Samsung Electro-Mechanics CL21C221JCANNND

CL21C221JCANNNND Samsung Electro-Mechanics MLCC Product Summary

The Samsung Electro-Mechanics CL21C221JCANNNND is a surface-mount, multilayer ceramic capacitor (MLCC) designed to provide exceptional electrical stability and reliability. With its 220 pF capacitance, 100V rated voltage, and C0G/NP0 dielectric in the industry-standard 0805 (2012 metric) package, this device is an optimal solution for engineers seeking precision, low-loss, and high-stability ceramic capacitors for both general and industrial-grade circuit designs.

As a member of Samsung's extensive MLCC portfolio, the CL21C221JCANNNND leverages advanced manufacturing and materials technology, making it suitable for use in environments that require stable capacitance and very low electrical losses over temperature and voltage variations.

-

Main Features and Electrical Specifications of CL21C221JCANNNND

At the heart of the CL21C221JCANNNND are key electrical characteristics critical to high-reliability applications:

Capacitance: 220 pF (picofarads), with a tight ±5% tolerance which supports precise frequency and timing applications.

Dielectric Type: C0G/NP0, ensuring minimal capacitance variation over temperature (0 ±30 ppm/°C) and negligible aging effects.

Voltage Rating: 100V DC, lending itself to midto high-voltage signal filtering and coupling/decoupling in communication and power electronics.

Dissipation Factor: Exceptionally low, with a high Q factor suitable for RF and precision analog circuitry where low loss is vital.

Insulation Resistance: Maintains high values, reflecting the superior insulation properties of C0G ceramics.

These features guarantee that CL21C221JCANNNND maintains consistent performance in demanding analog, high-frequency, and timing applications, supporting robust system operation even in fluctuating or harsh environments.

-

Manufacturing Information and Reliability Ratings of CL21C221JCANNNND

The CL21C221JCANNNND is built with a ceramic body and nickel-based internal electrodes, terminated with Cu/Ni/Sn to support reliable soldering under a variety of assembly conditions. This construction method is chosen to maximize mechanical robustness, electrical consistency, and compatibility with automatic surface-mount assembly techniques.

Samsung Electro-Mechanics classifies its MLCCs under several reliability levels; the CL21C221JCANNNND is available in their "Normal Standard" range, designed for mainstream electronic assemblies but distinguished by:

High Speed SMD Mounting Capability: Enables efficient process flow in automated manufacturing.

Effective DC Bias Characteristics: The device is engineered to avoid the capacitance losses typical of inferior dielectrics under DC bias.

Bending Strength: The construction passes a 2mm board bending test, confirming resilience to routine PCB stresses. For even harsher assembly conditions, families such as “High Bending Strength” variants are available.

By strictly adhering to reliability test standards, including voltage derating (where appropriate) and temperature/humidity cycling, the CL21C221JCANNNND demonstrates strong endurance against operational and environmental hazards.

-

Use Cases for CL21C221JCANNNND in Contemporary Electronic Devices

The CL21C221JCANNNND is widely used across a spectrum of advanced electronic platforms, including:

Consumer Devices: Smartphones, tablets, and game machines, where stable timing and filtering performance is necessary.

Computing: Laptops, HDD/SSD controllers, and board-level filtering.

Industrial and Power: DC-DC converters, displays, and control systems, requiring high voltage withstand and stable capacitance.

Communication: Network hardware, base stations, and server applications benefit from the MLCC's precise characteristics and reliable assembly compatibility.

In these environments, engineers rely on the C0G dielectric for circuits demanding stringent stability, such as clock lines, reference oscillators, high-frequency filters, and analog signal paths where voltage coefficient and aging effects must be minimized.

-

Guidelines for Handling, Assembly, and Design Integration of CL21C221JCANNNND

To achieve the full performance and reliability potential of the CL21C221JCANNNND, careful integration practices are essential:

Mounting Orientation: Aligning the MLCC's major axis parallel to expected PCB stress directions will help manage board flexing and avoid cracks.

