Renesas Electronics America Inc R7F7010404AFP-C#KA2

Mfr. Part

R7F7010404AFP-C#KA2

Manufacturer

Renesas Electronics Corporation

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Detailed Description

32-bit automotive-grade microcontroller from the RH850/F1L series, built on the RH850G3K core at 96 MHz. It integrates 768 KB embedded Flash, 32 KB EEPROM, and 96 KB RAM, plus rich on-chip peripherals for real-time control and in-vehicle networking. Supplied in a compact 64-LFQFP (10x10 mm) package for surface-mount assembly. Wide supply range (3 to 5.5 V) and extended operating temperature (-40°C to 125°C) make it suitable for harsh environments.

Key Features

Core and speed: 32-bit single-core RH850G3K, up to 96 MHz

Memory: 768 KB Flash, 32 KB EEPROM, 96 KB RAM

I/O: 49 general-purpose I/O lines

Communications: CANbus, LINbus, CSI (Clocked Serial Interface), SPI, UART/USART, Inter-IC (I2C)

Analog: A/D converters with 10 channels at 12-bit and 11 channels at 10-bit

Peripherals: DMA, low-voltage detection (LVD), power-on reset (POR), PWM, watchdog timer (WDT)

Oscillator: internal oscillator available (external clocking optional)

Power: 3 V to 5.5 V operation

Package: 64-LFQFP (10x10 mm), surface mount

Compliance: RoHS3 compliant

Series: RH850/F1L

Base product number: R7F7010404

Key Advantages

Designed for automotive and industrial reliability with -40°C to 125°C operating range

Integrated EEPROM reduces external memory needs and simplifies design

Rich communication interfaces enable robust in-vehicle and industrial networking

Deterministic real-time control with DMA, PWM, and watchdog improves system safety

Wide supply voltage range supports 3 V and 5 V systems without level translation

Large embedded Flash (768 KB) supports feature-rich firmware without external Flash

Low BOM and compact footprint with 64-LFQFP package

Stable long-term series (RH850) widely adopted in automotive control units

Packaging

Package / Case: 64-LFQFP (also referred to as 64-LQFP), body size about 10x10 mm

Supplier Device Package: 64-LFQFP (10x10)

Mounting: surface mount

Shipment packaging: tray (ideal for SMT pick-and-place)

Material: copper leadframe, epoxy mold compound, lead-free matte tin plating (RoHS3 compliant)

Pin configuration: 64 leads around the perimeter, pin 1 indicator, typical 0.5 mm pitch (LQFP64 standard); 49 GPIO plus dedicated pins for CAN/LIN, SPI, UART/USART, CSI, analog inputs, power and ground

Thermal characteristics: optimized for PCB heat dissipation via leadframe and copper areas; actual θJA depends on board stackup, copper pour, and airflow

Electrical properties: 3 to 5.5 V supply, robust ESD protection features integrated on I/O; internal oscillator reduces external components; designed for reliable operation across automotive temperature range

Lifecycle

Status: Generally available and widely used within the RH850/F1L family at the time of writing; not flagged as nearing discontinuation based on public information

Alternatives and equivalents: Pinand software-compatible options may exist within the RH850/F1L family (same RH850G3K core) with different Flash sizes, temperature grades, or package options. Exact cross recommendations depend on required memory, interfaces, and pinout

Next step: For a verified, detailed list of drop-in or software-compatible alternatives, please contact Y-IC via our website. Our team will match your requirements and provide vetted cross-references

Key Application Areas

Automotive body electronics: door modules, window lift, mirror control, seat control

HVAC and climate control units

Instrument clusters and switch panels

CAN/LIN gateways and network nodes

Small motor control and actuators (PWM-driven)

Industrial controllers and sensor hubs needing robust serial and analog interfacing

Datasheet

Y-IC hosts the most authoritative datasheet for this exact model on our product page. Visit our website and download the datasheet now to get full electrical specs, timing, pinouts, and design guidelines.

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