Texas Instruments AM3358BGCZA80EP

Mfr. Part

AM3358BGCZA80EP

Manufacturer

Luminary Micro Texas Instruments

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Detailed Description

Sitara ARM Cortex-A8 microprocessor running at 800 MHz in a non-fine pitch BGA package. Single-core 32-bit MPU with integrated graphics acceleration, dual Ethernet, dual USB 2.0 with PHY, wide memory support, display and touch controllers, and strong security. Suited for industrial control, HMI, gateways, and connected devices needing rich interfaces and long-term availability.

Key Features

Core processor ARM Cortex-A8 800 MHz

Single core 32-bit architecture with NEON SIMD

Ethernet 10/100/1000 Mbps 2 ports

USB 2.0 with integrated PHY 2 ports

RAM controllers for LPDDR, DDR2, DDR3, DDR3L

Graphics acceleration enabled

Display controller for LCD and touchscreen

Security features with cryptography and random number generator

Additional interfaces CAN, I2C, McASP, McSPI, MMC SD SDIO, UART

I O voltages 1.8 V and 3.3 V

Operating temperature range TJ -40 C to 105 C

RoHS3 compliant

Series Sitara

Base product number AM3358

Key Advantages

Strong performance per watt with 800 MHz ARM Cortex-A8 and NEON acceleration

Rich connectivity on-chip reduces external components and BOM cost

Dual Ethernet and dual USB simplify networking and peripheral expansion

Broad memory support lets you choose cost and performance with LPDDR DDR2 DDR3 DDR3L

Integrated graphics and display control enable smooth HMIs without external graphics chips

Built-in security features help protect firmware and data

Proven Sitara ecosystem with extensive software and tools reduces time to market

Industrial temperature range supports harsh environments

Packaging

Package type nFBGA ball grid array supplied in trays

Material lead-free RoHS3 compliant mold compound and BGA substrate

Package body size commonly used for AM3358 nFBGA is around 13 mm x 13 mm with 0.8 mm ball pitch and high ball count such as 324 balls in ZCZ options verify exact dimensions and ball map in the datasheet for AM3358BGCZA80EP

Pin configuration ball grid array consult the TI ball map for signal assignment and pin compatibility

Thermal characteristics junction temperature TJ -40 C to 105 C thermal resistance values depend on PCB design and airflow see datasheet for detailed theta values and derating

Electrical properties core and subsystem rails required include typical low voltage core rails and 1.8 V and 3.3 V I O rails DDR supply depends on memory type LPDDR DDR2 DDR3 DDR3L refer to TI power rail table for exact voltages and sequencing

Shipping form tray for secure handling and assembly

Lifecycle

Current status active and widely used in industrial and embedded markets

Not near discontinuation based on TI’s Sitara family roadmap always review the latest TI PCN notices

Pin compatible and feature compatible options within AM335x family often available verify by package code and ball map

- AM3358BZCZ80 800 MHz ZCZ nFBGA variant

- AM3358BZCZ100 1 GHz ZCZ nFBGA variant

- AM3357 AM3356 AM3354 AM3352 for reduced feature sets within AM335x family

- AM3359 for industrial Ethernet features often pin compatible in ZCZ family confirm details

Performance and feature upgrade paths

- AM437x family ARM Cortex-A9 up to 1 GHz with more peripherals

- AM625 family ARM Cortex-A53 for modern Linux platforms with long-term roadmap

If you need an exact drop-in equivalent for AM3358BGCZA80EP with the same package and ball map contact our sales team via the Y-IC website for confirmation and sourcing support

Key Application Areas

Industrial HMIs and operator panels with LCD and touch

Factory automation PLCs and motion control with real-time peripherals

Industrial and building gateways with dual Ethernet and security

Smart meters and energy management

Medical devices and diagnostics terminals

Retail POS and kiosks

Networked printers and scanners

IoT edge nodes running embedded Linux or RTOS

Audio systems using McASP and multimedia features

Datasheet

Y-IC provides the most authoritative and up-to-date datasheet for AM3358BGCZA80EP on our product page. We recommend downloading the datasheet here to get exact package drawings, ball maps, power rails, thermal data, and software support details.

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