TI AC481-CB-J

Mfr. Part

AC481-CB-J

Manufacturer

Luminary Micro Texas Instruments

Y-IC is a quality distributor for Texas Instruments and Luminary Micro legacy products. We focus on genuine sourcing, fast delivery, and strong technical support to give you the best products and services.

Detailed Description

Specialized integrated circuit from TI in a high-density BGA package

Category Integrated Circuits ICs and class Specialized ICs

Package BGA high ball count reference 869

Description TI BGA package part code AC481-CB-J

Available quantity 2184 units ready for order

Key Features

High I O density for complex designs and rich peripheral mapping

Compact BGA footprint for tight PCB layouts

Lead-free and RoHS compliant manufacturing

Reliable TI supply chain and quality control

Designed for high-speed signal routing on multilayer PCBs

Supports advanced power and clock distribution schemes typical of TI specialized ICs

Compatible with automated SMT assembly and reflow processes

Clear ball grid orientation marks for easier placement

Key Advantages

Small size with many connections simplifies board design for feature-rich systems

Better electrical performance versus leaded packages lower parasitics and inductance

Strong thermal path through balls and vias for improved heat spreading on the PCB

TI ecosystem and documentation reduce risk and speed time to market

Stable sourcing via Y-IC with competitive pricing and global shipping

Ideal for scaling to high volume due to mature BGA assembly processes

Packaging

Type BGA Ball Grid Array high ball count package

Ball count reference 869 ball grid layout

Material Molded epoxy over organic substrate lead-free SAC alloy balls

Size Exact body size and height are defined in the datasheet typical BGA body sizes vary based on variant

Pin configuration Balls arranged in a regular matrix with corner and edge markers consult pin map in the datasheet for net assignment

Ball pitch Typical BGA pitch is in the 0.8 mm to 1.0 mm range confirm in datasheet

Thermal characteristics Thermal performance depends on PCB stackup copper planes and thermal vias typical Theta JA is board dependent see datasheet guidance

Electrical properties Low parasitic inductance supports high-speed signals ESD protection and I O drive levels are defined by the device family consult datasheet for voltage rails and timing

Packaging for shipment Standard moisture barrier bag with desiccant and humidity indicator MSL and bake preconditions noted on label follow JEDEC handling guidelines

Lifecycle

Current status No public end-of-life notice found for AC481-CB-J as of the latest check status can vary by region and lead time

Alternatives and equivalents Specific drop-in or functional alternatives depend on the target application and pin map for this BGA device

If you need compatible or functionally similar TI parts we can provide a curated cross reference on request

If an exact equivalent is required please contact our sales team via the Y-IC website for detailed matching and availability

Key Application Areas

Industrial control and automation PLC motion control drive systems

Embedded compute modules and gateways

Networking and communications baseboards and line cards

Consumer and prosumer electronics advanced controllers and hubs

Medical electronics monitoring and instrumentation non life-support

Automotive non safety-critical modules infotainment connectivity

Test and measurement equipment high-channel interfaces

IoT edge nodes and smart infrastructure devices

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for AC481-CB-J on our product page. We recommend downloading the datasheet here to check exact pin maps dimensions electrical limits and assembly guidelines.

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Limited Time Offer secure 2184 units while stock lasts and accelerate your build schedule