Microchip Technology M2GL050T-1FGG484I

Mfr. Part

M2GL050T-1FGG484I

Manufacturer

Micrel / Microchip Technology

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Detailed Description

IGLOO2 flash-based FPGA, mid-density device with 56,340 logic elements, 1,869,824 total RAM bits, and 267 user I/Os. Package is 484-FPBGA, 23 mm x 23 mm, surface-mount. Industrial temperature grade. Low power, instant-on, non-volatile fabric. RoHS3 compliant.

Key Features

IGLOO2 family, base part M2GL050, speed grade -1, industrial grade (I)

56,340 logic elements/cells for scalable logic designs

1,869,824 bits of embedded SRAM for buffering and data handling

267 I/O for wide interface coverage and expansion

Non-volatile flash-based FPGA fabric (no external configuration memory needed)

Instant-on behavior for fast startup

Wide supply support: core and I/O rails from 1.14 V to 2.625 V (typical rails include ~1.2 V core and 2.5/3.3 V I/O, per design)

Surface-mount BGA for high-density PCB designs

IGLOO2 architecture supports robust clocking, PLLs, and flexible I/O standards

RoHS3 compliant for environmental regulations

Key Advantages

Simplifies system design by removing external configuration memory and enabling immediate boot

Lower static power than SRAM-based FPGAs, ideal for power-sensitive and always-on systems

High reliability flash technology with strong immunity to configuration upsets

Industrial temperature support for harsh environments

Broad I/O count and flexible standards reduce the need for external glue logic

Mature ecosystem from Microchip with long-term availability and robust documentation

Secure-by-design approach typical of IGLOO2 family (non-volatile configuration helps resist tampering)

Tray packaging and standard BGA footprints ease automated assembly

Packaging

Type: 484-FPBGA fine-pitch ball grid array, surface-mount

Size: 23 mm x 23 mm nominal body

Ball count: 484 total balls

User I/O: 267 (remaining balls for power, ground, configuration, and dedicated functions)

Material: Organic laminate substrate with epoxy mold compound (typical for FPBGA)

Pin configuration: Grid-array pattern for high-density routing; power/ground balls distributed for stable power delivery

Thermal characteristics: Junction temperature -40°C to +100°C; BGA form aids heat spreading into PCB; use thermal vias/heatsinking as required by power profile

Electrical properties: Supply voltage range 1.14 V to 2.625 V across core and I/O rails per design; low static power due to flash-based fabric; supports common I/O standards such as LVCMOS and differential interfaces (see datasheet for full list)

Factory package/case references: 484-FPBGA (23x23), 484-BGA, Supplier Device Package 484-FPBGA (23x23)

Shipping package: Tray for safe handling in automated pick-and-place

RoHS: ROHS3 Compliant

Lifecycle

Status: Active and in production as part of Microchip’s IGLOO2 family; not near discontinuation based on current industry status

Close equivalents and alternatives (verify exact features, speed grade, and pinout for your design):

- Same family, similar density and package

- M2GL050-1FGG484I (variant without T option, same package)

- M2GL050T-2FGG484I (higher speed grade, same package)

- M2GL050T-1FGG676I (more balls for expanded I/O in 676 BGA)

- M2GL050T-1FCS325I (smaller BGA footprint, lower ball count)

- Same family, different densities in 484 BGA

- M2GL025T-1FGG484I (lower density)

- M2GL090T-1FGG484I (higher density)

- SoC FPGA alternative in same ecosystem

- M2S050T-1FGG484I (SmartFusion2 with integrated ARM Cortex-M3 plus FPGA fabric)

- Cross-vendor functional alternatives (not pin compatible; performance/features differ)

- Xilinx Artix-7 XC7A50T-1FGG484I/C

- Intel Cyclone V family devices near 50k logic range (e.g., 5CEFA5 series; confirm exact part, package, and I/O)

If you need strict drop-in or lifecycle confirmation, contact our sales team via Y-IC’s website. We will help you select pin-compatible or feature-matched parts and advise on long-term availability.

Key Application Areas

Industrial control and automation (PLC, motor control, protocol bridging)

Embedded communications and networking interfaces

Secure, instant-on systems that must boot deterministically

Test and measurement, data acquisition, and buffering

Aerospace and defense subsystems needing robust, non-volatile configuration

Medical and imaging equipment requiring reliable startup and stable operation

Embedded compute acceleration, sensor fusion, and real-time signal handling

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for M2GL050T-1FGG484I. Download it directly from this product page to get full electrical, timing, I/O standards, configuration, and design guidelines.

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