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| Part Number: | A3P600-1FGG484I |
|---|---|
| Manufacturer/Brand: | Micrel / Microchip Technology |
| Part of Description: | IC FPGA 235 I/O 484FBGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.425V ~ 1.575V |
| Total RAM Bits | 110592 |
| Supplier Device Package | 484-FPBGA (23x23) |
| Series | ProASIC3 |
| Package / Case | 484-BGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Number of I/O | 235 |
| Number of Gates | 600000 |
| Mounting Type | Surface Mount |
| Base Product Number | A3P600 |




A3P600-1FGG484I
Micrel / Microchip Technology. Y-IC is a trusted, quality distributor for Microchip brands. We focus on genuine parts, stable supply, and fast service to deliver the best products and support to you.
ProASIC3 flash-based FPGA, 600k system gates, 235 user I/Os, 110,592 RAM bits, 484-FPBGA (23 x 23 mm), industrial temperature grade. Core supply 1.425 V to 1.575 V. Surface-mount BGA package. RoHS3 compliant. Series: ProASIC3. Base product number: A3P600. Supplier device package: 484-FPBGA (23x23). Quantity available: 2584 units (tray packaging).
Flash-based, non-volatile FPGA (no external configuration memory required)
Instant-on behavior for fast system startup
600,000 system gates for mid-density designs
235 user I/Os for broad connectivity
110,592 bits of on-chip RAM for buffering and data handling
Industrial temperature range (Tj -40°C to +100°C)
Low core voltage operation (typical 1.5 V) reduces power
ProASIC3 architecture supports common I/O standards (LVCMOS, LVTTL, LVDS, PCI signaling in supported banks)
Robust security features typical of ProASIC3 family (flash configuration, anti-tamper options)
RoHS3 compliant and lead-free manufacturing
Non-volatile flash FPGA: simpler BOM, faster boot, higher reliability vs. SRAM FPGAs
Lower power and heat vs. comparable SRAM-based devices
Strong security and instant-on make it ideal for control, power sequencing, and safety-critical startup
Industrial-grade temperature for harsh environments
Mature ecosystem with proven tools and application notes
Stable long-term supply from Microchip through Y-IC’s quality distribution
Type: 484-FPBGA (Fine-Pitch Plastic Ball Grid Array), surface mount
Material: Molded plastic over organic substrate (standard FPBGA construction), lead-free balls
Size: 23 mm x 23 mm body outline (supplier device package 484-FPBGA 23x23)
Pin configuration: 484-ball grid array, 235 user-accessible I/Os plus dedicated power, ground, and configuration pins
Thermal characteristics: Junction temperature operating range -40°C to +100°C (Tj). Actual thermal performance depends on PCB design, airflow, and heatsinking. Device’s low power helps minimize heat.
Electrical properties: Core supply 1.425 V to 1.575 V (typical ~1.5 V). Total RAM 110,592 bits. 600k system gates. I/O banks support common single-ended and differential standards per ProASIC3 family guidance.
Shipment: Tray packaging for assembly-line efficiency and device protection
Status: Mature and actively supported by Microchip. Not currently at end-of-life for typical industrial use.
Direct equivalents and close variants within the same family:
- A3P600-1FGG484C (Commercial temp grade, same package, similar performance)
- A3P600-2FGG484I (Higher speed grade -2 in same package, industrial temp)
- A3P600-1FGG256I (Same density, fewer balls and I/Os, smaller footprint)
- A3P250-1FGG484I (Lower density alternative for cost/power reduction)
- A3P1000-1FGG484I (Higher density alternative for more logic resources)
Alternative Microchip families for similar use cases:
- IGLOO AGL600-FG484I (Low-power flash FPGA, similar density)
- SmartFusion2 M2S series (FPGA + advanced security and hard IP; choose a density near 600k gates as needed)
If you need a pin-compatible or function-equivalent match not listed, contact our sales team via the Y-IC website for detailed cross-references and availability.
Industrial control systems and PLC add-on logic
Motor control, power sequencing, and protection
Communications equipment, protocol bridging, and glue logic
Medical instrumentation and imaging control
Automotive and transportation subsystems (industrial grade)
Secure boot, configuration control, and system supervision
IoT gateways, edge devices, and custom interfaces
Aerospace and defense subsystems (where industrial-grade is acceptable)
Y-IC provides the most authoritative, up-to-date datasheet for A3P600-1FGG484I on our product page. For complete electrical specs, pinouts, timing, and design guidelines, download the datasheet directly from our website now.
Get a Quote today on Y-IC! Limited Time Offer—secure your pricing and delivery. Learn More and submit your RFQ now to lock in availability and support from our expert team.
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A3P600-1FGG484IMicrochip Technology |
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