Intel EP2AGX45DF25C6NGA

Mfr. Part

EP2AGX45DF25C6NGA

Manufacturer

Intel

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Detailed Description

Mid-range Intel Arria II GX FPGA for embedded and communications designs. 42,959 logic elements, 1,805 LABs/CLBs, and 3,517,440 total RAM bits. 252 user I/Os in a 572-ball flip‑chip BGA, 25 mm x 25 mm body. Core supply 0.87–0.93 V. Commercial junction temperature 0 to 85°C. Surface‑mount, tray packaging. Optimized for balanced performance, low core voltage, and high I/O flexibility with integrated high‑speed serial capabilities typical of the GX family. Supported by Intel Quartus II design tools and IP.

Key Features

Arria II GX series density point with 42,959 logic elements and 1,805 LABs/CLBs

3,517,440 total RAM bits for buffers, FIFOs, and on‑chip data storage

252 user I/O for broad interface coverage and parallel expansion

572‑ball FCBGA package, 25 x 25 mm body size, surface mount

Core voltage operation at 0.87–0.93 V for lower power

Commercial TJ 0–85°C

Rich I/O standard support typical of Arria II (e.g., LVCMOS, LVDS)

Integrated high‑speed serial capability associated with GX devices

Compatible with Intel Quartus II toolchain, IP cores, and reference designs

Key Advantages

Strong cost‑to‑performance ratio for mid‑range designs

Low core voltage helps reduce dynamic and static power

High I/O count in a compact 572‑ball footprint simplifies board routing for complex systems

Mature platform with stable tools and a wide ecosystem of IP, examples, and application notes

Scalable to higher/lower densities within the Arria II family for easy migration

Proven reliability in industrial, communications, and embedded markets

Packaging

Type: Flip‑Chip Ball Grid Array (FCBGA), Supplier Device Package 572‑FBGA, FC (25x25)

Material: Organic substrate with flip‑chip die attach; tin/lead‑free solder balls

Size: 25 mm x 25 mm body (family code 25x25)

Pin configuration: 572 balls total; 252 user I/O balls, remaining balls for transceivers, power, ground, clocks, configuration, and test

Thermal characteristics: Commercial junction temperature 0 to 85°C; flip‑chip construction improves thermal conduction; follow Intel thermal guidelines for heatsinking and airflow

Electrical properties: Core supply 0.87–0.93 V; banks support common single‑ended and differential standards typical of Arria II; observe bank‑level voltage rules and decoupling recommendations from the datasheet

Package / case variants observed: 572‑FBGA, FC (25x25) and 572‑BGA, FCBGA

Shipping: Tray

Lifecycle

Status: Arria II GX is a mature, legacy Intel family. Many variants are in limited production or have reached end‑of‑life in some regions. Availability can be constrained.

Recommended equivalents or alternatives:

- Same family, similar density or speed grade: EP2AGX45 family variants (e.g., industrial‑temperature options or different speed grades), higher densities EP2AGX65/EP2AGX95 where feasible

- Newer Intel families for migration: Arria V GX (mid‑range with transceivers), Arria 10 (higher performance and efficiency), Cyclone V/10 GX (cost‑optimized with transceivers), Agilex (latest‑generation for advanced requirements)

If a direct drop‑in equivalent is required or if your compliance and timing needs are strict, contact our sales team via the Y‑IC website. We will verify lifecycle, stocking options, and the closest pin‑compatible or design‑compatible alternatives.

Key Application Areas

Communications and networking: Ethernet aggregation, packet processing, bridging, backplane serial links

Industrial automation: motion control, protocol bridging, fieldbus and LVDS interfaces

Video and imaging: frame buffering, pixel processing pipelines, LVDS camera links, display interfacing

Test and measurement: high‑speed data capture, pattern generation, instrumentation front‑ends

Medical and scientific equipment: signal conditioning, image reconstruction pipelines, custom data paths

Storage and servers: RAID acceleration, PCIe endpoint implementation, high‑speed serial connectivity

Broadcast and pro A/V: SDI/ASI interfacing, video format conversion, audio/video timing

Aerospace and defense (non‑ruggedized): prototyping, lab systems, signal processing where commercial temp is acceptable

Datasheet

Y‑IC provides the most authoritative datasheet and documentation for this model on our website. For precise electrical, timing, mechanical drawings, ball maps, configuration methods, and thermal design guidance, download the datasheet from this page now.

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