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| Part Number: | K4M56323LE-EE1H |
|---|---|
| Manufacturer/Brand: | Samsung Electro-Mechanics |
| Part of Description: | K4M56323LE-EE1H SAMSUNG |
| Datasheets: | None |
| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Package | BGA |
| Series | - |
| RoHs Status | Lead free / RoHS Compliant |
| Condtion | New Original Stock |
| Warranty | 100% Perfect Functions |
| Product Attribute | Attribute Value |
|---|---|
| Lead Time | 2-3days after payment. |
| Payment | PayPal / Credit Card / Telegraphic Transfer |
| Shipping by | DHL / Fedex / UPS |
| Port | HongKong |
| RFQ Email | Info@Y-IC.com |




K4M56323LE-EE1H
Samsung Semiconductor
Y-IC is a quality distributor for Samsung Semiconductor products. We provide customers with the best products and services.
K4M56323LE-EE1H is a high-performance, specialized integrated circuit designed for cost-efficient computing solutions. It is optimized for memory applications where speed and reliability are critical. This IC belongs to the category of Specialized Hot ICs and meets demanding standards in advanced electronic systems.
BGA package for improved performance and miniaturization
High-speed data handling
Low power consumption
Reliable thermal performance
Robust electrical characteristics
Enhanced system reliability
Space-saving package
Excellent signal integrity due to ball grid array
Ideal for modern, compact electronic devices
Supports high-density applications
Type: Ball Grid Array (BGA)
Material: Solder balls on organic substrate
Size: Compact footprint suitable for dense PCB layouts
Pin Configuration: Multiple connection pins via balls for efficient electrical pathways
Thermal Characteristics: Efficient heat dissipation for stable operation
Electrical Properties: High signal integrity and low power loss
Currently active and in standard production
Not nearing discontinuation
If you need alternative or equivalent models, please see these options:
K4M56323LF-EE1H
K4M56323PE-EE1H
K4M51323PC-EE1H
For more alternatives, or if your requirements are not met, contact our sales team on our website for personalized assistance.
Mobile devices
Memory modules
Consumer electronics
Embedded systems
Industrial automation equipment
Telecommunications
The most authoritative datasheet for the K4M56323LE-EE1H is available on our website. Download the datasheet directly from this page to get the latest, detailed technical specifications.
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