Texas Instruments AM3358BZCE60

Mfr. Part

AM3358BZCE60

Manufacturer

Luminary Micro/Texas Instruments

Y-IC is a quality distributor of Luminary Micro/Texas Instruments. We deliver genuine parts, fast shipping, and expert service so you get the best products and support.

Detailed Description

AM3358BZCE60 is a Sitara ARM Cortex-A8 single-core microprocessor running at 600 MHz. It integrates graphics acceleration, LCD and touchscreen controllers, dual Gigabit Ethernet, dual USB 2.0 with PHY, a wide set of industrial interfaces, and flexible memory controllers for LPDDR, DDR2, DDR3, and DDR3L. It is RoHS3 compliant, surface-mount, and available in 298-ball NFBGA/LFBGA 13 x 13 mm packages. I/O voltages are 1.8 V and 3.3 V. Operating junction temperature is 0°C to 90°C. Base product number is AM3358. Series is Sitara. Current stock available: 2669 units. Standard shipment packaging: tray.

Key Features

ARM Cortex-A8, 32-bit, 1 core, 600 MHz

NEON SIMD multimedia co-processor

Dual Ethernet MAC 10/100/1000 Mbps (2 ports)

USB 2.0 with integrated PHY (2 ports)

Graphics acceleration plus LCD and touchscreen controllers

Memory controllers: LPDDR, DDR2, DDR3, DDR3L

Security blocks: cryptography engine and hardware random number generator

Interfaces: CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART

I/O voltage options: 1.8 V and 3.3 V

RoHS3 compliant, surface mount

Supplier device package: 298-NFBGA (13 x 13)

Key Advantages

Highly integrated processor reduces BOM and saves board space

Mature Sitara platform with strong ecosystem and long-term availability

Flexible memory support enables cost and power optimization

Dual Gigabit Ethernet enables redundancy and advanced networking

Built-in security features help protect data and communications

NEON SIMD boosts multimedia and UI performance without extra DSP

Broad OS support (Linux and popular RTOS) and extensive community resources

Packaging

Type: NFBGA/LFBGA, 298-ball grid array

Size: 13 x 13 mm body

Material: Lead-free, RoHS3-compliant plastic BGA construction

Pin configuration: 298-ball array. Refer to the datasheet ball map for exact assignments and pitch

Thermal characteristics: Junction temperature 0°C to 90°C. BGA package relies on PCB copper for heat spreading. Ensure good layout and airflow for thermal margin

Electrical properties: I/O rails at 1.8 V and 3.3 V; core frequency 600 MHz; RoHS3 compliant

Mounting: Surface mount (SMT)

Shipment packaging: Tray

Lifecycle

Status: Active and widely used in production. Not nearing discontinuation based on current industry availability

Pin-compatible and family alternatives (feature sets vary; choose per need):

- AM3352: Cost-optimized, no 3D graphics

- AM3354: Graphics-capable variant

- AM3356: Expanded peripherals in AM335x family

- AM3357: Adds PRU-ICSS for real-time control

- AM3358: Current device; available in different speed and package options

- AM3359: Industrial Ethernet (e.g., EtherCAT) via PRU-ICSS

Need different speed grade, package, or feature mix: contact Y-IC via our website. Our sales team will match drop-in or near-equivalent options to your design

Key Application Areas

Industrial HMI, operator panels, and PLC front-ends

IoT gateways and building automation controllers

Smart grid and energy metering front-ends

Medical devices and portable diagnostics with touch UI

POS terminals, kiosks, and retail automation

Motor control and robotics with real-time communication

Printers, scanners, and office equipment

Connected consumer and embedded multimedia devices

Datasheet

Y-IC hosts the most authoritative datasheet for AM3358BZCE60 on our product page. Download the datasheet here to get complete pin maps, electrical specs, timing, and design guidelines.

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