Microchip Technology EX128-TQG64

Mfr. Part

EX128-TQG64

Manufacturer

Micrel / Microchip Technology. Y-IC is a quality distributor of Micrel / Microchip. We provide authentic products, fast delivery, and dependable technical support to help you build better systems.

Detailed Description

Small, low‑density FPGA in a 64‑pin TQFP for general embedded logic. 46 user I/Os, about 6000 system gates, 256 logic elements/cells. Single low‑voltage supply 2.3 V to 2.7 V (2.5 V nominal). Surface‑mount, commercial temperature 0°C to 70°C. EX series, base product number EX128. RoHS3 compliant. Supplied in trays.

Key Features

64‑pin TQFP body 10 x 10 mm (supplier device package 64‑TQFP 10x10)

46 user I/O lines for flexible interfacing

Approx. 6000 system gates

256 logic elements/cells

Single low‑voltage operation: 2.3 V to 2.7 V

Operating temperature: 0°C to 70°C (TA)

Surface‑mount

RoHS3 compliant

EX series; base product EX128

Available packaging: Tray

Stock available: 2536 pcs (subject to change)

Key Advantages

Simple power: runs from a 2.5 V domain, easy to integrate

Small footprint: 10 x 10 mm TQFP fits tight layouts

Enough I/O for typical glue logic and interface bridging

Fast time‑to‑market: programmable logic avoids respins

Cost‑effective for low‑to‑moderate complexity designs

Lead‑free, RoHS3 compliant for modern compliance needs

Packaging

Type: TQFP/LQFP, 64 leads

Body size: 10 x 10 mm; low profile plastic package

Lead pitch: typically 0.5 mm (check datasheet for exact pitch)

Material: Molded epoxy encapsulation, copper leadframe; lead‑free matte‑tin finish

Pin configuration: 64 pins total; 46 user I/O; remaining pins for power, ground, configuration, and dedicated functions

Mounting: Surface‑mount (SMT), compatible with standard reflow

Thermal characteristics: Commercial temperature range 0°C to 70°C; actual thermal resistance depends on PCB and airflow (refer to datasheet for guidance)

Electrical properties: Core/I/O powered within 2.3 V to 2.7 V range; low‑voltage operation; consult datasheet for supported I/O standards, timing, and current limits

Shipment form: Tray packaging for automated assembly

Handling: Moisture sensitivity per standard plastic QFP practices (see datasheet for MSL and baking requirements)

Lifecycle

Status: The EX series is a mature line under Micrel / Microchip portfolios. Availability can vary by region and date. Not officially marked EOL at the time of listing, but considered legacy in many new designs.

Direct drop‑in equivalents: None confirmed for pin‑to‑pin compatibility.

Comparable alternatives (similar low‑density FPGA/CPLD options; not pin‑compatible):

- Microchip (Actel/Microsemi): IGLOO Nano family (e.g., AGLN060), ProASIC3 low‑density parts (e.g., A3P060)

- Lattice: MachXO2/MachXO3 small devices (e.g., MachXO2‑640), iCE40 LP/HX small densities (e.g., iCE40LP384)

- Intel (Altera): MAX II/MAX 10 small devices (e.g., EPM240, 10M02)

- AMD (Xilinx): CoolRunner‑II CPLDs (e.g., XC2C256) or small Spartan‑3/Artix‑7 parts in similar footprints

Important: For exact fit, pinout, timing, and power compatibility, contact our sales team via Y-IC’s website. We will match the best alternative for your board and timeline.

Key Application Areas

Glue logic between MCUs, sensors, and peripherals

Interface level shifting and simple bus bridging

I/O expansion and custom serial/parallel interfaces

Finite state machines and simple control sequencers

LED/indicator control and timing generation

Low‑power consumer and handheld devices

Industrial control, small automation modules, PLC add‑ons

Medical and laboratory instruments

Test fixtures, production testers, and rapid prototyping

Education and research projects needing compact programmable logic

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for EX128‑TQG64 on our product page. We recommend downloading the datasheet here to get full pinout, timing, power, programming, and assembly guidelines.

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