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Infineon Technologies
S29GL128S10DHB010 Image
Image may be representation.
See specs for product details.

Infineon Technologies S29GL128S10DHB010

Part Number: S29GL128S10DHB010
Manufacturer/Brand: Cypress Semiconductor (Infineon Technologies)
Part of Description: IC FLASH 128MBIT PARALLEL 64FBGA
Datasheets:
1.S29GL128S10DHB0.pdf ···

PCN Design/Specification

Mult Dev Mark REV 9/Jul/2018.pdf

PCN Assembly/Origin

Wafer Fab Site 04/Sep/2019.pdf

S29GL128S10DHB010 Page PDF

Download Details PDF
RoHs Status: ROHS3 Compliant
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Shipment Way: DHL / Fedex / TNT / UPS / EMS
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In stock: 42944 Pcs Stock

Ship From: Hong Kong

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  • Infineon Technologies S29GL128S10DHB010 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies S29GL128S10DHB010.
    Product Attribute Attribute Value
    Write Cycle Time - Word, Page 60ns
    Voltage - Supply 2.7V ~ 3.6V
    Technology FLASH - NOR
    Supplier Device Package 64-FBGA (9x9)
    Series Automotive, AEC-Q100, GL-S
    Package / Case 64-LBGA
    Package Tray
    Operating Temperature -40°C ~ 105°C (TA)
    Product Attribute Attribute Value
    Mounting Type Surface Mount
    Memory Type Non-Volatile
    Memory Size 128Mbit
    Memory Organization 8M x 16
    Memory Interface Parallel
    Memory Format FLASH
    Base Product Number S29GL128
    Access Time 100 ns
  • Returns Policy
    Returns must be requested within 60 days of the invoice date and include:
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    - Brief explanation or test report stating the reason for return
    Returns will not be accepted after 60 days. Returned items must be in original packaging and resalable condition. Returns due to customer errors at the time of quote or purchase will not be accepted. Contact customer service for return authorization before shipping.
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S29GL128S10DHB010 Product Details

Product Summary S29GL128S10DHB010 Parallel NOR Flash Memory

The Infineon S29GL128S10DHB010 is a 128 Mbit (16 Mbyte) parallel NOR flash memory device, forming part of the S29GL-S family, which spans densities from 128 Mb to 1 Gb. Engineered on 65-nm MIRRORBIT™ Eclipse process technology, the S29GL128S10DHB010 targets embedded applications requiring high reliability, rapid random access, and long-term data retention. It features a 16-bit parallel data bus and operates at a single 3.0 V supply, offering compatibility and versatility to designers in both industrial and automotive domains.

With its 64-ball FBGA package measuring 9x9 mm, as well as other package options across the series, the S29GL128S10DHB010 provides robust integration into compact PCB layouts. This device is ideal for code storage, data logging, and XIP (eXecute-In-Place) applications that benefit from fast read and effective write operations.

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Main Features and Unique Attributes of the S29GL128S10DHB010

The S29GL128S10DHB010 stands out due to a combination of advanced technical features:

MIRRORBIT™ Eclipse Technology: Allows for two bits per cell storage, balancing density and endurance.

Versatile I/O Power: Supports a wide range from 1.65 V up to Vcc, enabling interfacing with varied logic families.

Industrial and Automotive Qualification: Operating temperature ranges from -40°C up to +105°C, and compliance with AEC-Q100 quality standards.

Uniform Sector Architecture: 128 Kbyte uniform sectors simplify software management for code and data partitions.

Page Read and Write Buffer: Fast 32-byte page mode read and a 512-byte write buffer optimize both code execution and bulk data programming.

Automated Error Correction (ECC): Integrated ECC hardware provides single-bit error correction per 32-byte data page.

Advanced Sector Protection (ASP): Rich set of volatile and non-volatile program/erase protection features per sector.

20-Year Data Retention and 100,000 P/E Cycles: Suitable for long-lifecycle embedded applications.

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Structure and Memory Mapping of the S29GL128S10DHB010

At the core of the S29GL128S10DHB010 is a non-volatile flash memory array organized into a uniform sector structure, each sector being 128 Kbytes. The device employs a host interface controller (HIC) for bus transactions and an embedded algorithm controller (EAC) for managing programming and erase cycles. The array supports 16-bit word access, with every read cycle delivering a full word, and a wide address bus for seamless integration.

The address space supports:

Main Flash Array: For standard code/data storage, accessible via random and page read.

Factory Programmed ID and CFI Data: Allowing identification and interface parameter retrieval through JEDEC-standard methods.

Secure Silicon Region (SSR): A dedicated OTP (One Time Programmable) array for permanent and customer-programmed secure storage.

Sector Protection Registers: Including persistent and dynamic bits, password register, and lock register for advanced configurability.

Four device modes optimize system interaction: Read, Data Polling, Status Register, and Address Space Overlay (ASO) modes, granting easy access to configuration, status and secure memory spaces.

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Integrated Functions Programming, Erase, and On-Chip ECC in S29GL128S10DHB010

The S29GL128S10DHB010 leverages an embedded algorithm controller to offload complex flash management from the host processor. Programming and erasure are command-driven and automated:

Write Buffer Programming: Supports programming of up to 512 bytes in a single operation, greatly boosting throughput over traditional word-at-a-time methods.

Word Programming: Allows for single-word updates for flexible data control.

Erase: Sector erase for 128 Kbyte blocks or chip-level erase for full device wipes; both automated and verifiable.

Suspend/Resume: Both program and erase operations can be suspended and later resumed, optimizing responsiveness for time-critical embedded systems.

Automatic ECC: Each 32-byte data page is protected by hardware-calculated ECC, which corrects single-bit errors on reads, vital for automotive, industrial, and mission-critical applications.

