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| Part Number: | MPC8306CVMAFDCA |
|---|---|
| Manufacturer/Brand: | NXP USA Inc. |
| Part of Description: | IC MPU MPC83XX 333MHZ 369BGA |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.9485 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - I/O | 1.8V, 3.3V |
| USB | USB 2.0 (1) |
| Supplier Device Package | 369-PBGA (19x19) |
| Speed | 333MHz |
| Series | MPC83xx |
| Security Features | - |
| SATA | - |
| RAM Controllers | DDR2 |
| Package / Case | 369-LFBGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 105°C (TA) |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Mounting Type | Surface Mount |
| Graphics Acceleration | No |
| Ethernet | 10/100Mbps (3) |
| Display & Interface Controllers | - |
| Core Processor | PowerPC e300c3 |
| Co-Processors/DSP | Communications; QUICC Engine |
| Base Product Number | MPC8306 |
| Additional Interfaces | CAN, DUART, I²C, MMC/SD, SPI, TDM |




NXP’s MPC8306CVMAFDCA is part of the PowerQUICC II Pro family, serving as a highly integrated, cost-effective communications processor. Built around the Power Architecture® e300c3 (MPC603e-based) core, this device delivers processing at 333 MHz within a compact 369-ball MAPBGA package (19x19 mm). It targets embedded networking, industrial control, residential gateways, and test and measurement applications, balancing CPU performance, versatile interfaces, board real estate efficiency, and low power operation. The MPC8306CVMAFDCA is designed to accelerate time-to-market for complex communication-enabled systems and is positioned for long-term product lifecycles.
At the heart of MPC8306CVMAFDCA is the e300c3 core, distinguished by its four-stage superscalar pipeline, dual integer units, floating-point capability, enhanced load/store mechanisms, and efficient interrupt latency. This 32-bit core features separate 16 KB instruction/data caches with locking capabilities, a dedicated performance monitor, and hardware debug enhancements. The architecture maintains software compatibility with Freescale/NXP Power Architecture processors, making it an ideal migration path or system upgrade.
The device is engineered for predictable processing and system control, integrating an on-chip memory management unit, dynamic power management, and multiple DMA channels. Key subsystems—including clock generation, programmable interrupt controller (IPIC), and power management controller—are all optimized for deterministic embedded performance.
The MPC8306CVMAFDCA stands out for its in-depth communications integration, centering on the QUICC Engine block with a 32-bit RISC controller, 48 KB instruction RAM, and 16 KB multiuser RAM. Five unified communication controllers (UCCs) support a spectrum of protocols: 10/100 Mbps MII/RMII Ethernet (with IEEE 1588 precision timing), HDLC/transparent, as well as TDM for voice or data. Support for up to 128 TDM channels enables scalable telephony or industrial applications. Ethernet MII/RMII interfaces operate at 3.3V signaling, compliant with IEEE 802.3 and IEEE 1588, and feature programmable PHY management via standard MDIO/MDC.
The embedded FlexCAN module facilitates robust CAN 2.0B bus connectivity with advanced message filtering and FIFO receive capability, making it suitable for industrial and automotive networking. The device’s USB Dual-Role Controller supports both USB 2.0 full and high-speed (host and device modes), further increasing system design flexibility.
A vital aspect for embedded system designers, the MPC8306CVMAFDCA features a 16-bit DDR2 SDRAM controller capable of supporting speeds up to 266 MHz data rates, with up to two chip-selects (256 MB per select) and flexible configuration for x8/x16 DRAM devices. Dynamic clocking, extensive page management, auto-refresh, and power conservation mechanisms enhance reliability and efficiency for demanding real-time applications.
The enhanced Local Bus Controller (eLBC) provides broad parallel expansion support, including boot from NOR/NAND flash, programmable bus width, up to eight chip-selects, and protocol engines tailored for various parallel memory devices. The device also supports advanced SD/SDIO/MMC memory/IO via the eSDHC, as well as dedicated Flash Control logic for NAND devices.
MPC8306CVMAFDCA offers rich peripheral integration: dual I²C controllers (multi-master, programmable boot sequencer), DUART (programmable, PC16550D-compatible for legacy serial support), a full-featured SPI master/slave interface, eight general-purpose timers including real-time clock, and extensive GPIO (56 channels) with edge/level detection and interrupt capacity. The device enables broad interoperability with standard industrial components and flexible system-level diagnostics.
IPIC supports up to six groups of prioritized interrupts, essential for responsive real-time multitasking. Enhanced serial DMA engines facilitate high-speed data movement across serial and parallel interfaces without core intervention, reducing latency and core overhead.
The device operates with a core voltage (VDD) of 1.0V (nominal), I/O supply options including 3.3V and 1.8V for different interfaces, and supports asynchronous or sequenced power-up schemes. Integrated dynamic power management, deep sleep/nap/doze states, per-module clock gating, and programmable PLLs allow fine-tuning of system power consumption—an important differentiation for low-power, always-on, or battery-backed applications.
Comprehensive AC/DC characteristics are specified for each interface, supporting high-speed signaling while maintaining robust noise immunity. Output driver strengths are optimized for minimal impedance mismatch, and input capacitance is minimized for high-frequency clocks. Guidance is provided for power supply filtering and decoupling best practices to ensure stability.
The chip’s 369-ball MAPBGA footprint (19x19 mm) combines space efficiency with robust thermal and electrical characteristics. Detailed guidance is provided for layout, recommended decoupling, soldering, and pinout assignment, aiding in optimized board design and minimizing electromagnetic interference.
Thermal management is supported by comprehensive data: junction-to-ambient and junction-to-board thermal resistance, guidelines for heat sink attachment, and calculation methods for effective device operation over a wide range of board and ambient conditions. The package supports robust temperature management for high-density or fanless systems.
Engineers considering the MPC8306CVMAFDCA should note its flexibility in configuring clock domains (core/system/QUICC Engine independent PLLs), support for multiple boot sources (NOR/NAND/MMC), and dynamic device initialization via configuration pins. System-level design should include careful filtering of PLL power supplies, low-inductance decoupling placement, and impedance matching for high-speed buses.
Its robust GPIO, industrial protocol support (FlexCAN, I²C, SPI), and flexible DMA make it a preferred choice for multi-protocol gateways, PLC controllers, and embedded Linux or RTOS platforms needing reliable real-time response and comprehensive connectivity. The device’s performance/cost profile is well-suited where communication throughput, legacy serial requirements, and embedded control are primary factors.
For existing designs, considering the MPC8306CVMAFDCA replacement may involve reviewing broader PowerQUICC II Pro series processors with compatible pinouts and enhanced features. Devices such as the MPC8308 and MPC8309 offer higher clock speeds or increased integrated peripherals while maintaining a similar system architecture. Depending on application-specific requirements (e.g., additional PCI, gigabit Ethernet, more DDR2 bandwidth), alternatives within the MPC83xx family may offer a direct migration path. It is recommended to cross-reference package, clock, and peripheral support, as well as confirm software compatibility, when evaluating functional replacements or migration strategies.
The NXP MPC8306CVMAFDCA provides an optimal combination of performance, integration, and flexibility for networked embedded system applications. Equipped with a powerful e300c3 core, advanced communications subsystems, versatile memory and peripheral interfaces, and a robust power and thermal design foundation, the device addresses key engineering priorities including design scalability, connectivity, real-time responsiveness, and low power operation. When selecting or migrating to the MPC8306CVMAFDCA, engineers benefit from a broad base of architectural continuity within the PowerQUICC II Pro family, enabling efficient design cycles and extended product lifespans.
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