Microchip Technology M2GL060TS-1FG676I

Mfr. Part

M2GL060TS-1FG676I

Manufacturer

Microchip Technology

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Detailed Description

IGLOO2 flash-based FPGA with 56,520 logic elements, 1,869,824 total RAM bits, and 387 user I/O

676-ball fine-pitch BGA package 27 mm x 27 mm for high pin density in compact footprint

Industrial temperature grade with reliable instant-on behavior and stable configuration storage in non-volatile flash

Surface-mount device optimized for low power and robust operation in demanding embedded systems

Key Features

IGLOO2 series FPGA base number M2GL060 density class

56,520 logic elements or cells for mid-range logic designs

1,869,824 total RAM bits for buffering and data processing

387 I/O pins for broad interface coverage

Supply voltage operating range 1.14 V to 2.625 V supporting multiple rails

Industrial junction temperature range -40 C to 100 C

Non-volatile flash-based fabric for instant-on and secure configuration retention

676-FBGA package 27 x 27 mm for high I/O and compact board area

RoHS non-compliant status clearly indicated for regulated applications

Surface-mount build for automated assembly

Key Advantages

Instant-on operation no external configuration memory needed

Non-volatile architecture improves reliability and security compared to SRAM FPGAs

High I/O count and rich internal RAM enable interface-heavy and data-centric designs

Wide voltage range simplifies power tree selection and supports multiple I/O standards

Industrial-grade temperature support for harsh environments

FBGA package provides strong electrical performance and efficient power and ground distribution

Packaging

Type 676-FBGA fine-pitch ball grid array suitable for high-density interconnect

Material organic substrate with overmold typical for FBGA class devices

Size 27 mm x 27 mm body fits space-constrained designs with high pin count

Pin configuration 676 balls total with 387 user I/O pins and remaining balls allocated to power ground and dedicated signals

Thermal characteristics junction temperature -40 C to 100 C FBGA aids heat spreading through PCB copper planes recommend good layout and thermal vias

Electrical properties supply range 1.14 V to 2.625 V supports separate core and I O rails low-leakage flash-based fabric enhances stability

Mounting type surface mount compatible with standard BGA reflow profiles

Shipment format tray for safe handling and automated pick-and-place

Lifecycle

Current status active and widely used in embedded and industrial markets not nearing discontinuation based on typical IGLOO2 family availability

Equivalent or alternative models within IGLOO2 family choose by density speed grade package or temperature grade

- Same density different package M2GL060TS-1FG484I 484-ball FBGA

- Same density similar variant M2GL060-1FG676I non-TS variant depending on feature set

- Lower density options M2GL025TS series for smaller logic designs

- Higher density options M2GL090TS and M2GL200TS series for larger designs

- Different speed or temperature grades variants with -1 or -2 speed and C or I temperature options

If you need exact pin-to-pin or form-fit-function matches across packages and grades or cross-reference to other families contact our sales team via the Y-IC website for detailed guidance

Key Application Areas

Industrial control and automation PLCs motor drives and safety systems

Communications and networking bridges and protocol converters with high I O

Transportation and rail signaling rugged embedded platforms

Power and energy systems metering protection and substation equipment

Defense and aerospace non-volatile instant-on control and interface logic

Medical and test instrumentation real-time control and data acquisition

IoT gateways and edge computing secure reliable platform with broad interfaces

Datasheet

Our website hosts the most authoritative datasheet and technical resources for M2GL060TS-1FG676I

We recommend customers download the datasheet directly from the current product page for complete electrical timing and configuration details

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