UPI ASP1258QGJ-A

Mfr. Part

ASP1258QGJ-A

Manufacturer

UPI

Y-IC is a quality distributor of UPI products. We provide genuine parts, fast delivery, and professional service to help you build reliable designs.

Detailed Description

Application-specific integrated circuit (Specialized IC) from UPI

Main Category: Integrated Circuits (ICs)

Small Classification: Specialized ICs

Package: QFN

Package/Case: 831 (manufacturer’s case code)

Current stock: 1353 units available

Built for compact, high-density boards where thermal performance and small footprint matter

For exact electrical function and pinout, refer to the datasheet on our website

Key Features

QFN package for compact size and excellent thermal performance

Perimeter pads with an exposed thermal pad for better heat dissipation

Surface-mount design for automated assembly and high production yield

Designed for specialized, application-specific tasks to reduce external components

Low profile package suited to space-constrained products

Moisture-sensitive device; follow JEDEC storage and reflow handling (see datasheet)

ESD-safe handling recommended; use proper grounding and protective packaging

Package/Case code 831 helps ensure correct footprint and pick-and-place

Key Advantages

Saves board space while maintaining strong thermal performance

Simplifies your bill of materials by integrating application-specific functions

Improves reliability due to low parasitic inductance/resistance of QFN leads

Speeds time-to-market with a proven, ready-to-use IC form factor

Compatible with standard SMT processes for cost-effective manufacturing

Packaging

Type: QFN (Quad Flat No-Lead), surface-mount

Material: Molded epoxy over copper leadframe with exposed thermal pad

Size: Low-profile, compact footprint; exact dimensions per datasheet

Pin configuration: Flat perimeter pads plus a large center thermal pad for heatsinking

Thermal characteristics: Strong thermal path through the exposed pad to PCB copper; use thermal vias for best results

Electrical properties: Low lead inductance and resistance; short current paths improve signal integrity and power handling

Handling: Moisture-sensitive; store dry, follow JEDEC J-STD-033. Lead-free reflow per J-STD-020 (check datasheet for profile)

Shipping options: Typically tape-and-reel or tray for SMT; confirm with our sales team for current packing options

Lifecycle

Current status: No public end-of-life notice found as of today

If you need lifecycle confirmation, contact our sales team via the Y-IC website

Equivalent or alternative models: Specific drop-in or functional equivalents are application-dependent. Share your requirements and constraints (function, voltage/current ranges, pinout, thermal, compliance needs) and our team will propose suitable UPI or cross-brand options

Key Application Areas

Space-constrained electronics needing high thermal efficiency and reliable SMT packaging

Consumer devices, computing modules, industrial controllers, communications equipment

Power or control subsystems where an application-specific IC reduces external parts

Designs requiring robust thermal dissipation into PCB copper planes

Note: Verify suitability for safety-critical or automotive applications against datasheet and qualification standards

Datasheet

Our website hosts the most authoritative datasheet for ASP1258QGJ-A. Download it now from this product page to confirm electrical specs, pinout, package dimensions, reflow profile, and layout guidelines.

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