Incremental programming is supported with the caveat that performing multiple program operations per page disables ECC for that page until the next sector erase, an important design consideration.

-

Data Security and Enhanced Sector Protection Methods for S29GL128S10DHB010

Robust data integrity and security are ensured through multiple overlapping mechanisms:

Power-up/Power-down Inhibit: The device ignores commands when Vcc is below the lockout voltage, safeguarding against accidental writes during voltage ramps.

Persistent and Dynamic Protection Bits (PPB/DYB): Non-volatile and volatile bits, respectively, allow fine-grained per-sector program/erase enable/disable.

Password Protection: Password mode secures the ability to change PPB bits, preventing unauthorized modification even under reset conditions.

Write Protect Pin (WP#): Provides hardware-level lockout on boundary sectors, enforced regardless of register configuration.

Lock Register (OTP): Stores configuration and security settings permanently, including selection between persistent and password protection modes.

Secure Silicon Region (SSR): 1024 bytes, subdivided into factory and customer programmable secure areas for critical configuration data or fingerprinting.

These multifaceted protection features are critical for firmware, boot code, or configuration data in systems requiring secure field or factory provisioning and in applications concerned with anti-tampering or regulatory compliance.

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Signal Compatibility and Packaging Selections for S29GL128S10DHB010

The S29GL128S10DHB010 features a 16-bit parallel interface, with address and data carried on separate pins for asynchronous, high-speed operation. Input/output voltage range is selectable, maximizing compatibility with both contemporary and legacy logic.

Ready/Busy# and reset signals are supported, ensuring reliable boot and power-cycle handling as well as facilitating system-level hardware reset and error recovery strategies.

Physical form factors include:

64-Ball FBGA (9×9 mm and 13×11 mm)

56-Pin TSOP and 56-Ball FBGA (9×7 mm)

This diversity ensures straightforward adoption into existing board layouts, whether for new designs or as a direct replacement for legacy flash memories.

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Electrical Characteristics and Timing Requirements of the S29GL128S10DHB010

The electrical profile is anchored by a 3.0 V ±10% supply (with I/O down to 1.65 V in some variants). Operating temperature options cover -40°C to +85°C (industrial) and up to +105°C (industrial plus and automotive). The device is RoHS3 compliant and REACH unaffected, removing environmental obstacles to global deployment.

Performance highlights:

Random Access Time: As low as 100 ns for word reads.

Page Mode Read: 15–30 ns subsequent accesses within the same 32-byte page.

Write/Erase Times: Write buffer programming cuts down effective programming times; sector erase is bounded by industry-standard timings.

Low-Power Modes: Automatic sleep and standby features minimize idle power, with active, standby, and reset current specifications suited for battery-powered and always-on systems.

Latch-up Immunity: Complies with JEDEC JESD78C standards.

For robust power system design, voltage ramp and supply sequencing are specified, and every package includes detailed decoupling and signal integrity recommendations.

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Design Guidelines and Application Notes for S29GL128S10DHB010

Engineers targeting the S29GL128S10DHB010 in embedded and automotive applications should be attentive to the following:

Interface Timing: Optimize for page mode reads and leverage the write buffer for time-critical programming.

Sector Management: Align partitioning to the 128 Kbyte sector structure for efficient erase cycles and effective use of the protection scheme.

ECC Use: Limit incremental word programming within the same page to preserve ECC advantage; consider full sector refresh if ECC must be re-enabled.

Security: Provision and document passwords and lock registers carefully—OTP programming is irreversible.

Board Integration: Match I/O voltage ranges and package footprints for drop-in compatibility with existing hardware and signal integrity constraints.

Automotive and Industrial Reliability: Leverage the extended temperature and AEC-Q100 qualifications for harsh environments and long-life deployments.

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Potential Alternatives or Substitutes for S29GL128S10DHB010

Within Infineon's portfolio, other S29GL-S family members are direct alternatives, differing in storage density while sharing bus, interface, and sector architectures:

S29GL256S: 256 Mbit version, if demands grow for additional code/data space.

S29GL512S: 512 Mbit, for extended data logging or richer feature code sets.

S29GL01GS: 1 Gbit, for large embedded filesystems or consolidation of multiple storage devices.

When considering replacements, ensure matching of sector architecture, bus width, package type, and temperature grade. For legacy designs transitioning from previous S29GL series generations, confirm compatibility regarding the CFI interface, command sets, and sector protection register handling.

-

Conclusion

: S29GL128S10DHB010 NOR Flash in Embedded System Design

The S29GL128S10DHB010 parallel NOR flash from Infineon exemplifies a highly adaptable and robust code and data storage solution for embedded designs. Its advanced protection, ECC, I/O versatility, and extended temperature/quality ratings position it as a flagship component for systems requiring reliable non-volatile memory under tough usage and regulatory demands.

With strong family continuity for scaling storage, rich protection and security features, and flexible hardware configurations, S29GL128S10DHB010 is a natural fit for automotive ECUs, industrial automation controllers, telecom infrastructure boards, and any product where firmware integrity and longevity are paramount. Proper architectural planning and understanding of its embedded operations will ensure optimal integration and system reliability.

User Review

  • Geor***cott

    Works fine as a signal component in timing circuits. No issues so far.

    May 12th, 2026

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    good communication

    May 8th, 2026

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    Reliable FPGA. Worked smoothly in my MCU + signal integration project.

    April 28th, 2026

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    April 17th, 2026

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    March 31th, 2026

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    Perfect replacement part. My system worked immediately after installation.

    March 23th, 2026

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    December 29th, 2025

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S29GL128S10DHB010 Image

S29GL128S10DHB010

Infineon Technologies

IC FLASH 128MBIT PARALLEL 64FBGA
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