Texas Instruments MSP430F5217IYFFT

Mfr. Part

MSP430F5217IYFFT

Manufacturer

Luminary Micro/Texas Instruments (TI). Y-IC is a quality, trusted distributor for TI and Luminary Micro products. We stand behind the brand and will provide you with the best products, fast support, and reliable service.

Detailed Description

Ultra-low-power 16-bit microcontroller from the MSP430F5xx series with MSP430 CPUXV2 core. Integrates 64KB Flash, 8KB RAM, rich peripherals (DMA, PWM, watchdog, brown-out reset, POR), and serial interfaces (I2C, SPI, UART/USART, IrDA). Runs up to 25 MHz. Packaged in a 64-ball DSBGA for compact, high-density designs. Operates from 1.8V to 3.6V over -40°C to +85°C. RoHS3 compliant. Supplied in Tape & Reel for automated SMT.

Key Features

Architecture: MSP430 CPUXV2, 16-bit core

Speed: Up to 25 MHz

Program memory: 64KB Flash (64K x 8)

RAM: 8KB (8K x 8)

I/O: 31 programmable GPIO

Interfaces: I2C, SPI, UART/USART, IrDA (via USCI modules)

Peripherals: DMA, PWM, watchdog timer (WDT), brown-out detect/reset, power-on reset (POR)

Oscillator: Internal clock source

Supply voltage: 1.8V to 3.6V

Operating temperature: -40°C to +85°C (TA)

Package: 64-DSBGA (also referenced as 64-UFBGA/DSBGA), Supplier Device Package 64-DSBGA

Series: MSP430F5xx

Compliance: RoHS3

Mounting: Surface-mount (SMT)

Base product number: MSP430F5217

Key Advantages

Very low power consumption with MSP430 low-power modes for long battery life

Fast wake-up and efficient DMA for responsive real-time tasks

Compact 64-ball DSBGA saves PCB area for space-constrained designs

Flexible communications (I2C/SPI/UART/IrDA) for easy system integration

Robust reliability with brown-out, POR, and watchdog protection

Mature MSP430 ecosystem, tools, and application notes reduce development time

Packaging

Type: 64-DSBGA (also listed as 64-UFBGA, DSBGA). Supplied as Tape & Reel (TR) for automated pick-and-place

Material: Organic BGA substrate with lead-free solder balls (RoHS3 compliant)

Size: Ultra-compact 64-ball footprint. Refer to TI’s package drawing for exact body dimensions and ball pitch

Pin configuration: 8x8 ball array (64 total); 31 available GPIO; dedicated balls for power, ground, and serial interfaces. See datasheet pin map for precise ball assignments

Thermal characteristics: Designed for low thermal dissipation due to ultra-low-power operation. Operates reliably from -40°C to +85°C (TA). Follow TI’s thermal layout guidelines; consult package thermal data in datasheet

Electrical properties: 1.8V–3.6V supply range, on-chip oscillators, DMA and PWM support, integrated reset circuitry, ESD-handling per TI specs. See electrical characteristics tables in datasheet for currents, timing, and logic levels

Lifecycle

Status: Generally active in the MSP430F5xx family. Not known to be near discontinuation at the time of writing. Always verify latest status

Pin-/software-compatible or close alternatives (verify pinout and memory before substituting):

- MSP430F5215, MSP430F5216, MSP430F5218, MSP430F5219 (same F521x family, varying memory/peripheral options)

- MSP430F5227, MSP430F5229 (higher memory/performance within MSP430F5xx)

- Other MSP430F5xx/YFF package members as listed in TI cross-reference

If you need exact drop-in or long-term supply planning, please contact our sales team via the Y-IC website for a tailored cross-list and lifecycle updates

Key Application Areas

Wearables and portable devices requiring ultra-low power and compact size

Battery-powered sensors, data loggers, and IoT endpoints

Industrial and building automation nodes with serial communications

Medical and consumer electronics that need reliable low-power control

Metering, handheld instruments, and smart accessories

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for this model. Visit our product page and download the current datasheet and package drawings directly to ensure you have the latest specifications.

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