Texas Instruments TPS61282DYFFR

Mfr. Part

TPS61282DYFFR

Manufacturer

Texas Instruments (Luminary Micro/TI). Y-IC is a quality distributor for Texas Instruments. We provide genuine products, professional support, and the best service experience.

Detailed Description

Synchronous step-up (boost) DC-DC switching regulator with programmable output, 4 A switch current capability, 2.3 MHz switching frequency, and a tiny 16-ball DSBGA package (1.67 mm × 1.67 mm). Designed for battery-powered systems that need a stable 3.15 V to 4.4 V rail from a 2.3 V to 4.85 V input. Industrial temperature range -40°C to +85°C.

Key Features

Function: Step-up (Boost) DC-DC converter

Output type: Programmable (3.15 V to 4.4 V)

Input voltage range: 2.3 V to 4.85 V (ideal for single Li-ion/Li-poly)

Switch current: 4 A (internal switch)

Switching frequency: 2.3 MHz for small inductors/capacitors

Rectification: Synchronous (high efficiency, no external Schottky needed)

Outputs: 1, positive output configuration

Package: 16-DSBGA, 1.67 mm × 1.67 mm footprint

Mounting: Surface-mount

Operating temperature: -40°C to +85°C (TA)

Compliance: RoHS3 compliant

Key Advantages

Very small solution size thanks to 2.3 MHz operation and 16-ball DSBGA

High efficiency from synchronous rectification reduces heat and extends battery life

Wide input range covers most single-cell battery discharge profiles

Programmable output allows one device to cover multiple rails (e.g., 3.3 V to 4.2 V)

4 A switch current supports high transient loads in compact systems

Simplified BOM; no external diode and fewer large passives

Packaging

Shipping format: Tape & Reel (TR) for automated assembly

Package/case: 16-DSBGA (also referenced as 16-UFBGA, DSBGA)

Body size: 1.67 mm × 1.67 mm nominal

Ball count and layout: 16-ball grid array (commonly 4 × 4). Confirm exact ball map in the datasheet.

Mounting: Surface-mount BGA; reflow soldering required

Materials/compliance: Lead-free SnAgCu solder balls, RoHS3 compliant

Pin configuration overview: Typical functions include VIN, SW, VOUT, FB, EN, GND and control pins. Refer to the official ball map for exact assignments.

Thermal characteristics: Industrial operating range -40°C to +85°C. Actual thermal performance depends on PCB copper area and layout; consult datasheet for thermal data and recommended layout.

Electrical properties summary: VIN 2.3–4.85 V; VOUT 3.15–4.4 V (programmable); fSW 2.3 MHz; synchronous rectifier; 4 A switch; single positive output

Lifecycle

Status: Active and widely used in portable designs (based on publicly available information as of the latest update). No indication it is nearing discontinuation.

Alternatives within TI family (verify electrical specs, features, and pinout):

- TPS61280A: Synchronous boost, high current capability for similar input ranges

- TPS61281A: Synchronous boost with comparable frequency and footprint options

- TPS61291: Compact boost for lower power rails (not pin-compatible, lower current)

- TPS61252 / TPS61090 series: Boost converters for similar voltage ranges (larger packages; not pin-compatible)

Pin-to-pin or drop-in compatibility is not guaranteed. Always check the datasheet, ball map, and design differences.

If you need functionally equivalent or second-source options, please contact Y-IC sales via our website for detailed cross-reference and availability guidance.

Key Application Areas

Single-cell Li-ion/Li-poly battery-powered systems needing a stable 3.15–4.4 V rail

Portable electronics: handheld terminals, wearables (that require 3.3–4.2 V rails)

Wireless modules, radios, and RF subsystems requiring a clean boosted supply

Imaging and camera modules, sensors, audio subsystems powered from battery

System rails in smartphones/tablets where small size and efficiency are critical

Backup/hold-up rails that need high transient capability in a tiny footprint

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for TPS61282DYFFR on our product page. We recommend downloading it here to get the official electrical characteristics, application notes, ball map, PCB layout guidelines, and thermal data.

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