Renesas Electronics America Inc R7F701304EAFP-C#AA1

Mfr. Part

R7F701304EAFP-C#AA1

Manufacturer

Renesas Electronics Corporation

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Detailed Description

High-performance 32-bit automotive microcontroller from the RH850/P1M series. Runs at up to 160 MHz on the RH850G3M core. Includes 2 MB embedded Flash and 512 KB RAM (64K x 8), rich safety/peripheral set (LVD, POR, PWM, WDT), and wide automotive connectivity (CAN, FlexRay, LIN, PSI5, CSI, UART/USART). Integrated 24-channel 12-bit ADC for precise sensing. Packaged in 100-pin LQFP (14 x 14 mm) for surface-mount assembly. Operates from 3.0 V to 5.5 V. RoHS3 compliant. Ideal for body, chassis, and gateway ECUs.

Key Features

Core and performance: RH850G3M, single-core 32-bit, up to 160 MHz

Memory: 2 MB embedded Flash; 512 KB internal RAM (64K x 8)

Analog: 24-channel 12-bit ADC for multi-sensor inputs

Peripherals: LVD (low-voltage detect), POR (power-on reset), PWM, WDT (watchdog)

Interfaces: CAN bus, FlexRay, LIN bus, PSI5, CSI, UART/USART

Supply range: 3.0 V to 5.5 V for robust automotive power systems

I/O: 52 general-purpose I/O lines

Clocking: Internal oscillator

Package: 100-LQFP / 100-LFQFP (14 x 14 mm), surface mount

Compliance: RoHS3 compliant

Series: RH850/P1M

Base product number: R7F701304

Supplier device package: 100-LFQFP (14 x 14)

Shipment form: Tray

Key Advantages

Automotive-grade MCU designed for reliability, functional safety, and long-term availability

High processing headroom (160 MHz) for real-time control, gateways, and timing-critical tasks

Broad in-vehicle networking support (CAN, LIN, FlexRay, PSI5) for modern ECUs

Integrated 12-bit ADC and PWM enable accurate sensing and fine motor/actuator control

Wide operating voltage (3.0–5.5 V) simplifies power design across vehicle systems

Internal oscillator reduces external component count and BOM cost

Mature RH850 ecosystem, tools, and documentation lower development risk

RoHS3 compliance and lead-free package support global environmental requirements

Packaging

Type: 100-pin LQFP / LFQFP, surface mount; shipped in tray packaging

Material: Molded epoxy resin over copper leadframe; lead-free, RoHS3 compliant (halogen-free grades typically available)

Size: 14 mm x 14 mm body; standard LQFP thickness

Pin pitch and configuration: Quad-flat leads, typically 0.5 mm pitch; 100 total pins including multiple VDD/VSS, oscillator pins, debug/programming pins, analog inputs, and digital I/O

Mechanical characteristics: Low-profile QFP suitable for automated pick-and-place; coplanarity per JEDEC standards

Thermal characteristics: Thermal resistance depends on PCB design; LQFP packages generally require adequate copper area and vias for heat spreading. Follow Renesas thermal guidelines and the datasheet for θJA/θJC and derating curves.

Electrical properties: ESD protection structures on-chip (level per datasheet); Moisture Sensitivity Level per JEDEC (commonly MSL 3 for LQFP—verify label/datasheet); supports 3.0–5.5 V operation; IO tolerance and boot configuration detailed in datasheet

Lifecycle

Current status: Part of the RH850/P1M family, widely used in automotive applications. No public end-of-life notice was observed at the time of last review. Always confirm latest lifecycle updates directly.

Nearing discontinuation: No indication of near-term discontinuation was observed; verify current status before design-in.

Equivalent or alternative models:

- Same family, similar functionality (check flash size, RAM, package, temp grade, and suffix details):

- R7F701303 series variants (typically lower flash density; potential 100-LQFP options)

- R7F701304 family variants with different suffixes (temperature grade, calibration options, or minor feature variations; e.g., R7F701304EAFP-C#BA1, R7F701304EAFP-C#CA1; confirm exact differences)

- R7F701305 / R7F701306 series (often higher flash densities or extended features; package and pin-compatibility vary—confirm datasheet)

- Cross-family Renesas alternatives (not pin-compatible; evaluate feature parity):

- RH850/F1K or RH850/F1L families for body/control ECUs with CAN/LIN (FlexRay availability varies)

- RH850/D1M variants targeting instrumentation/cluster (strong display/peripheral focus)

- Non-Renesas automotive MCU alternatives (feature-comparable, not pin-compatible):

- NXP MPC574xP or MPC56xx families (Power Architecture; CAN/FlexRay-rich)

- Infineon AURIX TC27x/TC29x series (TriCore; high safety content, CAN/FlexRay)

- Important: Pin-compatibility and peripheral equivalence are not guaranteed. Verify memory size, operating voltage, package, peripheral support, and temperature grade for your requirements.

If you need exact drop-in replacements or lifecycle confirmation, contact our sales team via the Y-IC website for the latest, model-specific guidance.

Key Application Areas

Automotive body control modules (BCM), door/window/seat controllers

Chassis and safety ECUs (PSI5 sensor interface aligns with airbag/safety applications)

Gateway and domain controllers (multi-bus: CAN, LIN, FlexRay)

Motor and actuator control (PWM + ADC + real-time processing)

Instrumentation and HVAC controllers

Industrial control where automotive-grade robustness is beneficial

Datasheet

Y-IC provides the most authoritative and up-to-date datasheet for this model on our website. We recommend downloading the datasheet from this page to access pin maps, electrical specs, timing, thermal data, and design guidelines.

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