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| Part Number: | CL10B223KB8NNWC |
|---|---|
| Manufacturer/Brand: | Samsung Electro-Mechanics |
| Part of Description: | CAP CER 0.022UF 50V X7R 0603 |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.0072 |
| 200+ | $0.0029 |
| 500+ | $0.0028 |
| 1000+ | $0.0027 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Rated | 50V |
| Tolerance | ±10% |
| Thickness (Max) | 0.035" (0.90mm) |
| Temperature Coefficient | X7R |
| Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
| Series | CL |
| Ratings | - |
| Package / Case | 0603 (1608 Metric) |
| Package | Tape & Reel (TR) |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -55°C ~ 125°C |
| Mounting Type | Surface Mount, MLCC |
| Lead Style | - |
| Lead Spacing | - |
| Height - Seated (Max) | - |
| Features | - |
| Failure Rate | - |
| Capacitance | 0.022 µF |
| Applications | General Purpose |




The Samsung Electro-Mechanics CL10B223KB8NNWC is a high-reliability multilayer ceramic capacitor (MLCC) designed for demanding general-purpose and signal-processing applications. With a compact 0603 (1608 metric) surface-mount package, this device features a nominal capacitance of 0.022μF (22nF), rated for 50V, with X7R temperature stability and a ±10% tolerance. It is well-suited for use in compact circuits where space and thermal stability are critical, such as filters, coupling and decoupling applications in consumer electronics, industrial automation, and communication equipment.
The defining parameters of the CL10B223KB8NNWC include:
Capacitance: 0.022μF (22nF)
Tolerance: ±10%
Rated Voltage: 50V DC
Dielectric Type: X7R (Class II)
Package Size: 0603 (1608 metric)
Maximum Operating Temperature: 125°C
Compliance: EIA RS-198-1-F-2002
The X7R dielectric provides stable performance over a wide temperature range, making the capacitor suitable for circuits where moderate thermal variation is expected. The 0603 package enables high-density board assembly, essential in modern compact design environments.
Several core electrical attributes govern the performance of the CL10B223KB8NNWC in real-world applications:
Capacitance and Measurement: The device’s capacitance can vary based on measurement voltage and frequency. Standard measurement requires heat treatment at 150°C for 1 hour, followed by stabilization at room temperature for 24±2 hours. The capacitance is then verified at the specified voltage and frequency.
Dissipation Factor (DF): As a Class II X7R device, the CL10B223KB8NNWC’s dielectric loss is represented by a typical DF, important for applications where energy loss and distortion are considerations. For critical linearity and low-loss requirements, a Class I MLCC might be preferable.
Insulation Resistance: The capacitor exhibits high insulation resistance, but this must be measured after a 1-minute application of voltage to ensure accuracy, following the initial surge of charging current.
Capacitance Aging: X7R capacitors show a logarithmic decrease in capacitance with time and usage (“aging”), recoverable via heat treatment. Engineers should account for this phenomenon in precise analog or timing circuits.
X7R MLCCs such as the CL10B223KB8NNWC must be selected with temperature and bias characteristics in mind:
Temperature Coefficient of Capacitance (TCC): Capacitance stability is maintained between -55°C and 125°C, with variations within the ±15% range typical of X7R ceramics. However, real system temperatures and voltage bias can further influence these parameters.
Self-Heating: When subjected to high AC or pulse voltages, internal dissipation (ESR) may cause self-heating. Surface temperature rise due to this self-heating must not exceed +20°C, and the total temperature must stay below 125°C.
DC and AC Bias Effects: Applied DC and AC voltages both cause a reduction in capacitance, especially important for filter, timing, or tuning circuits in high-precision scenarios. System designers must assess these changes against system tolerances.
Derating Practices: To extend reliability, the applied operating voltage should be kept below the device’s rated voltage, especially at elevated temperatures.
The physical robustness of the CL10B223KB8NNWC enhances its suitability for automatic mounting and reflow soldering, provided that specific mechanical and environmental considerations are addressed:
Vibration and Shock: The capacitor is sensitive to excessive vibration and impact, particularly on miniaturized boards. Avoid board bending, resonance, and external stresses by strategic placement and support, particularly near board edges, cutouts, or screw holes.
Piezoelectric Effect: X7R (Class II) ceramics can generate audible noise at certain AC or pulse frequencies due to their piezoelectric nature. While not typically a concern in most digital circuits, noise-sensitive audio or analog applications may require additional design considerations.
Environmental Restrictions: The CL10B223KB8NNWC is not intended for high-reliability environments such as aerospace, automotive, military, or critical medical applications, nor for direct use in conditions exposed to moisture, corrosive gases, or extreme mechanical stress.
Reliability and performance are deeply influenced by soldering and mounting methods:
Soldering: Reflow soldering is strongly recommended, with peak temperatures not exceeding 260°C for up to 30 seconds. Hand-soldering and flow soldering require careful monitoring of preheat, thermal gradients, and application to avoid ceramic cracking.
Solder Paste and Flux: Uniform and appropriate solder thickness ensure adequate mechanical support and prevent stress concentrations. Use recommended lead-free solders such as Sn-3.0Ag-0.5Cu.
PCB Handling: During assembly and testing, support the PCB to minimize board flexure, particularly when using testing probes, cutting or separating panels, or inserting through-hole components.
Land Pattern: Design PCB pads according to manufacturer’s recommendations to optimize solder fillet and minimize mechanical strain.
Cleaning and Coating: Select low-residue, non-corrosive cleaning solutions and conformal coatings; mechanical stresses from ultrasonic cleaning or thermal contraction of resin coatings should be minimized through process controls.
The CL10B223KB8NNWC is offered in various tape-and-reel and box-packaging options, compliant with IEC 60286-3 standards for automated component handling. For storage and inventory:
Store at 0°C to 40°C and 0–70% RH to preserve solderability and prevent oxidation.
Use products within 6 months of delivery for optimal performance; inspect solderability before use if stored longer.
Protect from mechanical shock, vibration, rapid temperature changes, and exposure to corrosive environments.
When supply or design requirements mandate alternatives, consider other X7R, 0.022μF, 50V, 0603-size MLCCs from reputable manufacturers. Selection criteria should include:
Matching electrical specifications (capacitance, voltage, tolerance)
Equivalent package size and termination material compatibility
Similar or superior temperature coefficient and life-test performance
Compliance with international standards (EIA, IEC)
Brands such as Murata, TDK, AVX, and Yageo offer equivalent 0603 X7R MLCCs. Always validate suitability through a direct comparison of reliability test data, aging characteristics, and recommended mounting guidelines, and requalify the alternative in the context of the application environment.
The Samsung CL10B223KB8NNWC multilayer ceramic capacitor integrates industry-standard X7R dielectric performance with enhanced reliability in a compact 0603 package, making it a strong candidate for general-purpose filtering, coupling, and decoupling roles in high-density electronic assemblies. When evaluating the CL10B223KB8NNWC, procurement professionals and engineers should pay close attention to real-world influence factors such as voltage, temperature, mechanical handling, and storage conditions to maximize reliability and performance. Finally, always consider design flexibility by cross-referencing with compatible alternatives to secure supply chain robustness.
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CL10B223KB8NNWCSamsung Electro-Mechanics |
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