6

Manufacturer

Infineon Technologies (Cypress Semiconductor is part of Infineon)

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Detailed Description

600 V N-channel power MOSFET in the CoolMOS P6 series. TO-220-3 FullPAK insulated package (PG-TO220-3-111) for through-hole mounting. Optimized for high-efficiency, high-voltage switching in offline SMPS and PFC stages. Low on-resistance and moderate gate charge make it suitable for fast, efficient switching with standard 10 V gate drive.

Key electrical parameters: Rds(on) 160 mΩ at Vgs=10 V and Id=9 A; continuous drain current 23.8 A (at Tc, 25°C); power dissipation 34 W (Tc); Vdss 600 V; Vgs ±20 V; gate charge Qg 44 nC at Vgs=10 V; input capacitance Ciss 2080 pF at Vds=100 V; Vgs(th) max 4.5 V at 750 µA; operating junction temperature -55°C to +150°C.

Key Features

600 V N-channel CoolMOS P6 technology for high efficiency in hard-switching topologies

Low Rds(on) 160 mΩ for reduced conduction losses

Moderate gate charge (44 nC) and low input capacitance (2080 pF) for faster switching and lower drive losses

Wide gate voltage range ±20 V for rugged operation

Through-hole TO-220-3 FullPAK (insulated tab) for safer thermal and electrical mounting

Standard 10 V gate drive for lowest Rds(on)

Operating junction range -55°C to +150°C for robust thermal performance

Series: CoolMOS

Key Advantages

Higher efficiency at high line due to low conduction and switching losses

Insulated FullPAK package simplifies thermal and electrical isolation from heatsinks

Reduced heat generation enables smaller heatsinks or higher power density

Rugged gate oxide and wide Vgs margin improve reliability under transient conditions

Simple drive requirements (10 V) compatible with common controllers

Reliable performance in demanding industrial and consumer SMPS applications

Packaging

Shipment type: Bulk

Device package: PG-TO220-3-111

Case: TO-220-3 FullPAK (fully molded, insulated tab)

Mounting: Through Hole

Pin configuration: 3 leads (Gate, Drain, Source); tab connected to Drain, tab is fully insulated from exterior

Materials: Molded epoxy body, copper leadframe; insulated tab for safer mounting

Size: Standard TO-220 footprint and hole spacing (PG-TO220-3-111 mechanical standard)

Thermal characteristics: FullPAK has higher thermal resistance vs. open-tab TO-220; device Pd max 34 W at case; use proper heatsinking and thermal interface materials

Electrical profile: 600 V Vdss; 23.8 A continuous Id (at Tc, 25°C); Rds(on) 160 mΩ at Vgs=10 V; Qg 44 nC; Ciss 2080 pF; Vgs ±20 V

Lifecycle

Current status: Generally active within Infineon’s CoolMOS portfolio; not indicated as near end-of-life based on current series identification

Potential equivalents or alternatives:

- IPA60R190P7 (FullPAK, 600 V CoolMOS P7, similar function with close Rds(on))

- IPP60R160P6 (TO-220 open-tab, same generation and Rds(on) target, non-insulated tab)

- IPW60R160P6 (TO-247, higher power handling, same voltage and Rds(on) class)

- Verify pinout, thermal performance, and exact electrical specs in datasheets before substituting

If you need an exact cross or different package/Rds(on) target, please contact our sales team via the Y-IC website for tailored recommendations and up-to-date lifecycle information

Key Application Areas

PFC front ends for AC-DC power supplies (industrial, server, telecom)

Primary-side switches in flyback and forward converters for adapters and chargers

LED lighting drivers (offline, isolated and non-isolated)

Auxiliary power supplies in industrial controls and appliances

UPS and inverter front sections

HVAC, white goods, and motor control SMPS stages

Any high-voltage, high-efficiency offline SMPS using hard-switching topologies

Datasheet

Y-IC provides the most authoritative and up-to-date datasheet for IPA60R160P6 on our product page. We strongly recommend downloading it here to get complete electrical curves, thermal data, and application guidance.

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