Intel 10M25DCF256I6G

Mfr. Part

10M25DCF256I6G

Manufacturer

Intel. Y-IC is a quality, trusted distributor for Intel. We supply genuine Intel products and deliver the best service, logistics, and technical support to help you succeed.

Detailed Description

Intel MAX 10 FPGA, 25k logic elements, 178 I/O, industrial temperature, 256-ball FBGA package 17 x 17 mm, speed grade 6. On-chip non-volatile flash for instant-on configuration. 1.15 to 1.25 V core supply. 1,563 LABs/CLBs and 691,200 total embedded RAM bits. Surface-mount device. RoHS compliant. Available in tray packaging. Series MAX 10.

Key Features

25,000 logic elements for mid-range designs

1,563 LABs or CLBs for structured logic implementation

178 user I/O for broad interface flexibility

691,200 embedded RAM bits for buffering and data handling

On-chip flash configuration memory for instant-on operation and no external config device

Industrial temperature range minus 40 to 100 degrees Celsius junction

256-ball FBGA package, 17 x 17 mm, compact footprint

1.15 to 1.25 V core voltage for low power

MAX 10 family features such as PLLs, internal oscillator, and optional integrated ADC on selected devices

RoHS compliant and lead-free

Key Advantages

Instant-on with internal flash reduces BOM and speeds startup

Low power core voltage lowers thermal and power budgets

Industrial-grade reliability for harsh environments

High I/O count enables multiple interfaces and bridging

Compact 256-ball FBGA fits space-constrained boards

Mature, widely adopted MAX 10 platform with strong tool support

Simplified supply chain and faster time-to-market with Y-IC support

Packaging

Type Tray

Package style 256-ball FBGA, also referenced in some catalogs as 256-LBGA

Body size approximately 17 mm x 17 mm

Ball count 256, user I/O 178

Mounting Surface mount

Material Molded plastic body with laminate substrate typical of FBGA devices

Thermal characteristics Junction temperature minus 40 to 100 degrees Celsius

Electrical properties Core supply 1.15 to 1.25 V, series MAX 10 FPGA architecture

Lifecycle

Current status Active in Intel’s MAX 10 family based on publicly available information

Not nearing discontinuation to the best of current knowledge; roadmap changes are possible, check with us for updates

Equivalent or alternative models within MAX 10 depend on package, speed grade, and temperature grade

- Same-density MAX 10 25k LE devices are available in other packages and grades, for example options in 144-pin EQFP, 169-ball BGA, and different speed grades 6, 7, 8, and commercial or industrial temperature ranges

- Pin-compatible alternatives exist within the 256-ball package across different speed and temperature grades

Because exact replacement part numbers depend on your PCB footprint, timing, and I/O needs, contact Y-IC via our website and our team will provide a precise cross and the best-fit substitute

Key Application Areas

Industrial automation and control

Motor control and power conversion

Sensor aggregation and signal conditioning

Communication protocol bridging and interface expansion

Embedded control, HMI, and panel interfaces

Test and measurement equipment

Consumer and commercial electronics needing instant-on programmable logic

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for this exact model on our product page. Download it now to get complete electrical, timing, and configuration details.

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