Microchip Technology EX256-TQG100A

Mfr. Part

EX256-TQG100A

Manufacturer

Micrel / Microchip Technology. Y-IC is a quality distributor of Micrel / Microchip Technology. We deliver genuine parts, fast service, and reliable support.

Detailed Description

Small FPGA for embedded use. 12k system gates, 512 logic elements, 81 I/O. 100-pin QFP (TQFP/LQFP) 14 x 14 mm. Industrial temperature -40°C to 125°C. Surface-mount. RoHS3 compliant. Base product number EX256. Series EX. Category Integrated Circuits (ICs), sub-category Embedded FPGAs. In-stock quantity 2501. Supplier device package 100-TQFP (14x14). Ships in tray packaging.

Key Features

12,000 system gates for compact designs

512 logic elements/cells for flexible logic building

81 user I/O lines for interfaces and control

Supply voltage 2.3 V to 2.7 V for low-power operation

Wide operating temperature -40°C to 125°C (TA) for harsh environments

100-pin TQFP/LQFP, 14 x 14 mm body for easy PCB integration

Surface-mount assembly for standard SMT lines

RoHS3 compliant, lead-free for global compliance

EX series family consistency and tool flow continuity

Tray packaging for safe handling and assembly

Key Advantages

Small, efficient FPGA for glue logic, control, and interface bridging

Low supply voltage helps reduce power and heat

Industrial temp range supports automotive and factory use

100-pin QFP footprint simplifies routing and rework compared to BGA

Proven Microchip lineage for long-term availability and reliability

Simple migration path within EX family

Y-IC provides fast delivery, quality assurance, and technical support

Packaging

Type: 100-pin QFP (listed as TQFP and LQFP), surface-mount

Body size: 14 x 14 mm nominal

Pin configuration: 4-sided gull-wing leads, 100 total pins, typical 0.5 mm pitch (check datasheet for exact pitch)

Material: Molded epoxy package with copper lead frame, lead-free finish (RoHS3)

Thermal characteristics: -40°C to 125°C ambient operation; use standard thermal design practices for QFP packages; derating depends on airflow and board copper (refer to datasheet for power and θJA)

Electrical properties: 2.3 V to 2.7 V supply, 81 I/O, 12k gates, 512 logic elements; I/O standards and timing per datasheet

Supplier device package: 100-TQFP (14x14)

Shipment packaging: Tray for stable placement and automated pick-and-place

Lifecycle

Current status: Not flagged as end-of-life in our listing. Availability can vary by region and date. Please confirm with our sales team for latest status.

Potential alternatives (not pin-compatible, specs vary; choose based on logic density, I/O count, package, and tools):

- Microchip IGLOO AGLN250 (low-power FPGA family)

- Microchip ProASIC3 A3P030/A3P060 (flash-based FPGA family)

- Lattice MachXO2-640/MachXO2-1200HC (non-volatile CPLD/FPGA crossover)

- Lattice iCE40LP1K/iCE40HX1K (low-power FPGA)

- Gowin GW1N-1/GW1N-2 (small-footprint FPGA)

- Xilinx Spartan-6 XC6SLX9 (larger density; different package options)

If you need a drop-in or feature-equivalent replacement, contact our sales team through the Y-IC website for an exact match and lifecycle guidance.

Key Application Areas

Industrial control, programmable logic controllers, sensor hubs

Automotive modules needing wide temperature tolerance

Embedded systems, microcontroller offload, protocol bridging

Consumer and IoT devices needing customizable logic

Power management sequencing and digital glue logic

Communications interfaces, bus translators, simple DSP blocks

Datasheet

Y-IC provides the most authoritative datasheet for EX256-TQG100A on our product page. We recommend customers download the datasheet here to get full specifications, timing, I/O standards, and design guidelines.

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