Microchip Technology A3P600-FG144

Mfr. Part

A3P600-FG144

Manufacturer

Micrel / Microchip Technology

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Detailed Description

ProASIC3 flash-based FPGA, 600k system gates, 97 user I/O, 110,592 RAM bits. Package is 144-FPBGA (13 x 13 mm), also referenced as 144-LBGA. Core supply 1.425 V to 1.575 V. Commercial temperature 0°C to 85°C (TJ). Surface-mount. Tray packaging. RoHS non-compliant. In-stock quantity: 2606. Base product number: A3P600. Series: ProASIC3.

Key Features

Flash-based, non-volatile FPGA (no external configuration memory)

Instant-on and live-at-power-up behavior

600,000 system gates

97 I/O in the 144-ball package

110,592 bits of on-chip RAM

Single low core voltage: 1.425 V to 1.575 V

ProASIC3 architecture designed for low power

Common I/O standards support (see datasheet for full list)

JTAG support for programming and test

Global clock and PLL resources (refer to datasheet)

Key Advantages

Fast power-up with no boot delay

Simplifies BOM and board design by removing external configuration flash

Lower static and dynamic power than SRAM-based FPGAs in many cases

Non-volatile configuration improves reliability and data retention

Stable architecture suitable for long-life industrial designs

Packaging

Type: 144-FPBGA (Fine-Pitch Ball Grid Array)

Body size: 13 x 13 mm

Alternate package naming: 144-LBGA

Mounting: Surface Mount (SMT)

Delivery: Tray

Material: Molded plastic FBGA on organic substrate (standard for FBGA)

Pin configuration: 144 solder balls total; 97 user I/O; remaining balls for power, ground, clock, configuration, and JTAG

Thermal characteristics: Operating junction temperature 0°C to 85°C (commercial grade); thermal performance depends on PCB layout, copper planes, and via density under the device; follow datasheet layout and thermal guidelines

Electrical properties: Core supply 1.425 V to 1.575 V; on-chip RAM 110,592 bits; ProASIC3 fabric; RoHS status: non-compliant; see datasheet for I/O bank voltages and supported standards

Lifecycle

Current status: Available, but lifecycle and availability may vary by region and by RoHS requirements. Non-RoHS variants can have limited production or special-order status.

Equivalent or alternative models:

- Same family, similar package options: A3P250-FG144, A3P400-FG144, A3P1000-FG144 (check pinout, I/O banking, timing, and power in datasheets)

- Newer flash FPGA families from Microchip for migration: IGLOO (e.g., AGL600-FG144) or SmartFusion2 (M2S series; package/pinout differ)

- Pin compatibility across ProASIC3 densities in FG144 may be possible for some designs; verify carefully against the datasheet and pin assignment tools

If you need a confirmed drop-in replacement or lifecycle guidance, please contact our sales team via the Y-IC website for the latest status, stock, and tailored alternatives.

Key Application Areas

Industrial control and automation (PLC interfacing, motor control)

Communications and networking glue logic, bus bridging, protocol conversion

Consumer and commercial electronics requiring instant-on behavior

Power sequencing and system management logic consolidation

Medical, instrumentation, and test equipment (commercial temp range)

Embedded soft-core microcontroller implementations within FPGA fabric

Datasheet

Our Y-IC product page hosts the most authoritative datasheet and technical resources for A3P600-FG144. Download the datasheet here to get full pinouts, electrical limits, timing data, configuration details, and application notes.

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