Microchip Technology EX128-PTQG64I

Mfr. Part

EX128-PTQG64I

Manufacturer

Micrel / Microchip Technology. Y-IC is a quality distributor for Micrel / Microchip Technology and we will provide you with the best products and services.

Detailed Description

Low-density FPGA, EX series, 256 logic elements/cells and about 6000 system gates, 46 user I/O, industrial temperature grade. 64-pin TQFP (10 x 10 mm) surface-mount package. Operates from a low 2.3 V to 2.7 V supply. RoHS3 compliant. Supplier device package 64-TQFP (10x10). Base product number EX128.

Key Features

EX series FPGA family

256 logic elements/cells

Approx. 6000 system gates

46 user-configurable I/O

Supply voltage 2.3 V to 2.7 V

Industrial temperature range -40°C to +85°C (TA)

64-pin TQFP (10 x 10 mm), also described as 64-LQFP

Surface-mount (SMD) mounting

RoHS3 compliant

Supplier device package 64-TQFP (10x10)

Tray packaging for production handling

Key Advantages

Small footprint 10 x 10 mm TQFP for compact designs

Low-voltage operation for reduced power

Industrial temperature rating for harsh environments

Balanced resource mix for control, glue logic, and interface tasks

Straightforward assembly with standard SMT processes

Proven brand support through Microchip (Micrel heritage) and Y-IC distribution

Packaging

Packaging type: Tray (ideal for volume manufacturing)

Package/case: 64-TQFP (10 x 10 mm body), commonly also referred to as 64-LQFP

Material: Molded epoxy package with copper leadframe; Pb-free finish (RoHS3 compliant)

Size: 10 x 10 mm body; standard low-profile TQFP outline

Pin configuration: 64 leads total with 46 user I/O; remaining pins for power, ground, configuration, and clocks

Lead pitch: Typical for 64-TQFP; confirm exact pitch in the datasheet for footprint design

Mounting: Surface mount, compatible with standard reflow profiles

Thermal characteristics: Industrial operating temperature -40°C to +85°C; use recommended thermal design to keep junction temperature within limits (see datasheet for thermal impedance and derating)

Electrical properties: VCC 2.3 V to 2.7 V; I/O banks designed for low-voltage operation (consult datasheet for supported I/O standards, drive strengths, and current limits)

Lifecycle

Current status: Not flagged as near end-of-life in the information provided. Actual lifecycle can vary by region and time. For the latest status, contact Y-IC.

Direct drop-in equivalents: No officially confirmed pin-to-pin replacements listed in our current database.

Potential alternatives (not guaranteed pin-compatible; verify carefully):

- Microchip low-density FPGAs of similar gate counts (for example, IGLOO/IGLOO-nano families)

- Lattice low-density devices (for example, MachXO or MachXO2 256-class devices)

These are examples for technical comparison only. Always review pinouts, power, timing, and configuration requirements before substitution.

If you need exact replacements or vetted alternatives, please contact our sales team via the Y-IC website for tailored cross-references and last-time-buy guidance.

Key Application Areas

Glue logic replacement and consolidation of discrete logic

Interface bridging and protocol adaptation

Industrial control, sensor hubs, and data acquisition front-ends

Motor control auxiliaries and timing/state machines

Consumer and embedded products needing small programmable logic

Low-power, space-constrained designs using TQFP footprints

Education, evaluation, and rapid prototyping of control logic

Datasheet

Y-IC provides the most authoritative datasheet for this product on our website. We recommend downloading the datasheet from the current product page to get full electrical limits, timing, configuration, pinout, and thermal data.

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