Texas Instruments TMS32C6415DGLZ7E3

Mfr. Part

TMS32C6415DGLZ7E3

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

High-performance fixed‑point DSP from the TI TMS320C64x family

720 MHz core frequency, 1.03 MB on‑chip RAM, external non‑volatile memory

532‑ball FCBGA package, 23 mm x 23 mm body, surface‑mount

Interfaces: Host Interface, McBSP (multi‑channel buffered serial port), PCI, UTOPIA

I/O voltage 3.30 V, core voltage 1.40 V

Operating case temperature 0°C to 90°C

RoHS3 compliant

Series: TMS320C6414/15/16

Base family: TMS320 (C64x)

Available stock quantity: 2631

Suffix decoding (for easy selection): Z7 = 720 MHz speed grade, E3 = lead‑free/RoHS, DGL = 532‑ball FCBGA package

Key Features

Fixed‑point TI C64x DSP core at 720 MHz for heavy signal processing

1.03 MB on‑chip RAM for fast data and code access

External non‑volatile memory support for program storage

Rich connectivity: Host Interface, McBSP, PCI, UTOPIA

Wide ecosystem and toolchain support (TI Code Composer Studio, libraries, examples)

RoHS3 compliant, lead‑free finish

Surface‑mount BGA for compact, high‑pin‑count designs

Key Advantages

High compute density for telecom, audio, and industrial DSP tasks

Proven, stable architecture with long market history and wide deployments

Flexible interfaces simplify integration into legacy and modern systems

Scalable across the TMS320C6414/15/16 family for performance/cost tuning

Large on‑chip RAM reduces external memory bandwidth pressure

Mature software support reduces development time and risk

Packaging

Device package type: FCBGA (Flip‑Chip Ball Grid Array)

Ball count: 532

Body size: 23 mm x 23 mm

Mounting: Surface‑mount BGA

Supplier device package: 532‑FCBGA (23x23); compatible listings may also reference 532‑BFBGA/FCBGA

Shipping packaging: Tube

Materials and finish: Lead‑free (E3), RoHS3 compliant solder balls

Pin configuration: 532‑ball grid; detailed ball‑out and bank assignments in the datasheet

Thermal characteristics: Operates 0°C to 90°C (TC); use adequate heat spreading, low‑impedance ground planes, and airflow as needed

Electrical properties: I/O 3.30 V, core 1.40 V; decoupling and power sequencing per TI guidelines

Lifecycle

Status: Mature, widely used TI C64x DSP family. Lifecycle varies by speed grade and package. For the latest status and supply outlook, contact Y-IC.

Equivalent or alternative models (choose based on performance, peripherals, and software compatibility):

- TMS320C6414T: Same C64x family, lower performance/resource variant

- TMS320C6416T: Same family, higher performance/resource variant

- TMS320C6424: C64x+ DSP with enhanced peripherals, lower power

- TMS320C6455: High‑performance C64x+ with rich I/O (e.g., SRIO on certain variants)

- TMS320C6472: Multicore C64x+ (6 cores) for parallel workloads

- TMS320C6747/C6748: Floating‑/fixed‑point (C67x+) if algorithms need native floating point

- OMAP‑L137/OMAP‑L138: ARM + DSP SoCs if you need integrated ARM and broader peripherals

If you need pin‑compatible or software‑compatible replacements, or if none of these fit, please contact our sales team via the Y-IC website for tailored guidance.

Key Application Areas

Telecom and networking: baseband, channelization, VoIP, packet processing

Industrial automation and control: real‑time control loops, motor control, vibration analysis

Audio and speech: beamforming, noise reduction, codec processing

Imaging and video: filtering, compression, feature extraction

Security and surveillance: analytics, pattern recognition, signal classification

Test and measurement: waveform generation, filtering, spectrum analysis

Medical devices: signal conditioning and DSP analytics (subject to regulatory design practices)

Datasheet

Y-IC hosts the most authoritative datasheet for this model. Download the current datasheet directly from this page to get exact ball‑out, timing, power, and design guidelines.

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