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| Part Number: | AGL600V2-FGG256I |
|---|---|
| Manufacturer/Brand: | Micrel / Microchip Technology |
| Part of Description: | IC FPGA 177 I/O 256FBGA |
| Datasheets: |
|
| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $313.0049 |
| 180+ | $124.8914 |
| 540+ | $120.719 |
| 990+ | $118.6568 |
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.14V ~ 1.575V |
| Total RAM Bits | 110592 |
| Supplier Device Package | 256-FPBGA (17x17) |
| Series | IGLOO |
| Package / Case | 256-LBGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 85°C (TA) |
| Number of Logic Elements/Cells | 13824 |
| Number of I/O | 177 |
| Number of Gates | 600000 |
| Mounting Type | Surface Mount |
| Base Product Number | AGL600 |




AGL600V2-FGG256I
Microchip Technology (Micrel heritage). Y-IC is a quality distributor of Microchip brands. We supply genuine parts and back them with reliable service, fast delivery, and technical support to help you select, design, and buy with confidence.
IGLOO-series low-power, non-volatile FPGA. 600k system gates, 13,824 logic elements/cells, 110,592 total RAM bits, 177 user I/O. Industrial temperature grade (-40°C to +85°C TA). 256-FPBGA (17 x 17 mm) surface-mount package. RoHS3 compliant. Core supply range 1.14 V to 1.575 V. Supplied in trays. Base product number AGL600.
IGLOO flash-based FPGA (non-volatile, no external configuration memory)
600,000 system gates; 13,824 logic cells; 110,592 RAM bits
177 user I/O in a 256-ball BGA footprint
Industrial temperature: -40°C to +85°C (TA)
Core voltage range: 1.14 V to 1.575 V (low-power operation)
Package: 256-FPBGA (17 x 17 mm), also referenced as 256-LBGA
Surface-mount assembly, RoHS3 compliant
IGLOO family known for low static power and quick configuration
Supplier device package: 256-FPBGA (17 x 17)
Non-volatile flash architecture: instant availability at power-up, no external config memory
Very low power consumption for battery-powered and always-on systems
High I/O count in compact BGA for dense designs
Industrial temperature support ensures reliability in harsh environments
Proven IGLOO ecosystem with mature tools and documentation
Simplified power design thanks to low core voltage range
Type: Tray (suitable for automated pick-and-place)
Package family: 256-FPBGA (fine-pitch ball grid array), also listed as 256-LBGA
Package size: 17 x 17 mm body
Ball count: 256 total balls with 177 user I/O available
Mounting: Surface mount (SMT), BGA provides efficient board space use
Material: Molded organic substrate typical of BGA packages; antistatic trays used for shipping
Thermal characteristics: BGA aids heat spreading through solder balls and PCB; observe board-level thermal design for -40°C to +85°C operation
Electrical properties: Core supply 1.14 V to 1.575 V; low-power flash FPGA fabric; verify I/O bank voltages and standards in the datasheet
IGLOO family devices have long-term support from Microchip. This specific model is commonly used in industrial designs and not generally flagged as near end-of-life at the time of writing.
Lifecycle status and regional availability can change. For the most accurate, current status, check our website or contact Y-IC sales.
Equivalent or alternative models:
- Same family/capacity variations: IGLOO AGL400, AGL1000 (different gate counts; not pin-compatible—verify)
- Same base family with different packages/grades: AGL600 variants in other BGA or QFN packages and commercial vs. industrial temperature grades (verify exact part codes and pinouts)
- Cross-family alternatives depending on requirements (not drop-in): Lattice iCE40 series (low-power), Intel MAX 10 (non-volatile CPLD/FPGA-like), Xilinx Spartan-6/Artix-7 (higher performance, volatile)
Important: Alternatives are typically not pinor tool-compatible. Always review datasheets, pinouts, timing, and power before substituting. If you need a direct, verified replacement list for AGL600V2-FGG256I, please contact our sales team via the Y-IC website for a curated cross-reference.
Industrial control and automation (state machines, sensor fusion, protocol handling)
Interface bridging and glue logic between microcontrollers and peripherals
Motor drivers and motion control timing logic
Power management sequencing and supervisory logic
Portable and battery-powered devices needing ultra-low power programmable logic
LED/LCD control, display timing, and light engine control
IoT edge devices requiring deterministic hardware acceleration with low energy use
Communications modules: simple SERDES and parallel bus adaptation (verify supported I/O standards)
Y-IC hosts the most authoritative datasheet and technical resources for AGL600V2-FGG256I on our product page. We recommend downloading the datasheet here to get full pinouts, electrical limits, timing, configuration details, and design guidelines.
Ready to buy or budget your build? Get a Quote on Y-IC now. Learn More about availability and lead times. Limited Time Offer: secure pricing and stock on 1600 units today.
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