Microsemi Corporation AGL600V5-FG484I

Mfr. Part

AGL600V5-FG484I

Manufacturer

Microsemi. Y-IC is a quality distributor of Microsemi products and we will provide you with the best products and services

Detailed Description

IGLOO family flash-based FPGA, industrial temperature grade. 600k system gates, 13,824 logic elements, 110,592 total RAM bits, and 235 user I O. Low core voltage operation from 1.425 V to 1.575 V. Package is 484-ball Fine Pitch BGA sized 23 x 23 mm. Surface-mount device. RoHS non-compliant version for legacy and high-reliability use where leaded balls are required

Key Features

IGLOO series non-volatile flash FPGA. No external configuration memory needed, instant-on behavior

Industrial temperature range minus 40 to plus 85 degrees Celsius typical ambient

600,000 system gates and 13,824 logic elements for mid-density designs

110,592 total RAM bits for on-chip buffering and small memory blocks

235 general-purpose I O for wide peripheral connectivity

Core supply 1.425 V to 1.575 V for low power operation

484-ball FBGA package with compact 23 x 23 mm footprint

Surface-mount assembly compatible with standard reflow processes

IGLOO architecture known for low power modes such as Flash Freeze and instant resume

Non-volatile flash technology helps immunity to configuration upsets and supports quick power cycling

Key Advantages

Instant-on and no external configuration simplifies board design and reduces BOM

Low power architecture helps reduce heat and extend battery life in embedded systems

Industrial temperature grade supports harsh environments and reliable operation

High I O count and mid-density logic give balanced compute and connectivity for control and glue logic

Flash-based configuration improves security versus SRAM-based bitstreams stored off-chip

Long-term availability from a high-reliability FPGA family commonly used in industrial and defense markets

Packaging

Type Fine Pitch Ball Grid Array FBGA

Material Organic substrate with solder ball array. This device is RoHS non-compliant and typically uses tin lead ball alloy. Verify exact alloy in the datasheet

Size 23 mm x 23 mm overall body footprint

Pin configuration 484-ball array. 235 user I O pins available. Remaining balls are used for power, ground, and dedicated pins. See ball map in the datasheet for bank assignments and signals

Thermal characteristics Designed for operation from minus 40 to plus 85 degrees Celsius ambient. Thermal resistance depends on PCB, airflow, and heatsinking. For detailed theta JA and theta JC values consult the datasheet

Electrical properties Core voltage 1.425 V to 1.575 V nominal. I O support includes common single-ended and differential standards per IGLOO family. Bank level voltages and supported standards must be confirmed in the datasheet

Supplier device package 484 FPBGA 23 x 23 mm

Shipping package Tray for secure handling and automated pick and place

Lifecycle

Status IGLOO family devices remain widely used in industrial and high-reliability markets. Specific lifecycle status for AGL600V5-FG484I can vary by region and date. It is not confirmed as near discontinuation at this time

Alternatives within IGLOO same density or package family Examples AGL600V5 in other packages and temperatures, AGL600V2 variants. Check exact pinout and speed grade

Higher or newer family alternatives IGLOO2 M2GL010 and M2GL025 for more features and modern tooling SmartFusion2 M2S050 if integrated ARM and advanced features are desired ProASIC3 A3P060 and A3P125 for similar non-volatile flash FPGA options

Important Alternatives may not be drop in replacements. Pinouts, supply rails, timing, and I O standards differ. For a precise cross or drop-in suggestion please contact our sales team via the Y-IC website and we will match an exact equivalent or best-fit alternative

Key Application Areas

Industrial control, PLC, motor drive interfaces, and machine automation

Embedded system glue logic, bus bridging, and protocol conversion

Communications modules and network equipment requiring instant-on logic

Defense and aerospace COTS subsystems where non-volatile FPGAs are preferred

Medical equipment non-implant devices with reliable startup and low power

IoT gateways and edge devices that need fast boot and moderate logic density

Datasheet

Y-IC provides the most authoritative datasheet for this product model on our website. We recommend downloading the current datasheet on this page to confirm ball maps, timing, I O standards, and thermal data

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