Texas Instruments OMAPL132EZWT2

Mfr. Part

OMAPL132EZWT2

Manufacturer

Texas Instruments (Luminary Micro/TI family)

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Detailed Description

OMAP-L132 32-bit ARM926EJ-S microprocessor with an integrated C674x DSP for signal processing. CPU runs at 200 MHz. Rich peripherals onboard: 10/100 Ethernet MAC, USB 2.0 with integrated PHY, SPI, I2C, UART, McASP, McBSP, AC97, MMC/SD/SDIO. Memory controller supports LPDDR and DDR2. No graphics engine. Package is 361-ball NFBGA (ZWT), about 16 x 16 mm. RoHS3 compliant. Surface-mount device. Junction temperature 0°C to 90°C. Series OMAP-L1x. Base product number OMAPL132

Key Features

ARM926EJ-S CPU core, 32-bit, 200 MHz

Integrated C674x DSP coprocessor for math-heavy and audio/voice workloads

10/100 Ethernet MAC (1 port)

USB 2.0 with on-chip PHY (1 port)

LPDDR and DDR2 memory controller

I/O voltages: 1.8 V and 3.3 V

Interfaces: I2C, I2S, SPI, UART, McASP, McBSP, AC97, MMC/SD/SDIO

System control features including CP15

Graphics acceleration: none

RoHS3 compliant

Supplier device package: 361-NFBGA (16x16)

Mounting type: Surface Mount

Main category: Integrated Circuits (ICs)

Small classification: Embedded Microprocessors

Key Advantages

One chip for control (ARM9) and signal processing (DSP) reduces BOM and board space

Efficient low-power processing with DSP acceleration for real-time tasks

Broad peripheral set minimizes external components

Proven TI platform with long-term support and mature toolchains

Flexible memory options (LPDDR/DDR2) to match cost and performance targets

Easy assembly via standard BGA reflow processes

Packaging

Type: 361-ball NFBGA (ZWT); often referenced as LFBGA in some documents

Shipping format: Tray

Material: Molded plastic BGA with lead-free SAC solder balls; halogen-free; RoHS3 compliant

Size: approximately 16 mm x 16 mm body; 361-ball array

Ball pitch: typically 0.8 mm (see datasheet for exact pitch and ball map)

Pin configuration: 361 balls with rails for core and I/O, DDR2/LPDDR interface, USB, Ethernet, audio serial ports, and system control signals

Thermal characteristics: junction temperature (TJ) 0°C to 90°C; follow TI layout and thermal guidance for proper heat dissipation

Electrical properties: I/O at 1.8 V and 3.3 V; CPU clock 200 MHz; Ethernet 10/100; USB 2.0; memory interface for LPDDR/DDR2; consult datasheet for supply rails, timings, and power numbers

Lifecycle

Status: Mature TI product family widely used in industrial designs; availability depends on specific suffix and ordering option, not generally near immediate discontinuation

Equivalent or alternative models (featureand family-near; verify pinout and compatibility):

- OMAP-L138: ARM926EJ-S + C674x DSP, higher performance and broader peripheral set

- OMAP-L137: similar architecture with DSP; check features and package options

- AM1808: Sitara ARM9 without DSP for control-centric designs

- AM1810: Sitara ARM9 variant with similar industrial interfaces

- TMS320C6748 / C6747: DSP-only alternatives when an ARM core is not required

Ball maps, voltages, and software support vary by device; for drop-in replacements or lifecycle confirmation, please contact our sales team via the Y-IC website and we will guide you to the best fit

Key Application Areas

Industrial control and automation (PLC, motor drives)

Audio and voice processing, telephony gateways, intercom systems

Medical and laboratory instruments

Test and measurement equipment

Building automation, HVAC, and security panels

HMI and operator panels

Printers, scanners, and imaging subsystems

Networking edge devices and protocol converters

Smart appliances and embedded consumer products

Data acquisition and logging systems

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for OMAPL132EZWT2. Download it on this page for full pin maps, electrical specs, design guidelines, and layout recommendations

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