Microchip Technology M1AGL600V2-FGG144

Mfr. Part

M1AGL600V2-FGG144

Manufacturer

Microchip Technology (IGLOO family, Microsemi heritage). Y-IC is a quality distributor of Microchip brand products and we will provide you with the best products and services.

Detailed Description

Flash-based IGLOO FPGA, 600k system gates, 13,824 logic elements/cells, 110,592 total RAM bits, and 97 user I/O. Package is 144-ball Fine-Pitch BGA, 13 x 13 mm body. Commercial operating temperature 0°C to 70°C (TA). Core supply 1.14 V to 1.575 V. Surface-mount device. RoHS3 compliant. Series IGLOO. Base product number M1AGL600. Supplier device package 144-FPBGA (13x13). Tray packing. Main Category: Integrated Circuits (ICs). Small Classification: Embedded – FPGAs (Field Programmable Gate Array). Current available quantity: 2512 units in stock.

Key Features

Non-volatile flash FPGA architecture (instant-on, no external configuration memory)

Ultra low-power design with IGLOO FlashFreeze mode for fast entry/exit from low-power state

600k system gates, 13,824 logic elements/cells for flexible logic implementation

110,592 bits of embedded SRAM for buffers, FIFOs, and small memories

97 user I/O in a compact 144-ball FPBGA footprint

Commercial temperature range 0°C to 70°C

Core voltage range 1.14 V to 1.575 V

JTAG programming and debug support

Robust against soft errors compared to SRAM-based FPGAs

RoHS3 compliant, lead-free packaging

Surface-mount BGA for reliable assembly

Key Advantages

Instant-on operation simplifies system startup and control sequencing

Very low static and dynamic power, ideal for battery-powered and always-on designs

Single-chip solution reduces BOM and removes external configuration memory

Stable timing and high reliability from flash-based fabric

Compact 13 x 13 mm BGA footprint saves board space

Strong security and design integrity characteristics typical of flash FPGAs

Simplified power architecture and straightforward decoupling compared with high-end SRAM FPGAs

Packaging

Type: 144-ball Fine-Pitch BGA (FPBGA) and 144-LBGA variants noted for this device family

Body size: 13 x 13 mm as supplied (Supplier Device Package: 144-FPBGA 13x13)

Pin configuration: 144-ball grid with 97 user I/O; dedicated pins for power, ground, clock, JTAG, and configuration per device pinout

Material: Lead-free, RoHS3-compliant BGA package using industry-standard epoxy molding compound and BT substrate

Mounting: Surface mount (SMT), compatible with standard BGA assembly processes

Thermal characteristics: Low-power device with efficient heat spreading via BGA and PCB; rated for commercial ambient 0°C to 70°C; no external heatsink typically required in low-power use cases

Electrical properties: Core supply 1.14 V to 1.575 V; I/O banks support common single-ended and differential standards available in the IGLOO family (see datasheet for exact supported I/O standards, voltage levels, and bank rules)

Shipping: Tray

Lifecycle

Status: Active and mature. Not currently flagged as near discontinuation to our knowledge, but availability can vary by package and speed grade.

Equivalent or alternative models:

- Same density, same family: M1AGL600 variants in other packages or temperature grades (for example 144-ball LBGA or larger-ball-count packages; industrial-temperature options may be available)

- Other densities in IGLOO family: M1AGL125, M1AGL250, M1AGL1000, M1AGL2000, M1AGL3000 (resource counts and I/O vary)

- Newer generation alternatives: IGLOO2 family (for example M2GL010, M2GL020, M2GL050, and related), offering more logic, higher performance, and added features

- Comparable flash FPGA architecture: ProASIC3 devices such as A3P600 (check resources and package options)

Important: Verify pin compatibility, logic resources, I/O standards, voltage rails, and timing before substitution. If you need a drop-in replacement or a vetted cross-reference, please contact our sales team via the Y-IC website for the latest guidance.

Key Application Areas

Battery-powered and portable devices needing ultra low power and instant-on

System control, power sequencing, and glue logic

Industrial controllers, HMI panels, and sensor hubs

Consumer electronics with strict standby power limits

Communication interface bridging and protocol adaptation

Secure and reliable control logic where non-volatile configuration is preferred

Medical instrumentation and lab equipment

Automotive infotainment and accessories (commercial temp variants)

Smart meters, gateways, and IoT edge devices

Datasheet

Y-IC provides the most authoritative and up-to-date datasheet for this exact model on our product page. Download it here to get complete electrical specifications, ball maps, pin functions, programming flow, timing data, and application notes.

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