Texas Instruments OMAPL138EZWTD4RW

Mfr. Part

OMAPL138EZWTD4RW

Manufacturer

Texas Instruments (formerly including Luminary Micro)

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Detailed Description

High-integration ARM9 + DSP microprocessor in a 361-ball BGA for embedded systems. Runs up to 456 MHz on the ARM926EJ-S core and includes a C674x DSP for real-time signal processing. Features rich connectivity such as 10/100 Ethernet, USB 1.1 and USB 2.0 with integrated PHYs, LCD controller, SATA 3 Gbps, and multiple serial interfaces. Industrial temperature capable. RoHS3 compliant. Ideal for space-constrained boards needing performance, signal processing, and many peripherals.

Key Features

ARM926EJ-S core up to 456 MHz

Integrated C674x DSP for signal processing and real-time tasks

1 core 32-bit ARM with DSP co-processor for heterogeneous workloads

SDRAM controller for external memory expansion

10/100 Ethernet MAC (1 port)

USB 1.1 + PHY (1 port) and USB 2.0 + PHY (1 port)

LCD display controller for simple GUIs

SATA 3 Gbps (1 port) for storage connectivity

Security: boot security and cryptographic features

System control and CP15 support

Additional interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART

I/O voltages: 1.8 V and 3.3 V

Surface mount BGA package for compact designs

RoHS3 compliant

Series: OMAP-L1x

Base product number: OMAPL138

Operating junction temperature: -40°C to +90°C

Key Advantages

Dual-core flexibility: ARM for control/UI and C674x DSP for compute-intensive signal processing

Fewer external chips: integrated PHYs for Ethernet and USB reduce BOM and simplify design

Broad peripheral set: easy to connect storage, displays, audio, sensors, and networking

Industrial temperature range for harsh environments

Security features help protect boot flow and application firmware

Mature TI ecosystem with tools, examples, and long-term availability

Proven architecture widely used in industrial, medical, and communications equipment

Packaging

Type: BGA, surface mount

Case options referenced: 361-NFBGA (16x16), also seen as 361-LFBGA in some listings

Supplier device package: 361-NFBGA (16x16)

Ball count and configuration: 361 balls in a fine-pitch array for compact PCB routing

Material: lead-free solder balls, RoHS3 compliant BGA substrate

Mounting: reflow soldering on standard multilayer PCBs

Thermal characteristics: junction temperature -40°C to +90°C; use solid ground/power planes and thermal vias under the package for heat spreading per TI guidelines

Electrical properties highlights: I/O at 1.8 V and 3.3 V; integrated high-speed interfaces (USB, SATA, Ethernet); SDRAM controller for memory expansion

Shipment packaging: Tray

Note: Follow TI’s package application notes for ball map, escape routing, and thermal design

Lifecycle

Current status: OMAP-L1x family remains widely used; availability varies by specific suffix. This OMAPL138EZWTD4RW is generally considered active for industrial customers.

Alternatives and close equivalents (verify features and package before substitution):

- OMAPL138AZWT and OMAPL138BZWT series variants (speed, temp grade, and package options vary)

- OMAP-L137 family (similar ARM9 + DSP concept with different peripheral mixes)

- TI Sitara AM1808, AM1806, AM1810 (ARM9-based, peripheral sets differ; no DSP on some models)

If you need a drop-in or fully equivalent replacement, or latest lifecycle updates, please contact our sales team via the Y-IC website. We will match the right part and ensure long-term supply.

Key Application Areas

Industrial control, PLCs, and factory automation

Human–machine interfaces (HMI) with LCD displays

Motor control and drives with real-time DSP processing

Audio and voice processing using McASP/McBSP

Medical devices and patient monitoring

Networking gateways, protocol converters, and edge devices

Data loggers and storage solutions leveraging SATA and SD/MMC

Test and measurement equipment

Printers, barcode scanners, and kiosks

Building automation and smart energy systems

Datasheet

Y-IC provides the most authoritative datasheet for this product on our website. Download it now on this page to get full electrical, mechanical, and design guidelines.

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