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| Part Number: | STTH806DTI |
|---|---|
| Manufacturer/Brand: | STMicroelectronics |
| Part of Description: | DIODE GP 600V 8A TO220AC INS |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.5422 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 3.6 V @ 8 A |
| Voltage - DC Reverse (Vr) (Max) | 600 V |
| Technology | Standard |
| Supplier Device Package | TO-220AC ins |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Series | - |
| Reverse Recovery Time (trr) | 30 ns |
| Package / Case | TO-220-2 Insulated, TO-220AC |
| Product Attribute | Attribute Value |
|---|---|
| Package | Tube |
| Operating Temperature - Junction | 175°C (Max) |
| Mounting Type | Through Hole |
| Current - Reverse Leakage @ Vr | 10 µA @ 600 V |
| Current - Average Rectified (Io) | 8A |
| Capacitance @ Vr, F | - |
| Base Product Number | STTH806 |




STMicroelectronics’ STTH806DTI is a 600V, 8A hyperfast recovery diode housed in a TO-220AC insulated package. As part of the TURBOSWITCH “H” family, this device consists of two 300V silicon dice in series and is targeted for use in continuous mode boost circuits and applications characterized by hard switching conditions. With its robust insulation (2500V RMS) and high-speed characteristics, the STTH806DTI addresses the requirements for efficiency, space optimization, and thermal flexibility in medium- and high-power designs.
The STTH806DTI brings together several features that leverage STMicroelectronics’ advanced diode technologies:
Hyperfast recovery: With a drastically reduced reverse recovery time, the STTH806DTI competes with silicon carbide (SiC) diodes in minimizing losses—crucially when paired with high-frequency MOSFETs.
High di/dt operation: Supports operation at high rates of change in forward current ($dI_F/dt$), making it well-suited for the demanding switching cycles in continuous-mode power factor correction (PFC) circuits and hard-switched converter topologies.
Reduced system size: Fast recovery characteristics allow for downsizing of associated MOSFETs and heatsinks, optimizing both cost and PCB layout.
Dual-diode, ceramic-insulated structure: Internal ceramic insulation ensures equal thermal conditions across both series diodes, supporting device reliability even under significant stress.
2500V RMS insulation: The insulated TO-220AC package allows mounting on a common heatsink with MOSFETs or on separate sinks, improving mechanical and layout flexibility.
Low package capacitance (7pF): Supports operation at high frequencies with minimal additional capacitive load on the power stage.
Dynamic and static current sharing: Designed to ensure robust balance between the two constituent 300V die, facilitating consistent operation across the rated range.
To fully assess the suitability of the STTH806DTI for a given application, engineers should consider the following quantified parameters:
Maximum continuous forward current (IF(AV)): 8A
Maximum reverse voltage (VRRM): 600V
Reverse recovery time (trr): Hyperfast, suitable for hard-switching and high PFC frequencies
Forward voltage drop (VF): Contributes directly to conduction losses, with detailed curves available for varying current levels
Package capacitance (C): 7pF, supporting high-speed operation
Maximum junction-case thermal resistance: Supports thermal calculations for heatsink selection
Power loss modeling: For conduction losses, use $P=1.7 \times IF_{(AV)} + 0.087 \times IF_{(RMS)}^2$ (with current in Amps)
Typical thermal and dynamic behaviors: Application notes provide curves for thermal impedance, recovery softness, dynamic charge, and forward/reverse recovery time across current and temperature
Engineers should reference the dynamic and thermal graphs to anticipate diode performance under ramped load, high-frequency, and varying thermal conditions—crucial for real-world power supply and converter design.
The STTH806DTI employs an insulated TO-220AC package, chosen for its balance of mechanical robustness, electrical insulation, and thermal conductivity. Highlights include:
Epoxy compound compliant with UL94 V0 flame retardant criteria
Lead-free (RoHS/ECOPACK compliant) assembly, per JEDEC JESD97 standards, suitable for environmentally controlled production
Optimized package dimensions to suit through-hole assembly and secure heat dissipation, with a recommended mounting torque of 0.4–0.6 Nm
Thermal insulation and equalized thermal conditions ensure safe operation even when the diode and switching MOSFET share a heatsink—supporting compact, high-density PCB layouts
The unique combination of speed, voltage, current, and insulation positions the STTH806DTI for use in a range of power electronic environments:
Boost diode in continuous mode PFC: The low reverse recovery time reduces switching losses in boost MOSFETs, enhancing overall efficiency particularly in high-power AC/DC front-ends.
Hard-switched converter topologies: Suitable for use in resonant converters, half-bridge, or full-bridge configurations where minimization of reverse recovery charge translates directly to enhanced robustness and lower EMI.
Industrial and consumer switched-mode power supplies (SMPS): Supports designers confronting stringent form factor and thermal management requirements.
Flexible thermal management: Insulated package enables the device to be used in configurations requiring both common or independent heatsinks.
For engineers and procurement teams considering alternatives to the STTH806DTI, it’s essential to match the combination of hyperfast recovery, 600V voltage class, 8A current rating, and TO-220AC insulation. Equivalent or replacement models may include:
Other hyperfast 600V, 8A diodes from major global manufacturers, provided they offer similar reverse recovery time, thermal ratings, and package insulation characteristics.
Silicon carbide (SiC) diodes rated for comparable voltage and current, though cost and availability may differ and mounting options may vary.
STMicroelectronics’ own TURBOSWITCH series offers multiple models with slightly differing voltage, current, and thermal properties for design optimization within similar platforms.
Component selection should always consider the end application’s switching frequency, available heatsinking, and system-level insulation needs.
The STTH806DTI from STMicroelectronics is a solution-oriented, high-performance, hyperfast diode for medium-to-high power electronics applications. Its insulated TO-220AC package, dual-diode structure, and hyperfast recovery enable not only the downsizing of system components but improvements in system efficiency, especially in PFC and hard-switched power conversion topologies. When compared with both traditional and SiC diode alternatives, the STTH806DTI offers engineers a robust and flexible option for demanding, space-constrained power designs, helping to deliver reliable operation and competitive production efficiency.
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