Assembly Process: Automated pick-and-place is supported; nozzle pressure must be carefully controlled (≤300g.f) to prevent part damage.

Soldering: The terminations are designed for reliable lead-free (Sn-Ag-Cu) reflow and wave soldering, with clear limits for temperature and time profiles (not exceeding 260°C for 5sec in flow solder, or manufacturer-recommended profiles in reflow).

Board Design: Proper pad layout and land pattern minimize mechanical stress; excessive or insufficient solder should be avoided. Mechanical stress from PCB handling, depanelization, and adjacent component installation must be controlled.

Cleaning & Post-Assembly: Excessive ultrasonic or mechanical cleaning should be avoided to prevent cracks.

These insights ensure the CL21C221JCANNNND retains its electrical and mechanical integrity from incoming inspection to end-of-life, especially vital for high-volume automated assembly and miniaturized hardware.

-

Compliance with Standards and Environmental Properties of CL21C221JCANNNND

The CL21C221JCANNNND meets the latest industry standards and environmental regulations, enabling broad use in both global and restricted environments:

RoHS3 Compliant: Free of hazardous substances.

REACH Unaffected: No substances of very high concern.

Moisture Sensitivity Level: MSL 1 (unlimited floor life at ≤30°C/85% RH).

Export Classification: EAR99 (not restricted).

The device is also manufactured to safety and application guidelines relevant to consumer, industrial, and networking hardware, but its use in life-support, military, or other high-reliability/mission-critical applications must be separately verified or upgraded to a high-rel MLCC variant.

-

Packaging Options and Supply Chain Information for CL21C221JCANNNND

Samsung Electro-Mechanics supplies the CL21C221JCANNNND in tape-and-reel packaging compliant with IEC 60286-3, supporting fully automated SMD assembly lines. Standard tape sizes and reel diameters are available for compatibility with mainstream pick-and-place machinery. Box packaging ensures protection during global transit, with options for special requirements upon consultation.

Labeling includes full traceability—chip size, dielectric, nominal capacitance, lot and reel numbers, and quantity—streamlining inventory management and quality assurance. Storage recommendations specify ≤40°C and ≤70%RH, with a shelf life of six months to maintain optimal solderability.

-

Alternative or Substitute Models for CL21C221JCANNNND

When designing with CL21C221JCANNNND, engineers may consider the following alternatives if project constraints or supply chain needs dictate:

Samsung’s own high-reliability variants: For applications subject to severe environmental stress (e.g., outdoor base stations, automotive PCBs), consider the “High Level I” or “High Level II” offerings; similar capacitance and voltage ratings are available with strengthened moisture, temperature, and bending resistance.

High Bending Strength MLCCs: Samsung’s soft termination MLCCs enhance resistance to PCB flexure—suitable for PCBs with challenging mechanical reliability requirements.

Comparable C0G/NP0 0805 220pF 100V MLCCs from other global manufacturers, such as Murata, TDK, AVX/Kyocera, and KEMET. Thorough electrical, mechanical, and tape-and-reel equivalence confirmation is essential before substitution.

Suppliers often cross-reference Samsung CL21C221JCANNNND against these industry MLCCs; however, always confirm detailed specifications and evaluate on your target system, particularly regarding mounting robustness, moisture resistance, and tolerances.

-

Conclusion

The Samsung Electro-Mechanics CL21C221JCANNNND MLCC brings together precise capacitance control, strong voltage capability, minimal drift, and robust manufacturability in a compact 0805 SMD package, making it an ideal building block for today’s high-frequency, high-reliability, and miniaturized electronic assemblies. With comprehensive guidance on application, handling, and compliance—plus proven alternatives for more demanding environments—this device enables engineers and buyers to make informed, future-proof sourcing and design decisions in sophisticated electronics projects.