Texas Instruments MSP430V294IZQER

Mfr. Part

MSP430V294IZQER

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

16-bit MSP430 microcontroller in a BGA package, supplied in Tape & Reel. Ultra-low-power MCU optimized for embedded control, sensing, and battery-operated designs. RoHS3 compliant. Base product family MSP430V294.

Key Features

16-bit MSP430 RISC CPU for efficient, low-power processing

Multiple low-power modes (typical MSP430 LPM0–LPM4) for long battery life

Fast wake-up from sleep for responsive systems

Flexible internal clocking (DCO/VLO-type options in MSP430 families)

Integrated timers (Timer_A/Timer_B family), watchdog, and real-time clock support

Mixed-signal peripherals common to MSP430 families (ADC, comparator)

Serial interfaces typically available in the family (UART, SPI, I2C)

Brown-out and reset circuitry for stable operation

Industrial temperature grade indicated by “I” in part number

Broad toolchain support (TI Code Composer Studio, IAR Embedded Workbench)

Note: Exact peripheral set and limits for MSP430V294IZQER are defined in the datasheet. Verify memory sizes, clock limits, and peripheral count against the current datasheet.

Key Advantages

Ultra-low power design extends battery life and reduces heat

Fast wake-up improves responsiveness in duty-cycled applications

High integration cuts BOM cost and saves PCB space

Compact BGA footprint suits dense, space-constrained designs

Mature ecosystem, tools, and documentation speed development

Industrial temp range supports harsh environments and long service life

Packaging

Shipping format: Tape & Reel (TR) for automated assembly

Package type: BGA (TI ZQE family code; “IZQER” indicates industrial grade, ZQE BGA, reel)

Material: Molded plastic encapsulation with lead-free solder balls; RoHS3 compliant

Size: Compact BGA body; fine-pitch ball grid (exact body dimensions and ball pitch per datasheet)

Pin configuration: Ball Grid Array; ball count and pin map are specified in the MSP430V294 datasheet

Thermal characteristics: Low power dissipation reduces thermal stress; detailed θJA/θJC values and thermal guidelines are in the datasheet

Electrical properties: Typical MSP430 supply range around 1.8–3.6 V, JEDEC-compliant reflow profile (J-STD-020), ESD ratings and I/O drive strengths per datasheet

Note: For precise mechanical drawings, land pattern, reflow profile, and pinout, use the datasheet on our website.

Lifecycle

Current status: Availability is limited (current stock shows quantity 0). Not flagged as nearing end-of-life in public summaries, but please confirm the latest status.

Equivalent or alternative models: Consider these MSP430 families depending on required peripherals, memory, and package

- MSP430F2xx series (e.g., MSP430F2274, MSP430F249)

- MSP430G2xx series (cost-optimized options, e.g., MSP430G2553)

- MSP430FR2xx/FR4xx (FRAM-based, e.g., MSP430FR2433, MSP430FR2355)

- MSP430FR5xx/FR6xx (higher performance FRAM, e.g., MSP430FR5969, MSP430FR6989)

- Package compatibility may differ (QFN, TQFP, BGA/QFN in select parts). Verify pinout, voltage, frequency, memory, and peripheral match against your design needs.

If you need an exact drop-in or a vetted substitute and do not see a direct match, please contact our sales team via the Y-IC website for one-on-one support.

Key Application Areas

Battery-powered sensors and IoT edge nodes

Wearables and portable medical devices

Smart metering and data loggers

Handheld instruments and human-machine interfaces

Industrial sensing and monitoring

Energy-harvesting and ultra-low-power systems

Compact consumer devices where small BGA footprint is critical

Datasheet

Y-IC hosts the most authoritative datasheet for MSP430V294IZQER. Download it directly from this page to get exact pin maps, electrical limits, mechanical drawings, and thermal data. Always design against the latest datasheet.

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