AMD XC6VLX130T-3FF784C

Mfr. Part

XC6VLX130T-3FF784C

Manufacturer

AMD Xilinx

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Detailed Description

Virtex-6 LXT family FPGA, speed grade -3, 128k logic cells with about 10k CLBs, 9.73 Mb embedded RAM, 240 user I/O, commercial temperature grade, 0.95–1.05 V core supply, surface-mount 784-ball flip‑chip BGA package (29 x 29 mm). RoHS non-compliant. Supplied in tray packaging.

Key Features

Family and series: Virtex-6 LXT

Base product number: XC6VLX130

Speed grade: -3

Logic resources: 128,000 logic elements / ~10,000 CLBs

Embedded memory: 9,732,096 total RAM bits

User I/O: 240

Supply voltage (core): 0.95 V to 1.05 V

Operating temperature (junction): 0°C to 85°C (commercial)

Package and size: 784-FCBGA, 29 mm x 29 mm body

Mounting: Surface mount

Device package options noted by supplier: 784-FCBGA (29x29), 784-BBGA/FCBGA

RoHS status: RoHS non-compliant

Shipment form: Tray

Key Advantages

Balanced logic density and on-chip RAM for mid-to-high complexity designs

Mature, proven Virtex-6 platform with stable behavior in production builds

Wide I/O count to interface with multiple buses and peripherals

-3 speed grade supports higher performance margins compared to lower grades

Flexible power core range around 1.0 V for efficiency

Large-ball-count FCBGA for robust power delivery and high signal breakout

Backed by Y-IC distribution quality and support for dependable supply

Packaging

Type: Flip-Chip Ball Grid Array (FCBGA), also referenced as BBGA/FCBGA by supplier

Body size: 29 mm x 29 mm

Ball count: 784

Shipment: Tray

Material and construction: Flip-chip die on organic BGA substrate with solder balls; RoHS non-compliant (leaded finish)

Pin configuration: 784-ball array; full ball map and pitch are defined in the official datasheet and package drawings

Thermal characteristics: Commercial-grade junction temperature 0°C to 85°C; actual θJA/θJC depend on board design, airflow, and heatsinking; see thermal guidelines in the datasheet

Electrical properties summary: Core supply 0.95–1.05 V; 240 user I/O; 128k logic cells; 9.73 Mb embedded RAM; additional rails and I/O standards are deviceand bank‑specific—refer to the datasheet for exact rail requirements and permitted I/O standards

Lifecycle

Status overview: Virtex-6 is a mature, legacy family. Some specific part numbers are NRND or have constrained availability. Please confirm current lifecycle and lead time with our sales team.

Close equivalents in the same family (performance and logic-class peers; check package, speed grade, and temperature):

- XC6VLX130T-1FF784C

- XC6VLX130T-2FF784C

- XC6VLX130T-4FF784I (industrial temp, different speed/grade; verify availability)

Potential modern alternatives (not pin-compatible; redesign required; chosen for similar or higher logic density/performance):

- Kintex-7 family examples: XC7K160T, XC7K325T

- Virtex-7 family examples: XC7VX180T, XC7VX330T

- Kintex UltraScale family examples: XCKU040, XCKU060

- Virtex UltraScale+ family examples: XCVU3P, XCVU5P

If you need a direct drop-in replacement in the same package and speed, contact our sales team via the Y-IC website. We will verify real-time lifecycle status and present the best-fit equivalents.

Key Application Areas

Communications infrastructure, switching, and routing

High-speed data acquisition and instrumentation

Industrial imaging, machine vision, and real-time processing

Storage, memory buffering, and protocol bridging

Test and measurement, ATE controllers

Secure systems and accelerated computing where custom logic is needed

Datasheet

Y-IC hosts the most authoritative datasheet and package resources for this exact model on our product page. We recommend downloading the datasheet from our site to get the latest specifications, pinout, thermal data, and design guidelines.

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