Microchip Technology EX256-PTQG100I

Mfr. Part

EX256-PTQG100I

Manufacturer

Micrel / Microchip Technology

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Detailed Description

Low-density, nonvolatile FPGA from the EX series (Actel heritage), 12k system gates, 512 logic elements/cells, 81 user I/O, industrial temperature, 2.3–2.7 V supply, 100-pin TQFP, RoHS3 compliant

Main Category: Integrated Circuits (ICs); Small Classification: Embedded FPGAs

Base Product Number: EX256

Available quantity in stock: 2641 units

Mounting Type: Surface-mount

Package: Tray

Key Features

Nonvolatile, instant-on architecture (no external configuration memory required)

12,000 system gates with 512 logic elements/cells for compact logic designs

81 user I/O in a 100-pin TQFP footprint (14 x 14 mm)

Industrial temperature range: -40°C to +85°C (TA)

Single low-voltage operation: 2.3 V to 2.7 V

RoHS3 compliant

EX series device for long-term stability and predictable behavior

Base product number EX256 for easy cross-reference

Surface-mount package suited for high-volume manufacturing

Key Advantages

Instant-on and deterministic startup for time-critical systems

Secure, one-time programmable architecture helps protect design IP

Simple power requirements with low-voltage operation

Robust reliability and stable performance over industrial temperature range

Small footprint TQFP enables easy PCB routing and lower assembly cost

Low static power compared to many SRAM-based FPGAs

No external configuration flash or boot sequence to manage

Packaging

Type: 100-TQFP (also noted as 100-LQFP), Tray packaging for production handling

Material: Standard molded epoxy package with copper leadframe (industry-standard TQFP construction)

Size: 14 mm x 14 mm body outline (nominal)

Pin configuration: 100 leads with 81 user I/O; remaining pins are power, ground, and dedicated device pins

Lead pitch: Standard TQFP pitch (check datasheet for exact mechanical dimensions and tolerances)

Thermal characteristics: Industrial operation (-40°C to +85°C TA); thermal performance depends on PCB layout and airflow; follow datasheet guidelines for θJA/θJC and heat dissipation

Electrical properties: 2.3–2.7 V device supply; I/O support for common low-voltage standards (e.g., LVCMOS/LVTTL—verify details in datasheet); ESD and latch-up protections per Microchip IC quality standards

Lifecycle

Status: EX family devices are legacy and many variants have limited availability. This part is not recommended for new designs in many cases.

Recommended alternatives from Microchip’s current nonvolatile FPGA families:

- ProASIC3: A3P060, A3P125 (similar low-density nonvolatile FPGAs; available in QFP/BGA packages)

- IGLOO: AGL060, AGL125; IGLOO nano: AGLN125 (ultra-low power, instant-on)

- IGLOO2: M2GL010, M2GL025 (modern nonvolatile architecture, richer features; mostly BGA, some QFP options depending on device)

- SmartFusion2: M2S005 (adds integrated microcontroller subsystem; for designs needing more capability)

Important note: Alternatives are usually not pin-compatible. For drop-in or footprint-compatible options, contact Y-IC via our website. Our sales team will help identify the best replacement and provide migration guidance.

Key Application Areas

Industrial control and automation (deterministic startup, stable behavior)

Motor drives and power management controllers

Automotive and transportation modules needing instant-on and reliability

Medical and instrumentation equipment

Communications interface bridging and glue logic

Secure supervisory and boot controllers

Aerospace and defense subsystems where nonvolatile, predictable operation is preferred

Datasheet

The most authoritative, up-to-date datasheet for EX256-PTQG100I is available on our website. We recommend downloading it directly from this page to get full electrical, mechanical, and programming details.

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