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| Part Number: | TLC083AID |
|---|---|
| Manufacturer/Brand: | Texas Instruments |
| Part of Description: | IC OPAMP GP 2 CIRCUIT 14SOIC |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 250+ | $2.1139 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply Span (Min) | 4.5 V |
| Voltage - Supply Span (Max) | 16 V |
| Voltage - Input Offset | 390 µV |
| Supplier Device Package | 14-SOIC |
| Slew Rate | 19V/µs |
| Series | - |
| Package / Case | 14-SOIC (0.154", 3.90mm Width) |
| Package | Tube |
| Output Type | - |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 125°C (TA) |
| Number of Circuits | 2 |
| Mounting Type | Surface Mount |
| Gain Bandwidth Product | 10 MHz |
| Current - Supply | 1.9mA (x2 Channels) |
| Current - Output / Channel | 57 mA |
| Current - Input Bias | 3 pA |
| Base Product Number | TLC083 |
| Amplifier Type | General Purpose |




The TLC083AID from Texas Instruments is a high-performance, general-purpose dual operational amplifier (op amp) housed in a 14-SOIC package. As a member of TI’s TLC08x BiMOS amplifier family, the TLC083AID leverages a hybrid CMOS and bipolar architecture to deliver superior bandwidth, low noise, and robust output drive, making it well-suited for a wide range of audio, industrial, automotive, and instrumentation systems. The device is designed to offer enhanced AC and DC performance for engineers transitioning from traditional BiFET to modern single-supply op amp requirements.
At the heart of the TLC083AID are distinct features that set it apart in demanding analog signal processing applications:
Wide Unity-Gain Bandwidth: 10 MHz enables high-frequency response for fast signal processing.
High Output Drive Capability: 57 mA sourcing (at VDD – 1.5 V) and 55 mA sinking (at 0.5 V), suitable for driving loads directly.
High Slew Rate: Up to 16 V/μs (positive) and 19 V/μs (negative), ensuring clean transitions even with rapidly changing signals.
Wide Supply Voltage Range: Operates from 4.5 V to 16 V, providing flexibility across different application circuits.
Low Quiescent Current: 1.9 mA per channel in normal mode; features an ultra-low power shutdown mode reducing supply current to 125 μA per channel.
Low Noise and Offset: Input noise voltage is just 8.5 nV/√Hz with a maximum input offset voltage of 1.5 mV (standard grade), supporting precision applications.
Input Offset Nulling: Offset null pins enhance versatility for high-accuracy instrumentation.
Compact Industry-Standard Packages: Available in SOIC and thermally efficient MSOP/VSSOP (PowerPAD™) footprints.
Extended Industrial Temperature Range: Functions reliably from −40°C to +125°C.
The TLC083AID’s combination of a CMOS input stage and bipolar output stage results in high input impedance, low input bias current, and strong output characteristics. Key parameter highlights include:
Input Common Mode Range (VICR): Includes ground, simplifying single-supply system implementation.
Power Supply Rejection Ratio (PSRR): > 40 dB (typical) up to 130 dB, improving accuracy over varying supply conditions.
Output Swing: Delivers output voltages close to both rails, maximizing dynamic range.
Low Total Harmonic Distortion: Suitable for audio and measurement applications where signal fidelity is critical.
Shutdown Function: On certain TLC08x family members (including TLC083AID), the SHDN pin transitions the op amp into a low-power, high-impedance output state, which is especially beneficial for battery-operated or power-conscious designs.
The TLC083AID is offered in a 14-pin SOIC package, with additional options in MSOP, VSSOP (PowerPAD), and HTSSOP formats. PowerPAD versions employ an exposed leadframe for improved heat dissipation, enhancing reliability even under high-output current conditions.
Key packaging attributes:
The thermal pad is electrically isolated but must be connected to the system ground for optimal thermal transfer.
Adheres to industry standards such as JEDEC MS-012 (SOIC) and MO-187 (VSSOP), ensuring compatibility with widespread automated assembly processes.
Robust moisture sensitivity and RoHS compliance.
Effective thermal management is achieved by soldering the PowerPAD to a suitable copper plane on the PCB and optimizing via placement to channel heat efficiently away from the IC. This is especially important for multi-amplifier packages and high-output-load scenarios to prevent junction temperature excursions.
To fully exploit the TLC083AID’s dynamic performance, the following application insights are recommended:
Offset Voltage Nulling: For applications demanding minimum offset, use the provided offset null pinouts and appropriate trim potentiometer as outlined in the datasheet.
Capacitive Load Driving: To prevent phase margin degradation and potential oscillations, insert a 20 Ω (minimum) isolation resistor between the op amp output and capacitive loads exceeding 10 pF.
High-Speed Configurations: Due to higher CMOS input capacitance (~20 pF), engineers should manage feedback resistor values carefully; for gains ≤10, a maximum value of 5 kΩ is advised, with bypass capacitors across higher-value feedback resistors to suppress peaking.
Filter Design: When implementing low-pass or Sallen-Key filters, maintain amplifier bandwidth at least 8–10 times greater than the filter cutoff frequency to preserve phase accuracy.
Shutdown Function Usage: Tie the SHDN pin to VDD (for split-supply designs) or logic high to enable the device; pull low to deactivate and isolate the amplifier outputs.
Proper PCB layout is essential to preserve the TLC083AID’s high-speed and low-noise properties:
Employ continuous ground planes except near amplifier inputs/outputs to contain stray capacitance.
Decouple each supply pin with a low-ESR 0.1 μF ceramic capacitor as close as possible to the device, complemented by a shared 6.8 μF tantalum bulk capacitor.
Prefer surface-mount components and short trace lengths to minimize inductive and capacitive parasitics.
For PowerPAD deployments, maximize copper under the device, connect thermal vias directly to a ground plane, and comply with recommended solder mask and via fill strategies to avoid solder voids and maximize thermal performance.
The TLC08x family encompasses single, dual, and quad amplifiers with compatible electrical characteristics. For applications requiring different channel counts or packaging, consider the following TLC083AID equivalents and replacements:
TLC080 (single op amp)
TLC081 (single, higher-precision variant)
TLC082 (dual op amp, standard performance)
TLC084 (quad op amp)
TLC085 (quad, higher-precision variant)
All listed models share the BiMOS architecture and similar bandwidth, offset, and noise performance. Automotive versions (e.g., TLC082-Q1, TLC084-Q1) are qualified to AEC-Q100 standards and are suitable for high-reliability automotive systems. Designers upgrading from the renowned TL08x BiFET series will benefit from the TLC08x family’s improved noise, offset, and supply current characteristics.
The TLC083AID is a robust and versatile choice for engineers seeking a dual operational amplifier that combines wide bandwidth, low noise, strong output drive, and efficient power consumption in a proven package. Its flexibility for use in precision signal conditioning, filtering, buffering, and other analog functions is enhanced by its advanced BiMOS process technology and attention to application and layout nuances. Additionally, its seamless compatibility with other TLC08x models offers easy design migration and supply chain flexibility, empowering product selection engineers and procurement professionals to optimize both technical and cost requirements in new and existing designs.
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