Texas Instruments AM3354BZCE60

Mfr. Part

AM3354BZCE60

Manufacturer

Texas Instruments (Luminary Micro/Texas Instruments, Sitara family)

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Detailed Description

32-bit ARM Cortex-A8 microprocessor, 600 MHz, Sitara AM335x series

298-ball BGA, 13 x 13 mm package, surface-mount

Integrated peripherals for connectivity, display, and security

RoHS3 compliant, lead-free

Operating junction temperature 0°C to 90°C

Ideal for human–machine interfaces, gateways, and embedded Linux/RTOS systems

Key Features

CPU and Performance

- ARM Cortex-A8 core, 600 MHz

- NEON SIMD engine for fast multimedia and math

- 32-bit architecture with memory management unit (MMU) for Linux/RTOS

Memory Interfaces

- LPDDR, DDR2, DDR3, DDR3L memory controller

Networking and I/O

- Ethernet 10/100/1000 Mbps x2 MACs

- USB 2.0 with integrated PHY x2

- Additional interfaces: CAN, I2C, McASP (audio), McSPI, MMC/SD/SDIO, UART

Graphics and Display

- 3D graphics acceleration enabled

- LCD controller and touchscreen support

Security

- Hardware cryptography support

- True random number generator

Power and I/O Voltages

- I/O rails supported at 1.8 V and 3.3 V

- Dynamic power management and low-power modes

Compliance and Series

- Sitara AM335x family

- RoHS3 compliant

Key Advantages

Balanced performance at low power for reliable 24/7 operation

Rich peripheral set reduces the need for extra chips and cuts BOM cost

Built-in graphics and LCD controller simplify HMI designs

Dual GbE ready MACs for high-throughput networking and industrial protocols

Mature software ecosystem: TI Processor SDK (Linux/RTOS), community support, and long-term availability

Pinand software-compatible options in the AM335x family enable easy performance and feature scaling

Secure features (crypto and RNG) help protect data and communications

Packaging

Package type: Ball Grid Array, 298-ball NFBGA/LFBGA

Size: 13 mm x 13 mm body

TI package family: ZCE (per part code), supplier device package 298-NFBGA (13x13)

Mounting: Surface mount

Material and finish: Lead-free, RoHS-compliant solder balls (SAC); organic substrate

Ball/pin configuration: 298-ball array; fine-pitch BGA suitable for high-density layouts; see datasheet for full ball map and signal groups

Handling and shipment: Tray packaging for assembly-line efficiency

Thermal characteristics:

- Operating Tj: 0°C to 90°C

- BGA allows heat spreading through PCB; use solid ground planes and thermal vias for best results

- Follow TI layout and power dissipation guidelines in the datasheet for accurate thermal modeling

Electrical properties:

- I/O voltage domains supported: 1.8 V and 3.3 V

- Core and PLL rails per TI power architecture (see datasheet for exact rails and sequencing)

- ESD and latch-up performance per JEDEC; observe recommended decoupling and sequencing

Lifecycle

Status: Active in production. Not nearing discontinuation as of the latest public information.

Longevity: Sitara AM335x is part of TI’s long-life embedded portfolio, widely used and supported.

Equivalent or alternative models:

- AM3352 series: Cost-optimized, typically without 3D graphics

- AM3354 variants: Different speed grades and packages within the same feature set

- AM3356/AM3357/AM3358/AM3359: Variants with combinations of PRU-ICSS, 3D GPU, and industrial Ethernet features; commonly used alternatives depending on required features and performance

- Note: Check package code and ball map for pin-to-pin compatibility. Some alternatives use different ball counts (e.g., ZCZ vs ZCE). Verify power rails and peripherals before drop-in replacement.

Need guidance finding a pin-compatible drop-in or second source: Contact Y-IC via our website. Our sales and FAE teams will help you select the best alternative for your design.

Key Application Areas

Human–machine interfaces (HMI), operator panels, and industrial displays

Industrial gateways, edge devices, and protocol bridges

Building automation controllers and smart energy systems

Test and measurement equipment and data loggers

Medical and lab instruments (non-automotive grade)

Retail POS terminals, kiosks, and printers

Audio terminals and intercoms using McASP/I2S

General embedded Linux/RTOS systems requiring Ethernet, USB, and display

Datasheet

The most authoritative and up-to-date AM3354BZCE60 datasheet is available on our Y-IC product page. Download it now for full electrical specs, ball map, power rails, layout rules, and software guidance.

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