Microchip Technology M2GL060TS-1FGG484

Mfr. Part

M2GL060TS-1FGG484

Manufacturer

Micrel / Microchip Technology

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Detailed Description

IGLOO2 flash-based FPGA, base product number M2GL060

56,520 logic elements, 1,869,824 total RAM bits, 267 user I/O

Package/case: 484-FPBGA (23 x 23 mm), supplier device package: 484-FPBGA (23 x 23 mm), mounting type: surface mount

Operating junction temperature: 0°C to 85°C

Supply voltage: 1.14 V to 2.625 V

RoHS: ROHS3 compliant

Series: IGLOO2

Speed grade: -1 (standard performance)

Package: Tray

Typical availability: 2558 units in stock (subject to change)

Key Features

Non-volatile flash FPGA for instant-on operation (no external configuration memory required)

Mid-density logic with balanced on-chip RAM for control, bridging, and signal processing tasks

267 programmable I/O for broad interface coverage

Wide supply range for flexible power architecture

Robust clocking and timing resources with on-chip management

Low static power and efficient active power for cooler, quieter systems

ROHS3 compliant, lead-free manufacturing

Supported by Microchip’s Libero SoC design tools and IP ecosystem

Key Advantages

Instant-on startup improves system availability and simplifies power-up sequencing

Flash configuration increases reliability and immunity to configuration upsets compared to SRAM FPGAs

Simplified BOM by eliminating external configuration memory

Lower power consumption reduces thermal design complexity and system cost

Long lifecycle support typical of Microchip’s FPGA portfolio

Easy migration within the IGLOO2 family to scale logic density and I/O

Packaging

Type: Fine-Pitch Ball Grid Array (FPBGA)

Material: Molded encapsulation over organic substrate (industry-standard BGA construction)

Size: 23 mm x 23 mm body

Ball count: 484

Pin configuration: 267 user I/O balls, multiple dedicated power/ground balls, banked I/O architecture, and dedicated configuration/test balls per datasheet

Thermal characteristics: Junction temperature 0°C to 85°C; BGA form factor aids heat spreading; actual thermal performance depends on PCB, airflow, and heatsinking

Electrical properties: Supply 1.14 V to 2.625 V; logic elements 56,520; total RAM bits 1,869,824; low leakage typical of flash FPGAs

Mounting: Surface mount

Shipping: Tray packaging for assembly-line handling

Lifecycle

Current status: Active in the Microchip IGLOO2 portfolio; not nearing discontinuation based on current information

Equivalent or alternative models:

- Same IGLOO2 family, different densities: M2GL010, M2GL025, M2GL090, M2GL150 (choose based on logic/memory needs)

- Same family in other speed grades or packages: M2GL060 variants with different speed grades or BGA footprints may be available

- Feature expansion: SmartFusion2 family (e.g., M2S060) adds an ARM Cortex-M3 for designs needing an integrated MCU

- Higher performance or transceiver needs: Consider Microchip PolarFire family for more I/O bandwidth and advanced features

Pin-compatibility and exact replacements depend on package, speed grade, and bank configuration. For precise cross-reference and availability, contact our sales team via the Y-IC website.

Key Application Areas

Industrial control and automation (PLCs, motion control, robotics)

Networking and communications (protocol bridging, interface control, packet processing)

Embedded systems and IoT gateways needing low power and reliable configuration

Instrumentation, medical electronics, and test equipment

Aerospace and defense COTS systems where instant-on and configuration security are valuable

Consumer and commercial electronics requiring flexible logic and moderate I/O density

Datasheet

Y-IC provides the most authoritative datasheet for M2GL060TS-1FGG484 on our product page. Download it now to get complete electrical specifications, timing data, package drawings, and pin maps.

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