Renesas Electronics America Inc UPD70F3763GC-UEU-AX

Mfr. Part

UPD70F3763GC-UEU-AX

Manufacturer

Renesas Electronics Corporation

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Detailed Description

32-bit single-core V850ES/Jx3-U microcontroller

384KB on-chip Flash program memory

Approx. 48KB RAM (48K x 8)

100-pin LQFP surface-mount package

75 general-purpose I/O

Internal oscillator, up to 48MHz core speed

Supply voltage 2.85V to 3.6V

12-channel 10-bit ADC and 2-channel 8-bit DAC

Interfaces: USB, UART/USART, CSI, EBI/EMI, IC

Peripherals: DMA, PWM, Watchdog Timer (WDT), Low-Voltage Detection (LVD)

Operating temperature −40°C to +85°C (TA)

RoHS3 compliant

Base product number: UPD70F3763

Packaged in trays

Key Features

32-bit V850ES CPU core, up to 48MHz

384KB Flash, approx. 48KB RAM (48K x 8)

75 GPIO pins for flexible I/O

Mixed-signal: 12×10-bit ADC, 2×8-bit DAC

Connectivity: USB, UART/USART, CSI, EBI/EMI, IC

On-chip DMA, PWM, WDT, LVD

Internal oscillator for simple clocking

Industrial temp range −40°C to +85°C

2.85V–3.6V supply for low-power designs

100-LQFP, RoHS3 compliant

Key Advantages

Mature, reliable Renesas V850ES platform for embedded control

Rich peripherals reduce external components and BOM cost

DMA improves throughput and lowers CPU load

Generous 384KB Flash supports mid-size applications and updates

Low-voltage operation helps power-sensitive systems

Wide interface set eases system integration

Proven ecosystem and tools for faster development

Backed by Y-IC’s genuine sourcing and responsive support

Packaging

Type: Tray, suitable for automated SMT assembly

Package/Case: 100-LQFP (Low-Profile Quad Flat Package)

Material: Epoxy molding compound with copper leadframe; matte-tin plated leads; RoHS3 compliant

Size: Typical 100-LQFP body ~14×14 mm, thickness ~1.4 mm, lead pitch 0.5 mm (refer to datasheet for exact dimensions)

Pin configuration: 100 pins total; 75 GPIO; dedicated pins for power/ground, USB, UART/USART, CSI, EBI/EMI, ADC inputs, DAC outputs, PWM, reset, and clock

Thermal characteristics: Rated for −40°C to +85°C ambient; thermal performance depends on PCB copper, vias, and airflow; use solid ground planes and ample copper under the package to improve heat spreading

Electrical properties: 2.85V–3.6V supply, up to 48MHz core clock, internal oscillator; ADC 12×10-bit, DAC 2×8-bit; peripherals include DMA, LVD, PWM, WDT; connectivity USB, UART/USART, CSI, EBI/EMI, IC

Lifecycle

Status insight: The V850ES/Jx3-U family is mature. Availability can vary by region and time. Always check current status before new designs.

Direct drop-in equivalents: No publicly confirmed pin-to-pin drop-in alternatives are listed for UPD70F3763GC-UEU-AX.

Migration paths: Renesas RH850 (automotive), RX (32-bit), and RA (ARM Cortex‑M) families are common migration targets; these are not pin-compatible and require redesign.

Need an exact or alternative match: Please contact our sales team via the Y-IC website. We will help verify lifecycle status and propose the best equivalent or replacement options for your design.

Key Application Areas

Industrial control and automation

Motor control and PWM-driven power stages

Human–machine interfaces, keypads, and display controllers

USB device implementations and gateways

Data acquisition and logging (mixed-signal with ADC/DAC)

Sensor hubs and signal conditioning

Power systems monitoring with LVD

Building and home automation

Non under-hood automotive modules (body electronics) within −40°C to +85°C limits

Datasheet

Y-IC provides the most authoritative datasheet for this product on our website. Download the datasheet from this page to get exact pinouts, electrical specs, timing, and mechanical dimensions.

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