Texas Instruments CSD18542KTT

Mfr. Part

CSD18542KTT

Manufacturer

Texas Instruments

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Detailed Description

N-channel power MOSFET from the NexFET series. 60 V drain-to-source rating, very low on-resistance, and high current handling for efficient switching in high-power designs. Surface-mount DDPAK TO-263-3 package, RoHS3 compliant. Ideal for synchronous rectification, high-current switching, and DC power stages. Available in Tape and Reel packaging with in-stock quantity of 2304 units.

Key Features

Technology MOSFET NexFET N-channel single

Vdss 60 V

Continuous drain current Id 200 A at 25°C

Rds(on) max 4 mΩ at 100 A and Vgs 10 V

Gate drive options 4.5 V and 10 V for low Rds(on)

Vgs max ±20 V

Gate charge Qg max 57 nC at Vgs 10 V

Input capacitance Ciss max 5070 pF at Vds 30 V

Power dissipation 250 W at case temperature Tc

Operating junction temperature range -55°C to 175°C

Package DDPAK TO-263-3 surface mount

RoHS status ROHS3 compliant

Base product number CSD18542

Series NexFET

Supplier device package DDPAK TO-263-3

Mounting type surface mount

Packaging Tape and Reel TR

Key Advantages

Very low conduction loss thanks to 4 mΩ Rds(on)

Handles very high current up to 200 A for heavy-load applications

Wide gate voltage range and logic-level drive support 4.5 V for easy control by standard controllers

Fast switching with low Qg for higher efficiency and lower switching loss

High thermal headroom with 175°C max junction temperature

Robust package with large thermal tab for effective heat spreading

RoHS3 compliant for environmental requirements

Packaging

Tape and Reel TR

Key Advantages

Very low conduction loss thanks to 4 mΩ Rds(on)

Handles very high current up to 200 A for heavy-load applications

Wide gate voltage range and logic-level drive support 4.5 V for easy control by standard controllers

Fast switching with low Qg for higher efficiency and lower switching loss

High thermal headroom with 175°C max junction temperature

Robust package with large thermal tab for effective heat spreading

RoHS3 compliant for environmental requirements

Packaging

Type DDPAK TO-263-3 also referenced as TO-263-4 DPak 3 leads plus tab TO-263AA

Material copper leadframe with epoxy mold compound and tin-plated leads typical for RoHS3 compliance

Size standard TO-263 outline with large exposed tab for thermal dissipation consult the datasheet mechanical drawing for exact dimensions and land pattern

Pin configuration typical TO-263 mapping pin 1 Gate pin 2 Drain pin 3 Source exposed tab Drain always confirm with the datasheet

Mounting surface mount compatible with reflow soldering

Thermal characteristics large metal tab provides a low thermal path to the PCB supports up to 250 W at Tc with proper heat sinking copper area and thermal vias

Electrical properties Vdss 60 V Id 200 A Rds(on) 4 mΩ at 10 V gate Vgs max ±20 V Qg 57 nC Ciss 5070 pF Vgs(th) up to 2.2 V refer to datasheet for exact test conditions

Lifecycle

Status active and widely used in high-power designs not nearing discontinuation based on current industry availability

Equivalent or alternative models exact pin-compatible and performance-matched options depend on your required Rds(on) switching speed gate drive and footprint to avoid mismatches and redesign risk please contact our sales team via the Y-IC website for a curated list of TI NexFET and cross-brand D2PAK TO-263 alternatives

Key Application Areas

Synchronous rectification in high-current DC-DC converters

Primary and secondary side switching in power supplies

48 V class systems including telecom and industrial power conversion

Battery charging and power distribution for e-mobility light industrial and energy storage

High-current load switches and OR-ing circuits

Motor control H-bridge and half-bridge stages

Inverter and UPS subsystems where low conduction loss is critical

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for CSD18542KTT on our product page. We recommend downloading it now to get mechanical drawings recommended land pattern detailed electrical curves and application guidance.

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