Texas Instruments MSP430F5636IZQWR

Mfr. Part

MSP430F5636IZQWR

Manufacturer

Luminary Micro/Texas Instruments (TI). Y-IC is a quality distributor of this brand, and we will provide you with the best products and services, including fast delivery, genuine parts, and professional technical support.

Detailed Description

16-bit MSP430 microcontroller with 128KB on-chip Flash and 18KB RAM, running up to 20MHz. Integrated USB, rich serial interfaces, 16-channel 12-bit ADC and dual 12-bit DAC, multiple low-power modes, and robust system protection features. Delivered in a compact 113-ball MicroStar Junior BGA (7x7) for space-constrained designs. RoHS3 compliant and rated for -40°C to +85°C operation.

Key Features

Core: MSP430 CPUXV2, 16-bit RISC, up to 20MHz

Program memory: 128KB Flash (128K x 8)

RAM: 18KB (18K x 8)

I/O: 74 configurable pins

Peripherals: Brown-out Detect/Reset, DMA, Power-On Reset (POR), PWM, Watchdog Timer (WDT)

Connectivity: IrDA, LINbus, SCI, SPI, UART/USART, USB (full-speed)

Data converters: 16-channel 12-bit ADC, 2-channel 12-bit DAC

Oscillator: Internal clock sources

Supply voltage: 1.8V to 3.6V

Operating temperature: -40°C to +85°C (TA)

Series: MSP430F5xx

Mounting: Surface mount

Compliance: RoHS3 compliant

Package: 113-ball MicroStar Junior BGA (7x7), also referenced as 113-VFBGA

Supplier device package: 113-BGA MicroStar Junior (7x7)

Key Advantages

Ultra-low power with flexible low-power modes to maximize battery life

Integrated USB simplifies PC/host connectivity without external USB controllers

Rich analog (12-bit ADC and DAC) reduces external components and improves signal chain integration

Multiple serial interfaces for easy connection to sensors, modules, and busses (UART/USART, SPI, LIN, IrDA, SCI)

High integration lowers BOM cost and board size

Compact 7x7mm BGA footprint for dense layouts and portable devices

Mature MSP430 ecosystem with tools, libraries, and community support

Wide supply range and industrial temperature rating for robust operation

RoHS3 compliance and lead-free construction meet modern environmental standards

Packaging

Shipment type: Tape & Reel (TR) for automated assembly

Package/case: 113-ball BGA, TI MicroStar Junior (7x7), also listed as 113-VFBGA

Size: Approx. 7mm x 7mm footprint; ultra-compact for space-limited designs

Material: Lead-free balls and RoHS3-compliant construction; organic substrate typical for BGA

Pin/ball configuration: 113 total balls with 74 user I/O; dedicated balls for power, ground, USB D+/D−, oscillator, analog inputs, reference, and control signals

Mounting: Surface mount (SMT), compatible with standard BGA reflow profiles

Thermal characteristics: Designed for low power dissipation; rated -40°C to +85°C ambient operation; use solid ground planes and thermal vias for best heat spreading

Electrical properties: 1.8V–3.6V supply; internal oscillator; 20MHz max core frequency; integrated ADC/DAC; ESD and reliability per TI MSP430 family standards

Lifecycle

Status: Active and widely deployed in MSP430F5xx solutions. Not nearing discontinuation based on current industry availability.

Same-family alternatives (feature and memory/package variations; verify pin compatibility):

- MSP430F5630 / F5632 / F5634 / F5638 (same MSP430F563x family with different Flash sizes and options; many share USB and similar peripherals)

Close alternatives from related families (similar CPU, USB, and analog; package options differ):

- MSP430F5529 (128KB Flash, USB, popular alternative in MSP430F552x family)

- MSP430F5510 / F5513 / F5522 / F5528 (USB-enabled MSP430F55xx variants with different memory and interfaces)

- MSP430F5438A (high-memory MSP430F54xx, similar CPU/peripherals, typically without USB)

If you need an exact pin-to-pin or function-equivalent replacement, please contact our sales team via the Y-IC website for a detailed cross-reference and the latest availability.

Key Application Areas

USB-connected instruments and data loggers

Wearables and portable medical devices

Industrial sensing, monitoring, and control nodes

Smart meters and energy monitoring

Home appliances and consumer electronics with serial connectivity

LIN bus nodes in automotive subsystems

IrDA remote and short-range communication devices

Low-power measurement, timing, and control systems

Datasheet

Y-IC hosts the most authoritative datasheet for MSP430F5636IZQWR on our product page. We recommend downloading the datasheet directly from this page to ensure you have the latest, verified specifications and design guidance.

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