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| Part Number: | R5F100LGGFB#10 |
|---|---|
| Manufacturer/Brand: | Renesas Electronics Corporation |
| Part of Description: | IC MCU 16BIT 128KB FLASH 64LFQFP |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $1.9462 |
| 200+ | $0.7538 |
| 500+ | $0.7275 |
| 1280+ | $0.7143 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply (Vcc/Vdd) | 2.4V ~ 5.5V |
| Supplier Device Package | 64-LFQFP (10x10) |
| Speed | 32MHz |
| Series | RL78/G13 |
| RAM Size | 12K x 8 |
| Program Memory Type | FLASH |
| Program Memory Size | 128KB (128K x 8) |
| Peripherals | DMA, LVD, POR, PWM, WDT |
| Package / Case | 64-LQFP |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Number of I/O | 48 |
| Mounting Type | Surface Mount |
| EEPROM Size | 8K x 8 |
| Data Converters | A/D 12x8/10b |
| Core Size | 16-Bit |
| Core Processor | RL78 |
| Connectivity | CSI, I²C, LINbus, UART/USART |
| Base Product Number | R5F100 |




The R5F100LGGFB#10 MCU belongs to Renesas Electronics’ RL78/G13 family, integrating a 16-bit CPU core with a maximum operating frequency of 32 MHz. It features 128 KB of on-chip flash memory and is supplied in a 64-pin LFQFP package. This microcontroller addresses a wide range of general-purpose embedded applications requiring low power consumption, flexible memory configurations, and comprehensive peripheral support. Operating from a single power supply ranging from 1.6 V to 5.5 V, the device is ideal for consumer and industrial applications, providing extended ambient temperature tolerance from -40°C up to +85°C for consumer versions and up to +105°C for industrial grade variants.
The RL78 CPU core embedded in the R5F100LGGFB#10 MCU employs a CISC architecture with a 3-stage pipeline to optimize instruction throughput and execution efficiency. It supports a 1 MB address space and includes 32 general-purpose 8-bit registers arranged as four banks, improving context switching and interrupt handling. On-chip RAM is configurable between 2 KB and 32 KB depending on the specific variant.
The MCU provides 128 KB of code flash memory with 1 KB block sizes, equipped with security functions to prohibit unauthorized block erasure or rewriting. Notably, the flash supports self-programming capabilities including boot swap and flash shield window functions, facilitating firmware updates and safety. Data flash memory ranges from 4 KB to 8 KB with background operation capability, allowing the CPU to execute instructions concurrently during flash rewrite, thus optimizing system responsiveness. The data flash endurance is specified at one million rewrites under 1.8 V to 5.5 V voltage conditions.
Power efficiency is a hallmark of the RL78/G13 series, with the R5F100LGGFB#10 consuming as low as 66 μA/MHz during active operation. Specialized modes—HALT, STOP, and SNOOZE—further reduce power consumption for various low-power states. Remarkably, consumption drops to 0.57 μA during operations limited to RTC and LVD, showcasing suitability for battery-powered applications. The device integrates an on-chip power-on-reset (POR) circuit and a voltage detector (LVD) with configurable interrupt and reset thresholds selectable across 14 levels, ensuring stable operation over varying supply voltages.
This MCU integrates a diverse set of peripherals to streamline connectivity and control functions. A DMA controller with 2 to 4 channels enhances data throughput between peripherals and memory with minimal CPU intervention, enabling efficient real-time processing.
Communication interfaces include up to eight channels of simplified SPI (CSI) supporting both master and slave modes, with timing configurations suited for same and different potential communication levels (1.8 V to 5.5 V compatible). UART/UARTs are present with support for LIN protocol across 2 to 4 channels, enabling automotive and industrial network interfacing. I²C and simplified I²C interfaces ranging from 3 to 10 channels allow multi-master bus communications and flexible device addressing. Detailed timing and voltage level considerations support communication at varying potentials, an asset in mixed-voltage systems.
Additional timer hardware consists of multiple 16-bit timers (8 to 16 channels) and one 12-bit interval timer. An integrated calendar RTC supports a 99-year calendar with alarm and clock correction functions. The watchdog timer operates with a dedicated low-speed oscillator, bolstering system reliability.
The device supports various oscillator configurations including a high-speed on-chip oscillator selectable between 1 MHz and 32 MHz with ±1.0% accuracy over 1.8 V to 5.5 V and -20°C to +85°C. External oscillators X1 and XT1 also interface, with caution advised for oscillator stabilization times managed via user-accessible registers.
Operating voltage spans an extensive 1.6 V to 5.5 V range enabling versatile power management strategies. Absolute maximum ratings restrict pin voltages to 6.5 V, with specific cautions for the REGC pin grounding via a 0.47 to 1 μF capacitor. The device supports operation in industrial temperature ranges up to +105°C for G grade models.
Comprehensive DC and AC electrical specifications cover pin drive and input characteristics, current consumption in various modes, and detailed timing parameters for UART, SPI, and I²C interfaces, including special consideration for communication across different voltage domains. Such granularity aids engineers in precise system performance assessments and signal integrity planning.
The embedded analog capabilities feature an A/D converter with selectable 8- or 10-bit resolution operating from 1.6 V to 5.5 V, supporting 6 to 26 analog input channels depending on the package. Various reference voltage schemes are supported including external pins, on-chip internal references, and supply voltage references. The A/D characteristics, including integral and differential linearity and zero/full-scale errors, are quantified across operating voltages and extended temperature ranges, making this MCU suitable for precision sensor interfacing.
Temperature sensor and internal reference voltage monitors assist in system calibration and health monitoring. The POR and LVD circuits ensure robust response to power irregularities, protecting against brownout and supply fluctuations.
Renesas offers the R5F100LGGFB#10 MCU in multiple package types and pin counts, including plastic LFQFP (64 pins at 10×10 mm), LQFP, HWQFN, and VFBGA variants, spanning from 20-pin up to 128-pin formats. Each package variant supports consistent pin functions with certain peripheral function multiplexing available via the Peripheral I/O Redirection Register (PIOR). Careful attention is required when connecting the REGC pin (capacitive grounding recommended) and managing power/ground pin potentials to minimize internal noise in precision applications. Package mechanical drawings specify tight tolerances on lead centerlines and dimensioning for layout accuracy.
Within the RL78/G13 family, numerous part numbers exist differing mainly in flash memory size, pin count, and temperature rating. For applications requiring similar performance but different memory or package parameters, other models within this RL78 series can be considered. Selection engineers should consult the latest Renesas product page for updated part numbers and note any architectural or functional variations. The family’s common core and peripheral architecture ease migration across related MCUs, facilitating lifecycle management and inventory optimization.
The Renesas RL78/G13 R5F100LGGFB#10 MCU combines an efficient 16-bit architecture, extensive on-chip memory, and versatile peripheral sets with ultra-low power consumption ideal for a wide spectrum of applications from consumer electronics to industrial devices. Its flexible communication interfaces support robust networking in mixed-voltage systems, while precise analog capabilities meet demanding sensor integration requirements. Multiple packaging options ensure adaptability to various space and assembly constraints. Product selection engineers and procurement staff will benefit from this comprehensive understanding to optimize their design and sourcing decisions for projects demanding reliability, scalability, and energy efficiency.
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R5F100LGGFB#10Renesas Electronics America Inc |
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