Intel EP4CGX22CF19C7

Mfr. Part

EP4CGX22CF19C7

Manufacturer

Intel (Altera). Y-IC is a quality distributor of Intel products. We supply genuine parts with reliable lead time, technical support, and attentive service to help you succeed

Detailed Description

Cyclone IV GX FPGA in a 324-FBGA 19x19 mm package, commercial temperature grade. 21,280 logic elements, 1,330 LABs, 150 user I O, and 774,144 bits of embedded RAM. Core supply 1.16 V to 1.24 V. Surface-mount. RoHS non-compliant version for legacy or specialized builds. Part of Intel’s cost-effective, low-power FPGA line with embedded high speed transceiver capability depending on package

Key Features

Cyclone IV GX family for cost-sensitive designs with serial connectivity

21,280 logic elements and 1,330 LABs for moderate logic complexity

774,144 total RAM bits using embedded memory blocks for FIFOs, buffers, and small frame storage

Up to 150 user I O for broad interface coverage across multiple banks

Core voltage 1.16 V to 1.24 V typical 1.2 V operation

Commercial temperature range 0 to 85 C junction

324-FBGA package 19x19 mm for compact, robust board assembly

Rich I O standard support across banks such as 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V where supported by the bank

PLL based clock management for clock synthesis and jitter filtering

JTAG and standard configuration modes supported such as Active Serial and Passive Serial

Transceiver capable family enabling low gigabit serial links application and PCI Express Gen1 soft or hard IP options depending on device variant

Key Advantages

Strong price performance ratio for mid range logic and memory needs

Low core voltage helps reduce dynamic power

Mature toolchain and extensive IP ecosystem reduce design risk

Long deployment history and broad community support

Flexible I O and package option helps PCB fit and BOM optimization

Ideal bridge platform between legacy parallel interfaces and newer serial links

Packaging

Type 324-ball FBGA Fine pitch Ball Grid Array for surface mount reflow

Body size 19 mm x 19 mm package code F19 per Intel package drawings

Ball count and configuration 324 balls total with user I O balls, power and ground distribution, JTAG and configuration pins, and transceiver related pins when applicable consult pinout file for exact bank map

Ball pitch follow Intel package drawing for F19 324 FBGA refer to datasheet and package drawing for pitch and keepout

Materials organic laminate substrate with epoxy mold compound and solder balls

Ball alloy RoHS non-compliant variant typically Sn Pb high reliability composition for legacy assembly flows

Moisture sensitivity shipped dry packed with desiccant and HIC label MSL per Intel label and package spec follow JEDEC handling

Thermal characteristics commercial grade 0 C to 85 C junction use airflow heatsinking and copper planes as needed Intel package thermal data theta JA theta JC depends on board layer stack and airflow see datasheet

Electrical properties core supply VCC 1.16 V to 1.24 V nominal 1.2 V I O bank voltages per standard 1.2 V to 3.3 V where supported dedicated supplies for PLL and transceiver blocks if used absolute maximum ratings and decoupling guidance in datasheet

Shipping form tray packing for assembly lines

Lifecycle

Status mature production family widely fielded. Some package speed temperature options in the Cyclone IV portfolio have moved to limited availability over time. Always check latest Intel notices

Nearing discontinuation not broadly announced for the entire family at time of writing but specific options may be in last time buy stages depending on region and date

Direct family alternatives and variants within EP4CGX22 line alternative speed grades temperature grades and packages may be available for the same base product number EP4CGX22 consult us for EP4CGX22 options that match your pinout and performance

Same generation no transceiver alternative EP4CE22 Cyclone IV E for designs that do not require high speed serial lanes lower cost and similar logic and memory density note not pin compatible

Migration paths newer Intel families

- Cyclone 10 LP 10CL016 10CL025 density options lower power modern tool support not pin compatible

- Cyclone V GX 5CGX variants with more capable transceivers and hard IP blocks not pin compatible

Cross vendor substitutes when acceptable

- Lattice ECP5 25K class for SERDES capable mid density designs

- AMD Xilinx Artix 7 XC7A25T class for similar logic scale and SERDES capability

Important compatibility note pin to pin and power rail compatibility are rarely drop in across families or vendors. Always request our detailed cross reference and migration guidance

If you need a pin compatible equivalent or an officially recommended substitute contact Y-IC sales via our website. We will verify lifecycle and provide the best available options

Key Application Areas

Industrial control PLC and motion controllers with mixed legacy I O and serial links

Communications and networking low speed backplane links GbE MAC bridging SPI I2C UART aggregation and protocol bridging

Interface and connectivity PCI Express Gen1 endpoints where supported SATA like or CPRI like legacy links within device limits

Video and imaging basic pre processing scaling timing and simple overlay with external frame buffers

Test and measurement waveform generation capture small DSP pipelines filtering and decimation

Medical and instrumentation user interface control sensor fusion and connectivity gateways

Aerospace and defense non safety critical subsystems where COTS FPGAs are acceptable

Datasheet

Y-IC hosts the most authoritative and up to date datasheet and package pinout for EP4CGX22CF19C7 on our product page. Please download the datasheet on this page for exact electrical limits pin assignments timing models thermal data and layout guidelines

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Learn More talk to our FPGA specialists for pinout reviews power rail guidance and migration advice