Texas Instruments AM3354BZCE30

Mfr. Part

AM3354BZCE30

Manufacturer

Luminary Micro/Texas Instruments. Y-IC is a quality distributor for this brand and we will provide you with the best products and services.

Detailed Description

Sitara embedded microprocessor for industrial and general embedded use. ARM Cortex-A8 core at 300 MHz with rich connectivity and security. Package is 298-ball NFBGA, 13 x 13 mm. RoHS3 compliant. Mounting type is surface mount. Main category is Integrated Circuits (ICs). Small classification is Embedded - Microprocessors. Series is Sitara AM335x. Base product number is AM3354. Supplier device package is 298-NFBGA (13x13). Quantity in stock: 2586. Standard shipment package: Tube.

Key Features

Core processor: ARM Cortex-A8, 1 core, 32-bit

Speed: 300 MHz

Memory interfaces: LPDDR, DDR2, DDR3, DDR3L

Graphics acceleration: Yes

Display controllers: LCD, touchscreen

Security: hardware cryptography, random number generator

Ethernet: 2 ports, 10/100/1000 Mbps (as specified)

USB: two USB 2.0 with integrated PHY

Additional interfaces: CAN, I2C, McASP (audio), McSPI, MMC/SD/SDIO, UART

Co-processors: Multimedia, NEON SIMD

I/O voltages: 1.8 V and 3.3 V

Operating temperature (TJ): 0°C to 90°C

Mounting: surface mount

Compliance: RoHS3

Key Advantages

Balanced performance and power for cost-sensitive designs

Wide memory support for flexible BOM choices

Built-in graphics and display to simplify HMI and panel designs

Rich I/O set reduces need for external controllers

Hardware security accelerates cryptographic workloads

Dual Ethernet and multiple serial interfaces for gateway and networked devices

Mature Sitara ecosystem with tools, software, and long-term availability

Packaging

Type: BGA, 298-ball NFBGA; some documentation may refer to LFBGA for the same ball grid style

Material: organic substrate with molded encapsulation typical of BGA ICs

Size: 13 x 13 mm body

Pin configuration: 298-ball grid array; consult the datasheet for detailed ball map, pitch, and signal assignments

Thermal characteristics: junction temperature 0°C to 90°C; use good PCB thermal design and airflow for reliable operation

Electrical properties: I/O levels at 1.8 V and 3.3 V; 300 MHz CPU; memory interfaces for LPDDR/DDR2/DDR3/DDR3L

Mounting type: surface mount

Supplier device package: 298-NFBGA (13x13)

Shipment packaging: Tube

Lifecycle

Status: Active and widely used in Sitara AM335x designs; not nearing discontinuation based on current industry information

Equivalent or alternative models:

- AM3351: cost-optimized variant; feature set differs (review display/graphics)

- AM3352: similar class with adjusted peripherals

- AM3354: same base family; ensure exact suffix and package match

- AM3357: adds industrial communications features (PRU-ICSS in many variants)

- AM3358: higher feature set; commonly includes enhanced graphics

- AM3359: targeted for industrial Ethernet and fieldbus (PRU-ICSS in many variants)

- AM437x family: next-generation Sitara with higher performance and more peripherals (not pin-compatible; system redesign required)

Important: Feature sets vary by device. Check datasheets for pin compatibility, graphics, PRU-ICSS, and industrial protocol support. If you need guidance on equivalents, contact our sales team via the Y-IC website for detailed cross-references and availability.

Key Application Areas

Industrial HMI panels, operator interfaces, and touch displays

Factory automation, PLCs, and robotics controllers

Networked gateways, edge IoT nodes, and protocol converters

Smart meters, building automation, and energy management devices

Medical instrumentation and portable diagnostics

Point-of-sale terminals and kiosks

Audio and communication equipment using McASP/McSPI

Test and measurement equipment

Automotive aftermarket and telematics (non-safety critical)

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. We recommend downloading it directly from this page on our website for the latest, complete electrical, pinout, and design guidelines.

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