Texas Instruments CSD18532NQ5BT

Mfr. Part

CSD18532NQ5BT

Manufacturer

Texas Instruments (Luminary Micro/Texas Instruments). Y-IC is a quality distributor for Texas Instruments and we are committed to delivering genuine products, fast logistics, and responsive technical support.

Detailed Description

N-channel power MOSFET, 60 V Vdss, 100 A Id (at 25°C), ultra-low Rds(on) 3.4 mΩ at Vgs 10 V, high-current NexFET series device in compact 8-VSON-CLIP (5 x 6 mm) package for high-density power designs. Optimized for 6 V and 10 V gate drive. Supports high power dissipation up to 156 W (Tc) with robust thermal path via clip/large drain pad. Surface-mount, RoHS3 compliant. Typical use in synchronous rectification, motor drive, battery systems, and telecom power. Current stock at Y-IC: 5890 pcs (subject to change).

Key Features

MOSFET type N-channel, single

Series NexFET high-performance power MOSFETs

Drain-source voltage Vdss 60 V

Continuous drain current Id 100 A (at 25°C, Ta reference per provided data)

Rds(on) max 3.4 mΩ at Id 25 A, Vgs 10 V

Gate charge Qg max 64 nC at Vgs 10 V

Input capacitance Ciss max 5340 pF at Vds 30 V

Gate-source voltage Vgs ±20 V absolute max

Gate drive targets 6 V and 10 V (best Rds(on) at 10 V, fast switching with adequate drive)

Power dissipation Pmax 3.1 W (Ta), 156 W (Tc)

Operating junction temperature range -55°C to +150°C (TJ)

Package 8-VSON-CLIP (5 x 6 mm), also referenced as 8-PowerTDFN

Mounting type Surface mount (SMT)

RoHS status RoHS3 compliant

Base product number CSD18532

Packaging Tape & Reel (TR)

Supplier device package 8-VSON-CLIP (5x6)

Key Advantages

Very low conduction loss with 3.4 mΩ Rds(on) reduces heat and boosts efficiency

High current handling (100 A class) supports heavy loads and fast transient response

Compact 5 x 6 mm footprint increases power density and saves PCB area

Clip-bonded VSON package provides a low thermal resistance path for high power dissipation

Wide Vgs range (±20 V) and strong avalanche capability contribute to rugged operation

Optimized for common gate-drive rails (6 V and 10 V) in modern power stages

RoHS3 compliance and lead-free finish support global environmental requirements

Packaging

Tape & Reel (TR)

Supplier device package 8-VSON-CLIP (5x6)

Key Advantages

Very low conduction loss with 3.4 mΩ Rds(on) reduces heat and boosts efficiency

High current handling (100 A class) supports heavy loads and fast transient response

Compact 5 x 6 mm footprint increases power density and saves PCB area

Clip-bonded VSON package provides a low thermal resistance path for high power dissipation

Wide Vgs range (±20 V) and strong avalanche capability contribute to rugged operation

Optimized for common gate-drive rails (6 V and 10 V) in modern power stages

RoHS3 compliance and lead-free finish support global environmental requirements

Packaging

Type 8-VSON-CLIP (also known as 8-PowerTDFN), surface mount

Body size approximately 5 x 6 mm, low profile

Construction molded epoxy over copper leadframe with drain clip for enhanced thermal/electrical performance (lead-free finish; exact finish per manufacturer documentation)

Pin configuration (typical for TI 5x6 SON-CLIP)

- Pins 1–3 Source

- Pin 4 Gate

- Pins 5–8 Drain

- Large exposed pad/clip tied to Drain for heat spreading and low impedance

- Always verify exact pinout in the datasheet before layout

Thermal characteristics

- Power dissipation 156 W (Tc), 3.1 W (Ta) as provided

- Very low junction-to-case path via drain clip for efficient heat removal

- Use ample copper and thermal vias on the drain pad area for best performance

Electrical properties summary

- 60 V Vdss, 100 A Id (25°C), Rds(on) 3.4 mΩ at 10 V, Qg 64 nC, Ciss 5340 pF, Vgs ±20 V

Shipping packaging Tape & Reel (TR) for automated assembly

Lifecycle

Status Generally active within TI’s NexFET portfolio. No end-of-life notice indicated in the provided data.

Risk of discontinuation Not indicated. For the most up-to-date lifecycle status, check our website or contact Y-IC sales.

Equivalent or alternative models For precise cross-reference (same voltage class, package, and similar Rds(on)/Qg), please contact our sales team. We will propose Texas Instruments NexFET 60 V 5 x 6 options and qualified cross-brands based on your electrical, thermal, and cost targets.

Key Application Areas

Synchronous rectification in high-current DC-DC converters (buck/boost)

Server, telecom, networking power supplies (48 V to PoL conversion)

Battery management and protection (e-bike, ESS, UPS)

Motor control and power tools (low-voltage BLDC/BDC stages)

Hot-swap, OR-ing, load switching for 24–60 V systems

Industrial automation, robotics, and automotive subsystems within 60 V domain (consult AEC-Q needs separately)

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for CSD18532NQ5BT on this product page. We strongly recommend downloading it here to confirm pinout, thermal parameters (RθJC/RθJA), safe operating area, and layout guidelines.

Request for Quotation Now

Ready to buy or need pricing and lead time? Visit our website and Get a Quote now. Limited Time Offer pricing may apply to current stock (5890 pcs available, subject to prior sale). Have design questions? Learn More on the product page or contact our sales team for fast support.