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| Part Number: | TPS2052D |
|---|---|
| Manufacturer/Brand: | Texas Instruments |
| Part of Description: | IC PWR SWITCH N-CHAN 1:2 8SOIC |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.7021 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply (Vcc/Vdd) | Not Required |
| Voltage - Load | 2.7V ~ 5.5V |
| Switch Type | General Purpose |
| Supplier Device Package | 8-SOIC |
| Series | - |
| Rds On (Typ) | 80mOhm |
| Ratio - Input:Output | 1:2 |
| Package / Case | 8-SOIC (0.154', 3.90mm Width) |
| Package | Tube |
| Output Type | N-Channel |
| Product Attribute | Attribute Value |
|---|---|
| Output Configuration | High Side |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Number of Outputs | 2 |
| Mounting Type | Surface Mount |
| Interface | On/Off |
| Input Type | Non-Inverting |
| Features | Status Flag |
| Fault Protection | Current Limiting (Fixed), Over Temperature, UVLO |
| Current - Output (Max) | 500mA |
| Base Product Number | TPS2052 |




The TPS2052D from Texas Instruments is a dual-channel, high-side power-distribution switch designed for robust load management across a variety of electronic systems. Implemented in an 8-pin SOIC package, the TPS2052D integrates two n-channel MOSFET switches, each capable of handling up to 500 mA of continuous current. Its feature set targets demanding applications such as USB power distribution, hot-plug device interfaces, and systems requiring reliable protection under capacitive load and fault conditions. The TPS2052D is engineered for use in voltage domains ranging from 2.7 V to 5.5 V and can withstand ambient temperature ranges from –40°C to 85°C.
At the core of the TPS2052D are two high-side 135 mΩ-max n-channel MOSFET switches. Each channel is independently enabled via logic-level inputs compatible with both TTL and CMOS standards, facilitating straightforward integration into standard microcontroller or FPGA designs. The device includes an internal charge pump, allowing operation from low supply voltages and delivering sufficient gate drive for fast switching transitions. Carefully controlled output rise and fall times (2–4 ms, typical) minimize EMI and reduce inrush current, a critical requirement for both power-sensitive and hot-plug applications.
Key functional blocks include:
Driver circuitry that manages MOSFET gate transitions for EMI reduction
Current sense functionality via a dedicated sense FET, enabling accurate overload detection without adding significant series impedance
Enable circuitry to reduce standby power consumption (<10 μA typical) when disabled
Overcurrent (OCx) open-drain outputs, providing active-low fault signaling for integration into system-level fault-handling mechanisms
Designed for robust performance, the TPS2052D can withstand input voltages up to 6 V (absolute maximum), and output current is internally limited to protect against faults. The device ensures a low standby supply current, thereby supporting low-power system requirements. Key operational parameters include:
ON-resistance: 135 mΩ max at VI = 5 V, ensuring low loss under load
Maximum operating currents: 500 mA per channel
Rise time: typically 2.5 ms (with capacitive load, e.g., 0.1 μF), supporting controlled voltage ramp-up
ESD protection: 2 kV HBM, 0.2 kV machine model, augmenting reliability in industrial environments
You can reference voltage and current waveforms through Texas Instruments’ datasheet diagrams, offering clear guidance for timing and behavior under load switching, short-circuit, and ramped load conditions.
The TPS2052D incorporates a suite of protection features to maintain safe operation and protect both the switch and the load. The overcurrent protection kicks in when output current exceeds the preset threshold or during a short-circuit event. It limits the output to a constant-current mode, and the OCx pin signals system-level controllers that a fault has occurred.
If overload conditions persist, the thermal protection circuit independently monitors each channel. Should junction temperature reach approximately 140°C, the affected switch turns off, isolating the faulted channel while the adjacent switch continues operation. Complete device shutdown occurs above 160°C, after which automatic recovery happens as the device cools. Hysteresis in the thermal trip circuit prevents rapid cycling in fluctuating temperature conditions.
The undervoltage lockout function provides guaranteed off-state behavior below 2 V supply input, as well as controlled restart for hot-insertion scenarios, ensuring no unexpected high inrush current or switch engagement prior to valid supply voltage.
TPS2052D is particularly well-suited for USB power switching roles. USB hosts, bus-powered hubs, and high-power peripheral designs mandate power-distribution switches with integrated current-limiting and fault reporting: requirements that TPS2052D fulfills. Its fast enable response, controlled rise/fall times, and ability to handle large downstream capacitive loads position it as a reliable choice for USB Rev 1.1/2.0 implementations.
In hot-plug applications, the TPS2052D's smooth ramp-up characteristics and undervoltage lockout avoid dangerous transients when plugging or removing modules. System designers can deploy TPS2052D between input power and subsystem circuits to guarantee soft starts and safe power sequencing—crucial in environments like backplane systems, communication hubs, or modular industrial controllers.
Optimal practical design with the TPS2052D calls for a local bypass capacitor (0.01–0.1 μF ceramic) from INx to GND, placed close to the IC, and optionally a large-value electrolytic output capacitor to mitigate transients during load switching. Output capacitive loads should be evaluated for inrush current peaks; TPS2052D’s gradual rise time helps reduce this, but further damping via RC filtering (e.g., 500 μs RC filter on OCx pins) can further reduce false fault reporting.
For thermal management, use the provided equations to assess dissipated power and junction temperature, accounting for ambient conditions, MOSFET on-resistance, and expected load currents. Given SOIC θJA of 172°C/W, ensure calculated junction temperatures remain within specification under all expected operational scenarios.
TPS2052D is available in surface-mount SOIC and through-hole PDIP configurations, with thermal, ESD, and environmental ratings supporting rugged deployments. These packages are compliant with key environmental standards (RoHS, “Green”), and rated for operation from –40°C to 85°C ambient, with a junction temperature ceiling at 125°C during use. Packing options (tape, reel, tube) are industry-standard, and full reliability and compliance documentation are provided through Texas Instruments’ resources.
For system designers considering alternatives or replacements for the TPS2052D, Texas Instruments’ own TPS2042 is a closely related model, featuring similar dual-channel MOSFET power-distribution switching. Depending on control logic requirements and package preferences, other equivalents in the family may also suit, such as single-channel versions (TPS2041 series) for more granular distribution. Cross-vendor options may include competitive dual power switches with similar current ratings and protection features, though specific behavioral characteristics and interface logic should always be evaluated for compatibility in the intended application.
: Selecting TPS2052D for reliable power control solutions
Texas Instruments' TPS2052D dual power-distribution switch delivers an integrated approach to efficient, protected power delivery in modern digital systems. Its combination of robust MOSFET performance, detailed fault protection, and versatile control interfaces equip engineers and procurement professionals with a device that meets stringent requirements for USB, hot-plug, and general power-management scenarios. By carefully considering application requirements, board layout, and system-level protection, the TPS2052D can serve as a foundation for reliable, scalable power switching in products spanning consumer, industrial, and communications markets.
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