Winbond Electronics W25Q64JVTBAM

Mfr. Part

W25Q64JVTBAM

Manufacturer

Winbond Electronics Corporation. Y-IC is a quality distributor of Winbond and we provide customers with the best genuine products, fast support, and dependable service

Detailed Description

64 Mbit SPI and Quad SPI NOR Flash memory in a 24-ball TFBGA 8x6 mm package. Non-volatile storage organized as 8M x 8. Operates from 2.7 to 3.6 V. High speed read up to 133 MHz. Wide operating temperature from minus 40 to 105 degrees Celsius. Surface-mount design. Part of Winbond SpiFlash family. Base product number W25Q64

Key Features

64 Mbit capacity with 8M x 8 organization

SPI and Quad I O interface for faster throughput

High speed read up to 133 MHz

Fast page program with typical 3 ms write cycle

NOR Flash technology for random read and execute in place support

6 ns access time for quick response

Wide temperature range minus 40 to 105 degrees Celsius

3 V supply operation from 2.7 to 3.6 V

Compact 24 ball TFBGA package 8x6 mm footprint

Surface mount for automated assembly

Part of the proven Winbond SpiFlash series

Key Advantages

Quad I O boosts read performance and shortens boot times

Robust operation in industrial and automotive temperature ranges

Low power 3 V operation reduces system power draw

Small BGA package saves PCB space and enables high density layouts

Mature SpiFlash command set simplifies firmware development and compatibility

Reliable non volatile storage for code and data

Winbond ecosystem support and broad toolchain compatibility

Packaging

Device package type 24 TFBGA body size 8x6 mm

Ball count 24 balls with standard Quad SPI signals CS SCLK IO0 IO1 IO2 IO3 WP HOLD power and ground

Mounting style surface mount suitable for reflow soldering

Package material epoxy molding compound with lead free RoHS compliant solder balls

Shipping packaging tube for secure handling and assembly convenience

Thermal characteristics wide operating temperature minus 40 to 105 degrees Celsius. For detailed thermal resistance and derating consult the datasheet

Electrical properties supply voltage 2.7 to 3.6 V. Read clock up to 133 MHz. Access time 6 ns. Page program typical 3 ms

Lifecycle

Current status active and widely used in production designs

Not nearing discontinuation based on current series standing

Equivalent and alternative models to consider. Verify pinout package and firmware command compatibility

- Winbond W25Q64JVSSIQ SOIC package same capacity and series

- Winbond W25Q64JVSIQ SOIC package compact variant

- Winbond W25Q64JVZPIQ WSON 8x6 package for low profile boards

- Macronix MX25L6406E 3 V Quad SPI NOR Flash 64 Mbit

- Infineon Cypress S25FL064L 3 V Quad SPI NOR Flash 64 Mbit

- Micron MT25QL64 3 V Quad SPI NOR Flash 64 Mbit

- ISSI IS25LP064 3 V Quad SPI NOR Flash 64 Mbit

- GigaDevice GD25Q64 3 V Quad SPI NOR Flash 64 Mbit

If you need pin compatible drop in replacements or automotive grade options contact our sales team via the Y IC website for up to date cross references and availability

Key Application Areas

Code storage and boot memory for microcontrollers and embedded systems

IoT devices gateways and sensor nodes needing compact non volatile memory

Consumer electronics wearables smart home and portable devices

Networking equipment routers access points and modems

Automotive modules clusters infotainment and telematics within specified temp range

Industrial control PLC HMI and instrumentation

Storage of firmware configuration data and calibration tables

Multimedia devices set top boxes smart TVs and printers

Datasheet

Our website hosts the most authoritative datasheet for W25Q64JVTBAM. Download it on this page to get full electrical timing pinout and design guidance

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